Manufacture and pre-treatment of the bump connector preform

Industry

CPC
H01L2224/111

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/111Manufacture and pre-treatment of the bump connector preform

Industries

Patents Grantslast 30 patents

Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 11,901,325
- Issue date Feb 13, 2024
- Dexerials Corporation
- Seiichiro Shinohara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 11,527,504
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shaped interconnect bumps in semiconductor devices
- Patent number 11,444,048
- Issue date Sep 13, 2022
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, method for producing the same, endosco...
- Patent number 11,444,049
- Issue date Sep 13, 2022
- Sony Corporation
- Osamu Maki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sintering materials and attachment methods using same
- Patent number 11,389,865
- Issue date Jul 19, 2022
- Alpha Assembly Solutions Inc.
- Shamik Ghoshal
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
System and method for extreme performance die attach
- Patent number 11,373,976
- Issue date Jun 28, 2022
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages for semiconductor devices, packaged semiconductor devices,...
- Patent number 11,329,022
- Issue date May 10, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Combination polyimide decal with a rigid mold
- Patent number 11,270,966
- Issue date Mar 8, 2022
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,183,399
- Issue date Nov 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes in semiconductor devices
- Patent number 11,152,322
- Issue date Oct 19, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having cutouts in an encapsulation material a...
- Patent number 11,145,563
- Issue date Oct 12, 2021
- Infineon Technologies AG
- Christian Geissler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive micro pin
- Patent number 11,101,232
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ying-Jui Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Cu pillar cylindrical preform for semiconductor connection
- Patent number 11,101,234
- Issue date Aug 24, 2021
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 11,101,235
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,101,140
- Issue date Aug 24, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Hsin Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 11,043,463
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded leadframes in semiconductor devices
- Patent number 10,957,666
- Issue date Mar 23, 2021
- Texas Instruments Incorporated
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump-forming film, semiconductor device and manufacturing method th...
- Patent number 10,943,879
- Issue date Mar 9, 2021
- Dexerials Corporation
- Yasushi Akutsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall and fine pitch interconnects
- Patent number 10,818,629
- Issue date Oct 27, 2020
- Invensas Corporation
- Cyprian Emeka Uzoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 10,811,378
- Issue date Oct 20, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive external connector structure and method of forming
- Patent number 10,741,513
- Issue date Aug 11, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Meng-Fu Shih
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Interconnect structures and methods of forming same
- Patent number 10,714,442
- Issue date Jul 14, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal cored solder decal structure and process
- Patent number 10,658,267
- Issue date May 19, 2020
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,622,403
- Issue date Apr 14, 2020
- Hamamatsu Photonics K.K.
- Noburo Hosokawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE AND METHOD OF MAKING
- Publication number 20240387500
- Publication date Nov 21, 2024
- Yibu Semiconductor Co., Ltd.
- Ming Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING COLUMN TYPE DEPOSITS
- Publication number 20240332233
- Publication date Oct 3, 2024
- PROTEC CO., LTD.
- Youn Sung Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMIC...
- Publication number 20240274564
- Publication date Aug 15, 2024
- POINT ENGINEERING CO., LTD.
- Bum Mo AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20240243088
- Publication date Jul 18, 2024
- Intel Corporation
- Brandon C. MARIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE
- Publication number 20240178208
- Publication date May 30, 2024
- TCL China Star Optoelectronics Technology Co., Ltd.
- Hongzhao DENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240105652
- Publication date Mar 28, 2024
- SK HYNIX INC.
- Dae Won KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTING PILLAR
- Publication number 20240096832
- Publication date Mar 21, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PILLAR FOR CONDUCTIVE CONNECTION
- Publication number 20240088079
- Publication date Mar 14, 2024
- DUKSAN HI-METAL CO., LTD.
- Eun Dong Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...
- Publication number 20240071873
- Publication date Feb 29, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Liqiang CAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTION DEVICE AND METHOD FOR MANUFACTURING PHOTODETECTION D...
- Publication number 20230044737
- Publication date Feb 9, 2023
- Sumitomo Electric Industries, Ltd.
- Ren Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES
- Publication number 20230012200
- Publication date Jan 12, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. Koduri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE
- Publication number 20220310518
- Publication date Sep 29, 2022
- Intel Corporation
- Haobo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20220262765
- Publication date Aug 18, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes in Semiconductor Devices
- Publication number 20220037277
- Publication date Feb 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20210313287
- Publication date Oct 7, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pre-Molded Leadframes in Semiconductor Devices
- Publication number 20210210453
- Publication date Jul 8, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method for Extreme Performance Die Attach
- Publication number 20210202433
- Publication date Jul 1, 2021
- Rockwell Collins, Inc.
- Nathan P. Lower
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD
- Publication number 20210151402
- Publication date May 20, 2021
- International Business Machines Corporation
- Jae-Woong Nah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPERLESS REGIONS TO CONTROL PLATING GROWTH
- Publication number 20210082852
- Publication date Mar 18, 2021
- Intel Corporation
- Bradon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20200343209
- Publication date Oct 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200303333
- Publication date Sep 24, 2020
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...
- Publication number 20200219836
- Publication date Jul 9, 2020
- SONY CORPORATION
- Osamu MAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect Structures and Methods of Forming Same
- Publication number 20190244920
- Publication date Aug 8, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages for Semiconductor Devices, Packaged Semiconductor Devices,...
- Publication number 20190157238
- Publication date May 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shaped Interconnect Bumps in Semiconductor Devices
- Publication number 20190109110
- Publication date Apr 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Sreenivasan K. KODURI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MICRO PIN
- Publication number 20190074259
- Publication date Mar 7, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ying-Jui HUANG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TALL AND FINE PITCH INTERCONNECTS
- Publication number 20190013287
- Publication date Jan 10, 2019
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180374812
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Manufacture and pre-treatment of the bump connector preform

