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CPC
H01L2223/54486

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/54486Located on package parts

Industries

Patents Grantslast 30 patents

Information Patent Grant
Mounting device and mounting method
- Patent number 12,154,811
- Issue date Nov 26, 2024
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure and method of manufacturing the same, semiconducto...
- Patent number 12,144,120
- Issue date Nov 12, 2024
- Dai Nippon Printing Co., Ltd.
- Ryohei Kasai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 12,119,338
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded packaging for wide band gap semiconductor devices
- Patent number 12,087,677
- Issue date Sep 10, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil Quinones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including at least one die position checker
- Patent number 12,033,952
- Issue date Jul 9, 2024
- SK hynix Inc.
- Bok Gyu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
- Patent number 11,921,134
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having information code on a lateral side of display...
- Patent number 11,923,316
- Issue date Mar 5, 2024
- Samsung Display Co., Ltd.
- Sun Kwun Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a chip package
- Patent number 11,908,692
- Issue date Feb 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,894,336
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, electric device including the same
- Patent number 11,877,485
- Issue date Jan 16, 2024
- Samsung Display Co., Ltd.
- Chung-seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting device and mounting method
- Patent number 11,823,938
- Issue date Nov 21, 2023
- Toray Engineering Co., Ltd.
- Yasushi Tamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package semiconductor device and method of manufacture
- Patent number 11,817,360
- Issue date Nov 14, 2023
- Nexperia B.V.
- Loh Choong Keat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packages, packaging methods, and packaged semi...
- Patent number 11,817,445
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including at least one die position checker
- Patent number 11,764,160
- Issue date Sep 19, 2023
- SK hynix Inc.
- Bok Gyu Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alignment mark design for packages
- Patent number 11,742,298
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing the same
- Patent number 11,682,653
- Issue date Jun 20, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming Hung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flip chip curved sidewall self-alignment features for substrate and...
- Patent number 11,658,099
- Issue date May 23, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated fluxgate device shielded by discrete magne...
- Patent number 11,619,658
- Issue date Apr 4, 2023
- Texas Instruments Incorporated
- Dok Won Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems for direct transfer of semiconductor device die
- Patent number 11,562,990
- Issue date Jan 24, 2023
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct transfer of semiconductor devices from a substrate
- Patent number 11,515,293
- Issue date Nov 29, 2022
- Rohinni, LLC
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer resin and compression mold chip scale package
- Patent number 11,508,679
- Issue date Nov 22, 2022
- Semiconductor Components Industries, LLC
- Yusheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transfer of semiconductor devices onto glass substrates
- Patent number 11,488,940
- Issue date Nov 1, 2022
- Rohinni, Inc.
- Andrew Huska
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,482,498
- Issue date Oct 25, 2022
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic semiconductor component and method for producing an elec...
- Patent number 11,367,691
- Issue date Jun 21, 2022
- OSRAM OLED GmbH
- Matthias Kiessling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of surface-mounting components
- Patent number 11,342,489
- Issue date May 24, 2022
- DST Innovations Limited
- Anthony Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for bonding semiconductor elements
- Patent number 11,295,996
- Issue date Apr 5, 2022
- Kulicke and Soffa Industries, Inc.
- James E. Eder
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES
- Publication number 20240429136
- Publication date Dec 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Clemens Ypil QUINONES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCLOSURE
- Publication number 20240417244
- Publication date Dec 19, 2024
- SCHOTT AG
- Jens Ulrich Thomas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...
- Publication number 20240395792
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363545
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE
- Publication number 20240266240
- Publication date Aug 8, 2024
- Murata Manufacturing Co., Ltd.
- Akio KATSUBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240194612
- Publication date Jun 13, 2024
- SAMSUNG DISPLAY CO., LTD.
- Sun Kwun SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240186283
- Publication date Jun 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240021541
- Publication date Jan 18, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY
- Publication number 20240006373
- Publication date Jan 4, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YOU-WEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER
- Publication number 20230402396
- Publication date Dec 14, 2023
- SK HYNIX INC.
- Bok Gyu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20230395588
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20230369182
- Publication date Nov 16, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230361017
- Publication date Nov 9, 2023
- Samsung Electronics Co., Ltd.
- HYEONJEONG HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230335533
- Publication date Oct 19, 2023
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230085198
- Publication date Mar 16, 2023
- InnoLux Corporation
- Liang-Lu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230040553
- Publication date Feb 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230015101
- Publication date Jan 19, 2023
- RENESAS ELECTRONICS CORPORATION
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Packages, Packaging Methods, and Packaged Semi...
- Publication number 20220189942
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jie CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC COMPONENT, SYSTEM AND METHOD FOR PRODUCING SAME
- Publication number 20220181266
- Publication date Jun 9, 2022
- Osram Opto Semiconductors GmbH
- Michael BRANDL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE HYBRID ELECTRONICS MANUFACTURING METHOD
- Publication number 20220173066
- Publication date Jun 2, 2022
- Flex Ltd.
- Weifeng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...
- Publication number 20220122938
- Publication date Apr 21, 2022
- Micron Technology, Inc.
- Young Do Kweon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER
- Publication number 20220037265
- Publication date Feb 3, 2022
- SK HYNIX INC.
- Bok Gyu MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210398942
- Publication date Dec 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jhih-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME
- Publication number 20210265455
- Publication date Aug 26, 2021
- SAMSUNG DISPLAY CO., LTD.
- Chung-seok LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...
- Publication number 20210265247
- Publication date Aug 26, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTO...
- Publication number 20210183719
- Publication date Jun 17, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Kyoko NISHIDONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210175205
- Publication date Jun 10, 2021
- Advanced Semiconductor Engineering, Inc.
- Chih-Ming HUNG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING
- Publication number 20210118809
- Publication date Apr 22, 2021
- Intel Corporation
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210066213
- Publication date Mar 4, 2021
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE
- Publication number 20210028133
- Publication date Jan 28, 2021
- Semiconductor Components Industries, LLC
- Yusheng LIN
- H01 - BASIC ELECTRIC ELEMENTS

