Leads, i.e. metallisations or lead-frames on insulating substrates

Industry

CPC
H01L23/498

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method
- Patent number 12,148,684
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect bridge
- Patent number 12,148,704
- Issue date Nov 19, 2024
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall connections and button interconnects for molded SiPs
- Patent number 12,148,741
- Issue date Nov 19, 2024
- Apple Inc.
- Bilal Mohamed Ibrahim Kani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package device and manufacturing method thereof
- Patent number 12,148,686
- Issue date Nov 19, 2024
- Innolux Corporation
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split substrate interposer with integrated passive device
- Patent number 12,148,687
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Arya Bhattacherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and manufacturing method thereof
- Patent number 12,148,688
- Issue date Nov 19, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate structure, semiconductor structure and manu...
- Patent number 12,148,726
- Issue date Nov 19, 2024
- Dyi-Chung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method for manufacturing the same
- Patent number 12,148,681
- Issue date Nov 19, 2024
- JCET GROUP CO., LTD.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure
- Patent number 12,148,685
- Issue date Nov 19, 2024
- INNOLUX CORPORATION
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having interposer substrate, and st...
- Patent number 12,148,729
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Choongbin Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated magnetic assembly
- Patent number 12,148,556
- Issue date Nov 19, 2024
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gallium nitride (GAN) three-dimensional integrated circuit technology
- Patent number 12,148,747
- Issue date Nov 19, 2024
- Intel Corporation
- Han Wui Then
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming ultra high density embed...
- Patent number 12,148,677
- Issue date Nov 19, 2024
- JCET Semiconductor (Shaoxing) Co., Ltd.
- See Chian Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming semiconductor devices bonded by interposer stru...
- Patent number 12,148,705
- Issue date Nov 19, 2024
- Yangtze Memory Technologies Co., Ltd.
- Jun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate employing vertical conductor loops for coupling noise red...
- Patent number 12,142,555
- Issue date Nov 12, 2024
- QUALCOMM Incorporated
- Hong-Ming Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and manufacturing method thereof
- Patent number 12,142,554
- Issue date Nov 12, 2024
- INNOLUX CORPORATION
- Yeong-E Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for embedded integrated circuit devices
- Patent number 12,142,543
- Issue date Nov 12, 2024
- Intel Corporation
- Johanna Swan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising a capacitor
- Patent number 12,142,559
- Issue date Nov 12, 2024
- Fuji Electric Co., Ltd.
- Ryoichi Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 12,142,560
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Shi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit physical security device having a security cover...
- Patent number 12,142,580
- Issue date Nov 12, 2024
- NVIDIA Corporation
- Ryan Albright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guard ring design enabling in-line testing of silicon bridges for s...
- Patent number 12,142,553
- Issue date Nov 12, 2024
- Intel Corporation
- Arnab Sarkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray shielding structure for a chip
- Patent number 12,142,556
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including the same
- Patent number 12,142,573
- Issue date Nov 12, 2024
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having an annular frame with trunca...
- Patent number 12,142,598
- Issue date Nov 12, 2024
- Mediatek Inc.
- Chia-Cheng Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with TSV inductor
- Patent number 12,142,633
- Issue date Nov 12, 2024
- Mediatek Inc.
- Zheng Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,142,584
- Issue date Nov 12, 2024
- Advanced Semiconductor Engineering, Inc.
- Wen-Long Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240385370
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH NICKEL LAYER
- Publication number 20240387192
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Ching HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...
- Publication number 20240387317
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Chen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...
- Publication number 20240387324
- Publication date Nov 21, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURIN...
- Publication number 20240387329
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsin LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD
- Publication number 20240387339
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shu-Shen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through-Hole Structures for Improved Power Performance
- Publication number 20240387340
- Publication date Nov 21, 2024
- Intel Corporation
- Jaydeep Ramniklal PARMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240387344
- Publication date Nov 21, 2024
- Samsung Electro-Mechanics Co., Ltd.
- Chi Hyeon JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240387347
- Publication date Nov 21, 2024
- MEDIATEK INC.
- Tai-Hao PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH DUMMY VIAS
- Publication number 20240387349
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION SENSOR
- Publication number 20240387411
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsuan Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure with Bump
- Publication number 20240387431
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20240387440
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package with Die Stackup and Connection Platform
- Publication number 20240387461
- Publication date Nov 21, 2024
- Western Digital Technologies, Inc.
- Rajitha Indla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240387463
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Jeonggi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387474
- Publication date Nov 21, 2024
- DENSO CORPORATION
- TOSHIHIRO NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES
- Publication number 20240385400
- Publication date Nov 21, 2024
- MELLANOX TECHNOLOGIES, LTD.
- Amit Oren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20240387473
- Publication date Nov 21, 2024
- Fuji Electric Co., Ltd.
- Tomoya KISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387486
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Dahee Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF
- Publication number 20240387491
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH
- Publication number 20240387499
- Publication date Nov 21, 2024
- Micron Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240387194
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Chih Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...
- Publication number 20240387338
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES
- Publication number 20240387341
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240387342
- Publication date Nov 21, 2024
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fingerprint Sensor Device and Method
- Publication number 20240386744
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Chih Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240387309
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- JinHee JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...
- Publication number 20240387325
- Publication date Nov 21, 2024
- INFINEON TECHNOLOGIES AG
- Andreas Grassmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS

