Leads, i.e. metallisations or lead-frames on insulating substrates

Industry

CPC
H01L23/498

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Ceramic laminated substrate, module, and method of manufacturing ce...
- Patent number 12,183,666
- Issue date Dec 31, 2024
- Murata Manufacturing Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method of manufacture
- Patent number 12,183,700
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device and tiled display including the same
- Patent number 12,183,768
- Issue date Dec 31, 2024
- Samsung Display Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit assemblies including metallic bars
- Patent number 12,185,454
- Issue date Dec 31, 2024
- Maxim Integrated Products, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,183,682
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging methods
- Patent number 12,183,684
- Issue date Dec 31, 2024
- Applied Materials, Inc.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 12,183,704
- Issue date Dec 31, 2024
- Nepes Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module, method for manufacturing same, and semiconduc...
- Patent number 12,183,713
- Issue date Dec 31, 2024
- ULTRAMEMORY, INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple pixel package structure with buried chip and electronic de...
- Patent number 12,183,724
- Issue date Dec 31, 2024
- Lite-On Opto Technology (Changzhou) Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic structure with metal traces
- Patent number 12,183,592
- Issue date Dec 31, 2024
- HRL Laboratories, LLC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,183,665
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for RF integrated circuit
- Patent number 12,183,676
- Issue date Dec 31, 2024
- MONDE WIRELESS INC.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,183,661
- Issue date Dec 31, 2024
- Dai Nippon Printing Co., Ltd.
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 12,183,664
- Issue date Dec 31, 2024
- Samsung Electronics Co., Ltd.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with power electronics carrier having trench...
- Patent number 12,183,667
- Issue date Dec 31, 2024
- Infineon Technologies AG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,176,256
- Issue date Dec 24, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Wang Gu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,176,323
- Issue date Dec 24, 2024
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array current meter with a current sense wire
- Patent number 12,174,240
- Issue date Dec 24, 2024
- International Business Machines Corporation
- Layne A. Berge
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for processing memory device
- Patent number 12,174,737
- Issue date Dec 24, 2024
- ESSENCORE LIMITED
- Chan Ho Sohn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor structure having an anti-arcing pattern disposed on a...
- Patent number 12,176,257
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-An Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect substrate and method of making interconnect substrate
- Patent number 12,176,280
- Issue date Dec 24, 2024
- Shinko Electric Industries Co., Ltd.
- Yuta Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,176,282
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Ming Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package and method of forming a die package
- Patent number 12,176,283
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Half-bridge module for an inverter of an electric drive of an elect...
- Patent number 12,176,316
- Issue date Dec 24, 2024
- ZF Friedrichshafen AG
- Manuel Raimann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and package structure
- Patent number 12,176,277
- Issue date Dec 24, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with uneven electrode surface and method for f...
- Patent number 12,176,281
- Issue date Dec 24, 2024
- NANYA TECHNOLOGY CORPORATION
- Tsu-Chieh Ai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Component carrier and method of manufacturing a component carrier
- Patent number 12,177,965
- Issue date Dec 24, 2024
- AT&SAustria Technologie & Systemtechnik Aktiengesellschaft
- Sebastian Sattler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inter-tier power delivery network (PDN) for dense gate-on-gate 3D l...
- Patent number 12,176,293
- Issue date Dec 24, 2024
- Tokyo Electron Limited
- Lars Liebmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with metal posts from structured leadframe
- Patent number 12,176,222
- Issue date Dec 24, 2024
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429206
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Yuichiro HINATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429207
- Publication date Dec 26, 2024
- InnoLux Corporation
- Jen-Hai CHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429110
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jangwoo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240429146
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Minwoo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429152
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Takashi KATSUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240429153
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Myungsam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
- Publication number 20240429180
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Mai SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE LINES HAVING MOLYBDENUM LINER AND TUNGSTEN FILL FOR ADVA...
- Publication number 20240429126
- Publication date Dec 26, 2024
- Intel Corporation
- Jeffrey S. LEIB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...
- Publication number 20240429140
- Publication date Dec 26, 2024
- ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...
- Publication number 20240429144
- Publication date Dec 26, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUILDING MULTI-DIE FPGAS USING CHIP-ON-WAFER TECHNOLOGY
- Publication number 20240429145
- Publication date Dec 26, 2024
- Xilinx, Inc.
- Praful JAIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS
- Publication number 20240429147
- Publication date Dec 26, 2024
- Fuji Electric Co., Ltd.
- Toshio DENTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240429151
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Heejin YUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20240429216
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429115
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429129
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Min-Feng KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING
- Publication number 20240429141
- Publication date Dec 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429142
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hung Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE STRUCTURE
- Publication number 20240429143
- Publication date Dec 26, 2024
- Delta Electronics, Inc.
- Jung-Li CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-VIA SUBSTRATE, MOUNTING SUBSTRATE, AND METHOD FOR MANUFACTU...
- Publication number 20240429149
- Publication date Dec 26, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240429176
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- JU-IL CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240429198
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240429213
- Publication date Dec 26, 2024
- Advanced Semiconductor Engineering, Inc.
- Syu-Tang LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE PAD DISCONNECTION FOR HIGH-SPEED MEMORY SYSTEM INTERFACES
- Publication number 20240428869
- Publication date Dec 26, 2024
- Micron Technology, Inc.
- Manuel Mencarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240429214
- Publication date Dec 26, 2024
- Samsung Electronics Co., Ltd.
- Ju-Il CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240429118
- Publication date Dec 26, 2024
- KIOXIA Corporation
- Keisuke TOKUBUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE INTERPOSER, A DEVICE IMPLEMENTING A THERMALLY...
- Publication number 20240429122
- Publication date Dec 26, 2024
- Kyle BOTHE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION
- Publication number 20240429123
- Publication date Dec 26, 2024
- WEI-LIN CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE ARRANGEMENT
- Publication number 20240429150
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Christian MÜLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240429154
- Publication date Dec 26, 2024
- ROHM CO., LTD.
- Tomoki FUJIMURA
- H01 - BASIC ELECTRIC ELEMENTS

