Leads, i.e. metallisations or lead-frames on insulating substrates

Industry

CPC
H01L23/498

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Systems for semiconductor package mounting with improved co-planarity
- Patent number 12,327,782
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Architecture for computing system package
- Patent number 12,327,796
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including glass cores
- Patent number 12,327,797
- Issue date Jun 10, 2025
- Intel Corporation
- Srinivas V. Pietambaram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Logic drive based on chip scale package comprising standardized com...
- Patent number 12,327,816
- Issue date Jun 10, 2025
- iCometrue Company Ltd.
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming thereof
- Patent number 12,327,825
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low noise charge pumps
- Patent number 12,328,066
- Issue date Jun 10, 2025
- Skyworks Solutions, Inc.
- Lui Ray Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder pads with concave edges for ball grid arrays
- Patent number 12,328,826
- Issue date Jun 10, 2025
- MOTOROLA SOLUTIONS, INC.
- Edwin L Bradley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,812
- Issue date Jun 10, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer package substrate with improved current density distribu...
- Patent number 12,327,736
- Issue date Jun 10, 2025
- Texas Instruments Incorporated
- Yiqi Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with underfill containment barrier
- Patent number 12,327,773
- Issue date Jun 10, 2025
- Intel Corporation
- Rahul Jain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,327,781
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ting-Yu Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system integration
- Patent number 12,327,783
- Issue date Jun 10, 2025
- BroadPak Corporation
- Farhang Yazdani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ASIC package with photonics and vertical power delivery
- Patent number 12,327,817
- Issue date Jun 10, 2025
- Google LLC
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices employing thermal and mechanical enhanced layers and method...
- Patent number 12,327,819
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,327,827
- Issue date Jun 10, 2025
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid switch multi-chip power module for a vehicle battery
- Patent number 12,328,078
- Issue date Jun 10, 2025
- GM Global Technology Operations LLC
- Benjamin S. Ngu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die coupling using a substrate with a glass core
- Patent number 12,327,794
- Issue date Jun 10, 2025
- Intel Corporation
- Telesphor Kamgaing
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Robust mold integrated substrate
- Patent number 12,327,801
- Issue date Jun 10, 2025
- Intel Corporation
- Jimin Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including redistribution substrate
- Patent number 12,327,824
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,327,784
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Sangcheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) package with substrate having validation co...
- Patent number 12,322,685
- Issue date Jun 3, 2025
- Intel Corporation
- Luis Ricardo Perez-Corona
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer structure
- Patent number 12,322,686
- Issue date Jun 3, 2025
- Innolux Corporation
- Hung-Sheng Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure including auxiliary dielectric portion
- Patent number 12,322,688
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Han Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring base and electronic device
- Patent number 12,322,700
- Issue date Jun 3, 2025
- Kyocera Corporation
- Toshihiko Kitamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,322,702
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Dongkyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for UBM/RDL routing
- Patent number 12,322,727
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Tsan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,322,729
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company Ltd.
- Weiming Chris Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module semiconductor device and inverter equipment, and fabri...
- Patent number 12,322,683
- Issue date Jun 3, 2025
- Rohm Co., Ltd.
- Toshio Hanada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including through electrode, and semiconductor p...
- Patent number 12,322,681
- Issue date Jun 3, 2025
- SK hynix Inc.
- Seung Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for noise prevention and semiconductor package including...
- Patent number 12,322,687
- Issue date Jun 3, 2025
- Samsung Electronics Co., Ltd.
- Kiwon Baek
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250192027
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hsiang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE
- Publication number 20250192079
- Publication date Jun 12, 2025
- AUO Corporation
- Yi-Cheng Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...
- Publication number 20250192101
- Publication date Jun 12, 2025
- Intel Corporation
- Wei LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST KEY AND SEMICONDUCTOR DIE INCLUDING THE SAME
- Publication number 20250191981
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tse-Pan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER
- Publication number 20250192010
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Aniket PATIL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
- Publication number 20250192020
- Publication date Jun 12, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Youngwoong Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192021
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Junho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250194113
- Publication date Jun 12, 2025
- SK HYNIX INC.
- Seung Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATED CIRCUIT BOARD WITH INTEGRATED HEAT SINK, AND ELECTRONIC D...
- Publication number 20250193993
- Publication date Jun 12, 2025
- MITSUBISHI MATERIALS CORPORATION
- Toyo Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20250194011
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunhye Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250194230
- Publication date Jun 12, 2025
- UNITED MICROELECTRONICS CORP.
- Chung-Sung Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH CAVITY AND AN INTEGRATED DEVICE...
- Publication number 20250191989
- Publication date Jun 12, 2025
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING A SUBSTRATE WI...
- Publication number 20250192013
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Wooseok PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...
- Publication number 20250192017
- Publication date Jun 12, 2025
- Intel Corporation
- Dae-Woo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...
- Publication number 20250192018
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Byung Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20250192074
- Publication date Jun 12, 2025
- Siliconware Precision Industries Co., Ltd.
- Chung-Chih YEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...
- Publication number 20250192077
- Publication date Jun 12, 2025
- CIENA CORPORATION
- Joël Boyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D STACK PACKAGE STRUCTURE
- Publication number 20250192105
- Publication date Jun 12, 2025
- Powerchip Semiconductor Manufacturing Corporation
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...
- Publication number 20250193997
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Seokbeom Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192131
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- DOOHWAN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192071
- Publication date Jun 12, 2025
- Samsung Electronics Co.,Ltd.
- Chengjing ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250192108
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Haseob SEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND PACKGING METHOD
- Publication number 20250191936
- Publication date Jun 12, 2025
- Semiconductor Manufacturing International (Shanghai) Corporation
- Jisong JIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20250191983
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- IN-JAE LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192016
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR MANUFACTURING ELECTRONIC COMPONENTS
- Publication number 20250192022
- Publication date Jun 12, 2025
- STMicroelectronics International N.V.
- Gregoire DELACOURT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...
- Publication number 20250189889
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sih-Hao Liao
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PLANAR BALUN STRUCTURE
- Publication number 20250189623
- Publication date Jun 12, 2025
- NXP B.V.
- Sjoerd Bosma
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250192060
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD
- Publication number 20250192091
- Publication date Jun 12, 2025
- Institute of Semiconductors, Guangdong Academy of Sciences
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS

