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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/73267
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last 30 patents
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Patent Grant
Encapsulated package including device dies connected via interconne...
Patent number
11,978,714
Issue date
May 7, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Kuo-Chiang Ting
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked via structure
Patent number
11,973,023
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical connection structure and electronic device comprising th...
Patent number
11,974,479
Issue date
Apr 30, 2024
Innolux Corporation
Shun-Yuan Hu
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
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Patent Grant
Package structure with improved antenna patterns performance
Patent number
11,973,038
Issue date
Apr 30, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Fang-Yu Liang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for multi-color LED pixel unit with horizontal...
Patent number
11,967,589
Issue date
Apr 23, 2024
Jade Bird Display (Shanghai) Limited
Qunchao Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out package having a main die and a dummy die
Patent number
11,967,563
Issue date
Apr 23, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yan-Fu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,961,789
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,948,891
Issue date
Apr 2, 2024
NEPES CO., LTD.
Sang Yong Park
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structures and method of forming the same
Patent number
11,948,862
Issue date
Apr 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,942,435
Issue date
Mar 26, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Po-Han Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor device
Patent number
11,935,907
Issue date
Mar 19, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a redistribution layer
Patent number
11,935,856
Issue date
Mar 19, 2024
Amkor Technology Singapore Holding Pte Ltd.
Jong Sik Paek
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of forming thereof
Patent number
11,935,761
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming device and package structure
Patent number
11,929,322
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D-interconnect
Patent number
11,929,337
Issue date
Mar 12, 2024
Invensas LLC
Chok J. Chia
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Package structure including through via structures
Patent number
11,923,310
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chih-Kai Cheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
LTHC as charging barrier in info package formation
Patent number
11,923,353
Issue date
Mar 5, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yi-Jen Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting device reflective bank structure
Patent number
11,916,048
Issue date
Feb 27, 2024
Apple Inc.
Kapil V. Sakariya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for fabricating a chip package
Patent number
11,908,692
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and method of manufacturing the same
Patent number
11,908,787
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chuei-Tang Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring substrate, semiconductor package having the wiring substrate...
Patent number
11,908,783
Issue date
Feb 20, 2024
Amkor Technology Singapore Holding Pte Ltd.
Naoki Hayashi
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
3D IC decoupling capacitor structure and method for manufacturing t...
Patent number
11,908,788
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company Ltd.
Wen-Shiang Liao
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,908,795
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and production method thereof, and semiconduc...
Patent number
11,901,341
Issue date
Feb 13, 2024
Mitsubishi Electric Corporation
Yosuke Nakata
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Semiconductor package and method of manufacturing the semiconductor...
Patent number
11,901,348
Issue date
Feb 13, 2024
Samsung Electronics Co., Ltd.
Tae-Ho Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Iintegrated fan-out packages with embedded heat dissipation structure
Patent number
11,901,258
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Jan Pei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer system-level fan-out packaging structure and manufacturing me...
Patent number
11,894,243
Issue date
Feb 6, 2024
SJ Semiconductor (Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method of package structure
Patent number
11,895,780
Issue date
Feb 6, 2024
Unimicron Technology Corp.
Kai-Ming Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device with embedded die substrate on interposer
Patent number
11,894,311
Issue date
Feb 6, 2024
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
Publication number
20240153872
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING LEADFR...
Publication number
20240145429
Publication date
May 2, 2024
STMicroelectronics S.r.l.
Riccardo VILLA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP INTERCONNECTION PACKAGE STRUCTURE WITH HEAT DISSIPATION...
Publication number
20240136297
Publication date
Apr 25, 2024
Institute of Semiconductors, Guangdong Academy of Sciences
Yingqiang YAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOGIC DRIVE BASED ON STANDARD COMMODITY FPGA IC CHIPS
Publication number
20240135079
Publication date
Apr 25, 2024
iCometrue Company Ltd.
Mou-Shiung LIN
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20240128206
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Peng YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE RECONSTITUTION AND HIGH-DENSITY INTERCONNECTS FOR EMBEDDED CHIPS
Publication number
20240128222
Publication date
Apr 18, 2024
Neuralink Corp.
Supin Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240096760
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096837
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096811
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Chung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240088053
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
CHEN-HUA YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Publication number
20240088104
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240088085
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Shu Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240087954
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing company Ltd.
JING-CHENG LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
Publication number
20240079384
Publication date
Mar 7, 2024
Mitsubishi Electric Corporation
Yosuke NAKATA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240072019
Publication date
Feb 29, 2024
SILICONWARE PRECISION INDUSTRIES CO., LTD.
Chung-Yu Ke
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WORKPIECE CHUCK, WORKPIECE HANDLING APPARATUS, MANUFACTURING METHOD...
Publication number
20240063048
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Ching Lo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240063131
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Jaeean Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240055329
Publication date
Feb 15, 2024
ROHM CO., LTD.
Kentaro NASU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Publication number
20240047405
Publication date
Feb 8, 2024
ROHM CO., LTD.
Kazunori FUJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
Publication number
20240047376
Publication date
Feb 8, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Abiola Awujoola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED CHIP SCALE OPTICAL SENSOR PACKAGE
Publication number
20240030265
Publication date
Jan 25, 2024
Semiconductor Components Industries, LLC
Weng-Jin WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Info Packages Including Thermal Dissipation Blocks
Publication number
20240021441
Publication date
Jan 18, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Ching-Yi Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT PACKAGING DEVICE USING BRIDGE AND METHOD OF MANUFACTURING F...
Publication number
20240014111
Publication date
Jan 11, 2024
Byung Joon HAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240014151
Publication date
Jan 11, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Component Carrier With Electronic Components and Thermally Conducti...
Publication number
20240014142
Publication date
Jan 11, 2024
Mike Morianz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package and Method of Forming Thereof
Publication number
20230386866
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Jiun Yi Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dummy through vias for Integrated Circuit Packages and Methods of F...
Publication number
20230377905
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien-Li Kuo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of Forming Semiconductor Packages Having Through Package Vias
Publication number
20230378075
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SENSING DIE ENCAPSULATED BY AN ENCAPSULANT WITH A ROUGHNESS SURFACE...
Publication number
20230369158
Publication date
Nov 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yung-Chi Chu
H01 - BASIC ELECTRIC ELEMENTS