Leads, i.e. metallisations or lead-frames on insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package structure and method

Electrical interconnect bridge

Sidewall connections and button interconnects for molded SiPs

Package device and manufacturing method thereof

Split substrate interposer with integrated passive device

Semiconductor substrate and manufacturing method thereof

Semiconductor substrate structure, semiconductor structure and manu...

Fan-out package structure and method for manufacturing the same

Redistribution layer structure

Semiconductor device with interconnectors of different density

Semiconductor package structure having interposer substrate, and st...

Integrated magnetic assembly

Gallium nitride (GAN) three-dimensional integrated circuit technology

Semiconductor device and method of forming ultra high density embed...

Methods for forming semiconductor devices bonded by interposer stru...

Substrate employing vertical conductor loops for coupling noise red...

Electronic component and manufacturing method thereof

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Thermal management solutions for embedded integrated circuit devices

Semiconductor device comprising a capacitor

Semiconductor packages and methods of forming same

Integrated circuit physical security device having a security cover...

Power amplifier modules including semiconductor resistor and tantal...

Guard ring design enabling in-line testing of silicon bridges for s...

X-ray shielding structure for a chip

Interposer and semiconductor package including the same

Semiconductor package structure having an annular frame with trunca...

Semiconductor package with TSV inductor

Wiring structure and method of manufacturing the same, semiconducto...

Semiconductor device package

Patents Applicationslast 30 patents

PACKAGE AND METHOD OF FORMING SAME

CHIP PACKAGE STRUCTURE WITH NICKEL LAYER

SEMICONDUCTOR PACKAGES WITH THERMAL LID AND METHODS OF FORMING THE...

INTEGRATED COOLING ASSEMBLIES INCLUDING SIGNAL REDISTRIBUTION AND M...

PACKAGE STRUCTURE WITH OPTICAL ELEMENTS AND METHOD FOR MANUFACTURIN...

PACKAGE STRUCTURE AND METHOD

Through-Hole Structures for Improved Power Performance

CIRCUIT BOARD

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

SEMICONDUCTOR PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE WITH DUMMY VIAS

DELAMINATION SENSOR

Chip Package Structure with Bump

MANUFACTURING METHOD OF PACKAGE STRUCTURE

Semiconductor Device Package with Die Stackup and Connection Platform

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE

ELECTRONIC MODULES FOR CO-PACKAGED OPTICS AND COPPER PACKAGES

SEMICONDUCTOR MODULE

SEMICONDUCTOR PACKAGE

PHOTONIC PACKAGES WITH MODULES AND FORMATION METHOD THEREOF

FACE-TO-FACE SEMICONDUCTOR DEVICE WITH FAN-OUT PORCH

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHOD...

EMBEDDING BARRIER LAYER IN FINE-PITCH BOND STRUCTURES

SUBSTRATE WITH EMBEDDED ELEMENTS AND MANUFACTURING METHOD OF THE SAME

Fingerprint Sensor Device and Method

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

POWER ELECTRONIC SYSTEM INCLUDING A SEMICONDUCTOR MODULE AND A COOL...

Semiconductor Package and Method of Manufacturing the Same