Layer and HDI connectors

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H01L2224/73267

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/73267Layer and HDI connectors

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Method for laser drilling process for an integrated circuit package
- Patent number 12,368,053
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High bandwidth die to die interconnect with package area reduction
- Patent number 12,368,137
- Issue date Jul 22, 2025
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,362,309
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hui-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 12,362,178
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 12,362,308
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Hao Jung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass carrier for die-up fan-out packaging and methods for making t...
- Patent number 12,354,996
- Issue date Jul 8, 2025
- Corning Incorporated
- Jin Su Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,347,749
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and semiconductor device
- Patent number 12,347,814
- Issue date Jul 1, 2025
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with tilted interface between device die and encapsulating...
- Patent number 12,334,406
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Yen Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,334,424
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Ming Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated package including device dies connected via interconne...
- Patent number 12,334,464
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with discrete blocks
- Patent number 12,334,476
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Wen Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lthc as charging barrier in info package formation
- Patent number 12,334,489
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 12,327,819
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,322,705
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,324,268
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Dual-mode wireless charging device
- Patent number 12,322,696
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shih-Wei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die stack structure
- Patent number 12,322,728
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,322,691
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chuei-Tang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device reflective bank structure
- Patent number 12,322,738
- Issue date Jun 3, 2025
- Apple Inc.
- Kapil V. Sakariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,315,831
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnection using fanout interposer chiplet
- Patent number 12,283,549
- Issue date Apr 22, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component and method for producing a component
- Patent number 12,278,318
- Issue date Apr 15, 2025
- Osram Opto Semiconductors GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Info structure with copper pillar having reversed profile
- Patent number 12,261,074
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting diode display panel with micro lens array
- Patent number 12,261,162
- Issue date Mar 25, 2025
- Jade Bird Display (Shanghai) Limited
- Lei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor in InFO structure and formation method
- Patent number 12,260,669
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 12,255,184
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 12,255,153
- Issue date Mar 18, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
- Publication number 20250239555
- Publication date Jul 24, 2025
- ROHM CO., LTD.
- Kazunori FUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY
- Publication number 20250226370
- Publication date Jul 10, 2025
- Jade Bird Display (Shanghai) Limited
- Lei ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250226299
- Publication date Jul 10, 2025
- Samsung Electronics Co., Ltd.
- TAE OH HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Embedding a Component in a Printed Circuit Board
- Publication number 20250227850
- Publication date Jul 10, 2025
- AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Timo Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages And Methods Of Forming The Same
- Publication number 20250219024
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20250210569
- Publication date Jun 26, 2025
- Shinko Electric Industries Co., Ltd.
- Takumi Yumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE
- Publication number 20250201617
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsi-Kuei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20250192086
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20250183213
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Having a Main Die and a Dummy Die
- Publication number 20250183191
- Publication date Jun 5, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yan-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
- Publication number 20250157939
- Publication date May 15, 2025
- Apple Inc.
- Jun Zhai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Fan-Out Package Structur...
- Publication number 20250140730
- Publication date May 1, 2025
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250132278
- Publication date Apr 24, 2025
- Advanced Semiconductor Engineering, Inc.
- Chih-Jing HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250125206
- Publication date Apr 17, 2025
- Powertech Technology Inc.
- SHANG YU CHANG CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL
- Publication number 20250105133
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Jinyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250096203
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Kang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...
- Publication number 20250087623
- Publication date Mar 13, 2025
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250087635
- Publication date Mar 13, 2025
- Siliconware Precision Industries Co., Ltd.
- Shu-Chuan CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250087572
- Publication date Mar 13, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
- Publication number 20250077754
- Publication date Mar 6, 2025
- iCometrue Company Ltd.
- Mou-Shiung LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES
- Publication number 20250070056
- Publication date Feb 27, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS
- Publication number 20250054775
- Publication date Feb 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier and Method of Manufacturing the Same
- Publication number 20250054893
- Publication date Feb 13, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Artan BAFTIRI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-INTERCONNECT
- Publication number 20250015031
- Publication date Jan 9, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240413121
- Publication date Dec 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- CHIH-TING LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Package Structures Including Redistribution Layers
- Publication number 20240404992
- Publication date Dec 5, 2024
- Parabellum Strategic Opportunities Fund LLC
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240404972
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seyeong Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...
- Publication number 20240395782
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Wei Tu
- H01 - BASIC ELECTRIC ELEMENTS

Layer and HDI connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for laser drilling process for an integrated circuit package

High bandwidth die to die interconnect with package area reduction

Package structure

Method for fabricating a chip package

Electronic device

Glass carrier for die-up fan-out packaging and methods for making t...

Semiconductor packages

Semiconductor package and semiconductor device

Package with tilted interface between device die and encapsulating...

Package structure and manufacturing method thereof

Encapsulated package including device dies connected via interconne...

Semiconductor device with discrete blocks

Lthc as charging barrier in info package formation

Devices employing thermal and mechanical enhanced layers and method...

Chip package and manufacturing method thereof

Device and method for UBM/RDL routing

Image sensor device

Semiconductor device and method of forming microelectromechanical s...

Dual-mode wireless charging device

Method of manufacturing die stack structure

Package structure and method of manufacturing the same

Light emitting device reflective bank structure

Package structure and manufacturing method thereof

High density interconnection using fanout interposer chiplet

Component and method for producing a component

Info structure with copper pillar having reversed profile

Light-emitting diode display panel with micro lens array

Fingerprint sensor in InFO structure and formation method

Semiconductor packages and methods of forming the same

Wire bond wires for interference shielding

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

LIGHT-EMITTING DIODE DISPLAY PANEL WITH MICRO LENS ARRAY

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Method for Embedding a Component in a Printed Circuit Board

Semiconductor Packages And Methods Of Forming The Same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

INFO STRUCTURE WITH COPPER PILLAR HAVING REVERSED PROFILE

CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR STRUCTURE AND FORMING METHOD THEREOF

Fan-Out Package Having a Main Die and a Dummy Die

HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET

Semiconductor Device and Method of Forming Fan-Out Package Structur...

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

ELECTRONIC DEVICE

CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING INSULATING MATERIAL

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

PACKAGED SEMICONDUCTOR DEVICE HAVING IMPROVED RELIABILITY AND INSPE...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS

METAL-FREE FRAME DESIGN FOR SILICON BRIDGES FOR SEMICONDUCTOR PACKAGES

INFO PACKAGES INCLUDING THERMAL DISSIPATION BLOCKS

Component Carrier and Method of Manufacturing the Same

3D-INTERCONNECT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Multi-Die Package Structures Including Redistribution Layers

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

INTERCONNECT STRUCTURES, PACKAGED SEMICONDUCTOR DEVICES, AND METHOD...