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Solderless interconnection structure and method of forming same

Multilayer substrate

Conductive external connector structure and method of forming

Shaped interconnect bumps in semiconductor devices

Electronic component module, method for producing the same, endosco...

Sintering materials and attachment methods using same

System and method for extreme performance die attach

Packages for semiconductor devices, packaged semiconductor devices,...

Combination polyimide decal with a rigid mold

Semiconductor device and method of manufacture

Leadframes in semiconductor devices

Semiconductor devices having cutouts in an encapsulation material a...

Conductive micro pin

Cu pillar cylindrical preform for semiconductor connection

Fabrication method of semiconductor package with stacked semiconduc...

Semiconductor device and method of manufacture

Solderless interconnection structure and method of forming same

Interconnect structures and methods of forming same

Pre-molded leadframes in semiconductor devices

Bump-forming film, semiconductor device and manufacturing method th...

Method of forming solder bumps

Method of forming solder bumps

Tall and fine pitch interconnects

Electronic package and manufacturing method thereof

Method of forming solder bumps

Fabrication of solder balls with injection molded solder

Conductive external connector structure and method of forming

Interconnect structures and methods of forming same

Metal cored solder decal structure and process

Semiconductor device manufacturing method

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE AND METHOD OF MAKING

METHOD OF BONDING COLUMN TYPE DEPOSITS

MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMIC...

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

MANUFACTURING METHOD OF LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

CONNECTING PILLAR

METAL PILLAR FOR CONDUCTIVE CONNECTION

PACKAGE STRUCTURE FOR REDUCING WARPAGE OF PLASTIC PACKAGE WAFER AND...

PHOTODETECTION DEVICE AND METHOD FOR MANUFACTURING PHOTODETECTION D...

SHAPED INTERCONNECT BUMPS IN SEMICONDUCTOR DEVICES

EMBEDDED BRIDGE ARCHITECTURE WITH THINNED SURFACE

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Leadframes in Semiconductor Devices

Solderless Interconnection Structure and Method of Forming Same

Pre-Molded Leadframes in Semiconductor Devices

System and Method for Extreme Performance Die Attach

COMBINATION POLYIMIDE DECAL WITH A RIGID MOLD

COPPERLESS REGIONS TO CONTROL PLATING GROWTH

Interconnect Structures and Methods of Forming Same

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC COMPONENT MODULE, METHOD FOR PRODUCING THE SAME, ENDOSCO...

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

Solderless Interconnection Structure and Method of Forming Same

Interconnect Structures and Methods of Forming Same

Packages for Semiconductor Devices, Packaged Semiconductor Devices,...

Shaped Interconnect Bumps in Semiconductor Devices

CONDUCTIVE MICRO PIN

TALL AND FINE PITCH INTERCONNECTS

METHOD OF FORMING SOLDER BUMPS