Lead (Pb) as principal constituent

Industry

CPC
H01L2224/45116

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/45116Lead (Pb) as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,660,532
- Issue date May 23, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Package systems including passive electrical components
- Patent number 9,530,761
- Issue date Dec 27, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan Roth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a multi-layer coating and method of forming the same
- Patent number 9,055,700
- Issue date Jun 9, 2015
- Semblant Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module system having encapsulated through wire interc...
- Patent number 9,018,751
- Issue date Apr 28, 2015
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Power/ground layout for chips
- Patent number 8,946,890
- Issue date Feb 3, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a through wire interconnect (TWI) on a semic...
- Patent number 8,741,667
- Issue date Jun 3, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Through wire interconnect (TWI) having bonded connection and encaps...
- Patent number 8,581,387
- Issue date Nov 12, 2013
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating stacked semiconductor system with encapsulat...
- Patent number 8,404,523
- Issue date Mar 26, 2013
- Micron Technoloy, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor module system having stacked components with encapsul...
- Patent number 8,217,510
- Issue date Jul 10, 2012
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
System with semiconductor components having encapsulated through wi...
- Patent number 8,120,167
- Issue date Feb 21, 2012
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for fabricating semiconductor component having encapsulated...
- Patent number 7,883,908
- Issue date Feb 8, 2011
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor device including an insulating film and insulating pi...
- Patent number 7,675,183
- Issue date Mar 9, 2010
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor components having encapsulated through wire interconn...
- Patent number 7,659,612
- Issue date Feb 9, 2010
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Staggered wirebonding configuration
- Patent number 7,411,287
- Issue date Aug 12, 2008
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resilient contact structures formed and then attached to a substrate
- Patent number 7,225,538
- Issue date Jun 5, 2007
- FormFactor, Inc.
- Benjamin Niles Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Contact structures and methods for making same
- Patent number 7,082,682
- Issue date Aug 1, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...
- Patent number 6,835,898
- Issue date Dec 28, 2004
- FormFactor, Inc.
- Benjamin N. Eldridge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,818,840
- Issue date Nov 16, 2004
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device with improved bonding
- Patent number 6,727,593
- Issue date Apr 27, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,538,214
- Issue date Mar 25, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assembly comprising a substrate and a plurality of sprin...
- Patent number 6,252,175
- Issue date Jun 26, 2001
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing raised electrical contact pattern of contr...
- Patent number 6,215,670
- Issue date Apr 10, 2001
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of mounting free-standing resilient electrical contact struc...
- Patent number 6,049,976
- Issue date Apr 18, 2000
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making raised contacts on electronic components
- Patent number 5,852,871
- Issue date Dec 29, 1998
- Form Factor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing electrical contacts, using a sacrificial me...
- Patent number 5,476,211
- Issue date Dec 19, 1995
- Form Factor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate for mounting a semiconductor element
- Patent number 5,362,926
- Issue date Nov 8, 1994
- Denki Kagaku Kogyo Kabushiki Kaisha
- Makoto Fukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and methods for making simultaneous electrical connections
- Patent number 5,193,732
- Issue date Mar 16, 1993
- International Business Machines Corporation
- Mario J. Interrante
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...
- Publication number 20240079305
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Bong Woo Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215791
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Jinmo Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20170063236
- Publication date Mar 2, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Alan ROTH
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS
- Publication number 20130058049
- Publication date Mar 7, 2013
- TAIWAN SEMICONDUCOTR MANUFACTURING COMPANY, LTD.
- Alan ROTH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...
- Publication number 20120288997
- Publication date Nov 15, 2012
- Micron Technology, Inc.
- DAVID R. HEMBREE
- G01 - MEASURING TESTING
Information Patent Application
POWER/GROUND LAYOUT FOR CHIPS
- Publication number 20120098127
- Publication date Apr 26, 2012
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Module System Having Stacked Components With Encapsul...
- Publication number 20120043670
- Publication date Feb 23, 2012
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Apparatus with a Multi-Layer Coating and Method of Forming the Same
- Publication number 20110253429
- Publication date Oct 20, 2011
- Semblant Global Limited
- Mark Robson Humphries
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System With Semiconductor Components Having Encapsulated Through Wi...
- Publication number 20110024745
- Publication date Feb 3, 2011
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Method For Fabricating Semiconductor Component Having Encapsulated...
- Publication number 20100047934
- Publication date Feb 25, 2010
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20080237863
- Publication date Oct 2, 2008
- Kabushiki Kaisha Tosiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor components and systems having encapsulated through wi...
- Publication number 20070246819
- Publication date Oct 25, 2007
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Contact Structures Comprising A Core Structure And An Overcoat
- Publication number 20060286828
- Publication date Dec 21, 2006
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20060113674
- Publication date Jun 1, 2006
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Staggered wirebonding configuration
- Publication number 20060097387
- Publication date May 11, 2006
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact structures and methods for making same
- Publication number 20050028363
- Publication date Feb 10, 2005
- FormFactor, Inc.
- Igor Y. Khandros
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20040159951
- Publication date Aug 19, 2004
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing raised electrical contact pattern of contr...
- Publication number 20030062398
- Publication date Apr 3, 2003
- FormFactor, Inc.
- Igor Y. Khandros
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor device and manufacturing method of semiconductor device
- Publication number 20020121703
- Publication date Sep 5, 2002
- KABUSHI KAISHA TOSHIBA
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resilient contact structures formed and then attached to a substrate
- Publication number 20020117330
- Publication date Aug 29, 2002
- FormFactor, Inc.
- Benjamin Niles Eldridge
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for manufacturing raised electrical contact patten of contro...
- Publication number 20020023773
- Publication date Feb 28, 2002
- FormFactor, Inc.
- Igor Yan Khandros
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electrical contact structures formed by configuring a flexible wire...
- Publication number 20010020546
- Publication date Sep 13, 2001
- FormFactor, Inc.
- Benjamin N. Eldridge
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Lead (Pb) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Printed adhesion deposition to mitigate integrated circuit package...