Located on package parts

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Mounting device and mounting method

Wiring structure and method of manufacturing the same, semiconducto...

Semiconductor device package and manufacturing method thereof

Semiconductor device packages, packaging methods, and packaged semi...

Molded packaging for wide band gap semiconductor devices

Semiconductor packages including at least one die position checker

Semiconductor integrated fluxgate device shielded by discrete magne...

Display device having information code on a lateral side of display...

Method for fabricating a chip package

Integrated fan-out package and manufacturing method thereof

Electronic component, electric device including the same

Mounting device and mounting method

Chip scale package semiconductor device and method of manufacture

Semiconductor device packages, packaging methods, and packaged semi...

Semiconductor device and method of manufacturing the same

Semiconductor packages including at least one die position checker

Alignment mark design for packages

Semiconductor device package and method for manufacturing the same

Flip chip curved sidewall self-alignment features for substrate and...

Semiconductor integrated fluxgate device shielded by discrete magne...

Systems for direct transfer of semiconductor device die

Direct transfer of semiconductor devices from a substrate

Chip assembly

Polymer resin and compression mold chip scale package

Method for transfer of semiconductor devices onto glass substrates

Semiconductor device and method of manufacturing the same

Semiconductor device package and manufacturing method thereof

Electronic semiconductor component and method for producing an elec...

Method of surface-mounting components

Systems and methods for bonding semiconductor elements

Patents Applicationslast 30 patents

MOLDED PACKAGING FOR WIDE BAND GAP SEMICONDUCTOR DEVICES

ENCLOSURE

SEMICONDUCTOR DEVICE PACKAGES, PACKAGING METHODS, AND PACKAGED SEMI...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

MODULE

DISPLAY DEVICE

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND METHOD FOR FABRICATING CHIP ASSEMBLY

SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MULTI-LAYERED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device Packages, Packaging Methods, and Packaged Semi...

OPTOELECTRONIC COMPONENT, SYSTEM AND METHOD FOR PRODUCING SAME

FLEXIBLE HYBRID ELECTRONICS MANUFACTURING METHOD

PACKAGED MICROELECTRONIC DEVICES HAVING STACKED INTERCONNECT ELEMEN...

SEMICONDUCTOR PACKAGES INCLUDING AT LEAST ONE DIE POSITION CHECKER

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT, ELECTRIC DEVICE INCLUDING THE SAME

FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLI...

SEMICONDUCTOR-CHIP-ENCAPSULATING RESIN COMPOSITION AND SEMICONDUCTO...

SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MICROELECTRONIC PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

POLYMER RESIN AND COMPRESSION MOLD CHIP SCALE PACKAGE