Leads, i.e. metallisations or lead-frames on insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Ceramic laminated substrate, module, and method of manufacturing ce...

Semiconductor device package and method of manufacture

Display device and tiled display including the same

Circuit assemblies including metallic bars

Semiconductor package and manufacturing method thereof

Semiconductor device packaging methods

Semiconductor package and method for manufacturing the same

Semiconductor module, method for manufacturing same, and semiconduc...

Multiple pixel package structure with buried chip and electronic de...

Method of manufacturing a ceramic structure with metal traces

Semiconductor package

Semiconductor device for RF integrated circuit

Through electrode substrate and semiconductor device

Semiconductor package

Semiconductor package with power electronics carrier having trench...

Semiconductor devices and methods of manufacturing semiconductor de...

Microelectronic assemblies

Ball grid array current meter with a current sense wire

Method for processing memory device

Semiconductor structure having an anti-arcing pattern disposed on a...

Integrated cooling assembly including coolant channel on the backsi...

Interconnect substrate and method of making interconnect substrate

Manufacturing method of semiconductor package

Die package and method of forming a die package

Half-bridge module for an inverter of an electric drive of an elect...

Package substrate and package structure

Semiconductor device with uneven electrode surface and method for f...

Component carrier and method of manufacturing a component carrier

Inter-tier power delivery network (PDN) for dense gate-on-gate 3D l...

Semiconductor package with metal posts from structured leadframe

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

CONDUCTIVE LINES HAVING MOLYBDENUM LINER AND TUNGSTEN FILL FOR ADVA...

SEMICONDUCTOR PACKAGE HAVING MULTIPLE REDISTRIBUTION LAYERS AND MET...

SEMICONDUCTOR COMPONENT WITH DAMPED BONDING SURFACES IN A PACKAGE W...

BUILDING MULTI-DIE FPGAS USING CHIP-ON-WAFER TECHNOLOGY

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

EMBEDDED INDUCTOR MODULE AND PACKAGED SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE COMPRISING SIDEWALL INTERCONNECTS CONFIGURED FOR POWER ROUTING

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

POWER MODULE STRUCTURE

THROUGH-VIA SUBSTRATE, MOUNTING SUBSTRATE, AND METHOD FOR MANUFACTU...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE

PROBE PAD DISCONNECTION FOR HIGH-SPEED MEMORY SYSTEM INTERFACES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

THERMALLY CONDUCTIVE INTERPOSER, A DEVICE IMPLEMENTING A THERMALLY...

IC PACKAGE WITH VERY THIN VAPOR CHAMBER FOR HEAT DISSIPATION

SEMICONDUCTOR MODULE ARRANGEMENT

SEMICONDUCTOR DEVICE