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ELECTRICITY
H01
Electric elements
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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H01L2924/01082
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Patents Grants
last 30 patents
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Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with sealed semiconductor chip
Patent number
11,854,946
Issue date
Dec 26, 2023
Kioxia Corporation
Isao Ozawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material and method for die attachment
Patent number
11,842,974
Issue date
Dec 12, 2023
Alpha Assembly Solutions Inc.
Angelo Gulino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
Patent number
11,810,893
Issue date
Nov 7, 2023
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of room temperature covalent bonding
Patent number
11,760,059
Issue date
Sep 19, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Qin-Yi Tong
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor memory device structure
Patent number
11,742,307
Issue date
Aug 29, 2023
OVONYX MEMORY TECHNOLOGY, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded fan-out packaged semiconductor device and method of manufa...
Patent number
11,742,252
Issue date
Aug 29, 2023
Micron Technology, Inc.
Fumitomo Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic module and electronic module
Patent number
11,716,816
Issue date
Aug 1, 2023
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures and methods for low temperature bonding using nanoparticles
Patent number
11,710,718
Issue date
Jul 25, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for attachment and devices produced using the methods
Patent number
11,699,632
Issue date
Jul 11, 2023
Alpha Assembly Solutions Inc.
Monnir Boureghda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming interposer with opening...
Patent number
11,688,612
Issue date
Jun 27, 2023
STATS ChipPAC Pte. Ltd.
Reza A. Pagaila
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing a semiconductor device having a semiconduc...
Patent number
11,688,659
Issue date
Jun 27, 2023
Kioxia Corporation
Yoshiaki Goto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package
Patent number
11,676,931
Issue date
Jun 13, 2023
JMJ KOREA CO., LTD.
Yun Hwa Choi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor having double-sided substrate
Patent number
11,631,627
Issue date
Apr 18, 2023
JMJ KOREA CO., LTD.
Yun Hwa Choi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Superconducting bump bonds for quantum computing systems
Patent number
11,600,588
Issue date
Mar 7, 2023
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device and a method of manufacturing the same
Patent number
11,600,522
Issue date
Mar 7, 2023
Renesas Electronics Corporation
Katsuhiko Hotta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
Patent number
11,594,525
Issue date
Feb 28, 2023
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrasonic-assisted solder transfer
Patent number
11,541,472
Issue date
Jan 3, 2023
International Business Machines Corporation
Jae-Woong Nah
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Microelectronic devices with through-substrate interconnects and as...
Patent number
11,527,436
Issue date
Dec 13, 2022
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
11,515,272
Issue date
Nov 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
3D IC method and device
Patent number
11,515,202
Issue date
Nov 29, 2022
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Paul M. Enquist
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of making flip chip
Patent number
RE49286
Issue date
Nov 8, 2022
Research & Business Foundation SUNGKYUNKWAN UNIV
Seung Boo Jung
Information
Patent Grant
Systems and methods for optimizing looping parameters and looping t...
Patent number
11,495,570
Issue date
Nov 8, 2022
Kulicke and Soffa Industries, Inc.
Ivy Wei Qin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor chip with redundant thru-silicon-vias
Patent number
11,469,212
Issue date
Oct 11, 2022
Advanced Micro Devices, Inc.
Bryan Black
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Four D device process and structure
Patent number
11,458,717
Issue date
Oct 4, 2022
International Business Machines Corporation
Roy R. Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal paste for joints, assembly, production method for assembly, s...
Patent number
11,462,502
Issue date
Oct 4, 2022
SHOWA DENKO MATERIALS CO., LTD.
Yuki Kawana
B22 - CASTING POWDER METALLURGY
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Two-In-One Lead Frame Package
Publication number
20240071878
Publication date
Feb 29, 2024
Littelfuse Semiconductor (Wuxi) Co., Ltd
Lei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Publication number
20240065002
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230335531
Publication date
Oct 19, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
Publication number
20230207507
Publication date
Jun 29, 2023
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20230197690
Publication date
Jun 22, 2023
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20230187275
Publication date
Jun 15, 2023
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230132060
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230111343
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Choong Bin YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20230085696
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Publication number
20230031099
Publication date
Feb 2, 2023
ADVANCED MICRO DEVICES, INC.
BRYAN BLACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
Publication number
20230020310
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230005866
Publication date
Jan 5, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Producing Power Semiconductor Module and Power Semicondu...
Publication number
20220406679
Publication date
Dec 22, 2022
Huawei Digital Power Technologies Co., Ltd.
Ruoyang Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
Publication number
20220352053
Publication date
Nov 3, 2022
KIOXIA Corporation
Isao OZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
Publication number
20220336273
Publication date
Oct 20, 2022
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20220336305
Publication date
Oct 20, 2022
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MICROSTRUCTURE MODIFICATION OF CONDUCTING LINES
Publication number
20220293467
Publication date
Sep 15, 2022
YUAN ZE UNIVERSITY
Cheng EN HO
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20220285325
Publication date
Sep 8, 2022
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MEMORY DEVICE STRUCTURE
Publication number
20220157753
Publication date
May 19, 2022
Ovonyx Memory Technology, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20220148998
Publication date
May 12, 2022
JMJ KOREA CO., LTD.
Yun Hwa CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
Publication number
20220122938
Publication date
Apr 21, 2022
Micron Technology, Inc.
Young Do Kweon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
Publication number
20220084979
Publication date
Mar 17, 2022
Western Digital Technologies, Inc.
Kirubakaran Periyannan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPOSITION FOR CONDUCTIVE ADHESIVE, SEMICONDUCTOR PACKAGE COMPRISI...
Publication number
20220077099
Publication date
Mar 10, 2022
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
Gwang-Mun CHOI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
Publication number
20220059484
Publication date
Feb 24, 2022
Intel Corporation
Valery M. DUBIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
Publication number
20220044987
Publication date
Feb 10, 2022
Toshiba Memory Corporation
Isao OZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
Publication number
20220013460
Publication date
Jan 13, 2022
Micron Technology, Inc.
Suan Jeung Boon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SHIELDED FAN-OUT PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFA...
Publication number
20220013421
Publication date
Jan 13, 2022
Micron Technology, Inc.
Fumitomo Watanabe
H01 - BASIC ELECTRIC ELEMENTS