Printed adhesion deposition to mitigate integrated circuit delamina...

Package systems including passive electrical components

Package systems including passive electrical components

Apparatus with a multi-layer coating and method of forming the same

Semiconductor module system having encapsulated through wire interc...

Power/ground layout for chips

Method for fabricating a through wire interconnect (TWI) on a semic...

Through wire interconnect (TWI) having bonded connection and encaps...

Method for fabricating stacked semiconductor system with encapsulat...

Semiconductor module system having stacked components with encapsul...

System with semiconductor components having encapsulated through wi...

Method for fabricating semiconductor component having encapsulated...

Semiconductor device including an insulating film and insulating pi...

Semiconductor components having encapsulated through wire interconn...

Staggered wirebonding configuration

Resilient contact structures formed and then attached to a substrate

Contact structures and methods for making same

ELECTRICAL CONTACT STRUCTURES FORMED BY CONFIGURING A FLEXIBLE WIRE...

Method for manufacturing raised electrical contact pattern of contr...

Semiconductor device with improved bonding

Method for manufacturing raised electrical contact pattern of contr...

Electronic assembly comprising a substrate and a plurality of sprin...

Method for manufacturing raised electrical contact pattern of contr...

Method of mounting free-standing resilient electrical contact struc...

Method of making raised contacts on electronic components

Method of manufacturing electrical contacts, using a sacrificial me...

Circuit substrate for mounting a semiconductor element

Apparatus and methods for making simultaneous electrical connections

Patents Applicationslast 30 patents

EMBEDDED TRACE SUBSTRATE ASSEMBLIES, AND RELATED MICROELECTRONIC DE...

SEMICONDUCTOR PACKAGE

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

PACKAGE SYSTEMS INCLUDING PASSIVE ELECTRICAL COMPONENTS

METHOD FOR FABRICATING STACKED SEMICONDUCTOR SYSTEM WITH ENCAPSULAT...

POWER/GROUND LAYOUT FOR CHIPS

Semiconductor Module System Having Stacked Components With Encapsul...

Apparatus with a Multi-Layer Coating and Method of Forming the Same

System With Semiconductor Components Having Encapsulated Through Wi...

Method For Fabricating Semiconductor Component Having Encapsulated...

Semiconductor device and manufacturing method of semiconductor device

Semiconductor components and systems having encapsulated through wi...

Contact Structures Comprising A Core Structure And An Overcoat

Semiconductor device and manufacturing method of semiconductor device

Staggered wirebonding configuration

Contact structures and methods for making same

Semiconductor device and manufacturing method of semiconductor device

Method for manufacturing raised electrical contact pattern of contr...

Semiconductor device and manufacturing method of semiconductor device

Resilient contact structures formed and then attached to a substrate

Method for manufacturing raised electrical contact patten of contro...

Electrical contact structures formed by configuring a flexible wire...