Leads, i.e. metallisations or lead-frames on insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems for semiconductor package mounting with improved co-planarity

Architecture for computing system package

Microelectronic structures including glass cores

Logic drive based on chip scale package comprising standardized com...

Package structure and method of forming thereof

Low noise charge pumps

Solder pads with concave edges for ball grid arrays

Semiconductor device and manufacturing method thereof

Multilayer package substrate with improved current density distribu...

Package with underfill containment barrier

Semiconductor structure and manufacturing method thereof

3D system integration

ASIC package with photonics and vertical power delivery

Devices employing thermal and mechanical enhanced layers and method...

Microelectronic assemblies

Hybrid switch multi-chip power module for a vehicle battery

Die coupling using a substrate with a glass core

Robust mold integrated substrate

Semiconductor package including redistribution substrate

Semiconductor package

Integrated circuit (IC) package with substrate having validation co...

Redistribution layer structure

Package structure including auxiliary dielectric portion

Wiring base and electronic device

Semiconductor package

Device and method for UBM/RDL routing

Semiconductor device

Power module semiconductor device and inverter equipment, and fabri...

Semiconductor chip including through electrode, and semiconductor p...

Substrate for noise prevention and semiconductor package including...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ANTENNA DEVICE

NO MOLD SHELF PACKAGE DESIGN AND PROCESS FLOW FOR ADVANCED PACKAGE...

TEST KEY AND SEMICONDUCTOR DIE INCLUDING THE SAME

INTERPOSER SUBSTRATE INCLUDING OFFSET CORE LAYER

CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

INSULATED CIRCUIT BOARD WITH INTEGRATED HEAT SINK, AND ELECTRONIC D...

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE HAVING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

PACKAGE COMPRISING A SUBSTRATE WITH CAVITY AND AN INTEGRATED DEVICE...

WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING A SUBSTRATE WI...

ALTERNATIVE SURFACES FOR CONDUCTIVE PAD LAYERS OF SILICON BRIDGES F...

SEMICONDUCTOR PACKAGE INCLUDING INTERPOSER AND METHOD FOR MANUFACTU...

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICA...

3D STACK PACKAGE STRUCTURE

MULTILAYER WIRING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

PACKAGE STRUCTURE AND PACKGING METHOD

ELECTRONIC COMPONENT PACKAGE

SEMICONDUCTOR PACKAGE

PROCESS FOR MANUFACTURING ELECTRONIC COMPONENTS

POLYMER MATERIAL IN A REDISTRIBUTION STRUCTURE OF A SEMICONDUCTOR P...

PLANAR BALUN STRUCTURE

SEMICONDUCTOR PACKAGE

FAN-OUT PACKAGE STRUCTURE AND FAN-OUT PACKAGE METHOD