Manufacturing methods of high density interconnect preforms

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H01L2224/19

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/19Manufacturing methods of high density interconnect preforms

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device structure and method therefor
- Patent number 12,322,719
- Issue date Jun 3, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly and manufacturing method thereof
- Patent number 12,324,100
- Issue date Jun 3, 2025
- Unimicron Technology Corp.
- Yu-Shen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor device
- Patent number 12,324,268
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,288,766
- Issue date Apr 29, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fingerprint sensor in InFO structure and formation method
- Patent number 12,260,669
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hua Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package structure comprising via structure and redist...
- Patent number 12,255,166
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods of manufacture
- Patent number 12,249,588
- Issue date Mar 11, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Chun Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with open cavity and method therefor
- Patent number 12,243,842
- Issue date Mar 4, 2025
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,243,843
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jiun Yi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded substrate and circuit module using th...
- Patent number 12,243,841
- Issue date Mar 4, 2025
- TDK Corporation
- Toshiyuki Abe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structure of stacked and bonded semiconductor device
- Patent number 12,237,291
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay module with thermal storage
- Patent number 12,237,243
- Issue date Feb 25, 2025
- GE Aviation Systems LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package structure with molding layer
- Patent number 12,218,104
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and manufacuring method thereof
- Patent number 12,205,934
- Issue date Jan 21, 2025
- Diodes Incorporated
- Shiau-Shi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
- Patent number 12,191,163
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double resist structure for electrodeposition bonding
- Patent number 12,183,708
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Koki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative photosensitive resin composition, production method for po...
- Patent number 12,174,539
- Issue date Dec 24, 2024
- Asahi Kasei Kabushiki Kaisha
- Takeki Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 12,170,261
- Issue date Dec 17, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method, semiconductor assembly and electron...
- Patent number 12,154,884
- Issue date Nov 26, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode constructions and methods for making the same
- Patent number 12,148,868
- Issue date Nov 19, 2024
- Bridgelux, Inc.
- Vladimir A. Odnoblyudov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabrication method thereof
- Patent number 12,136,581
- Issue date Nov 5, 2024
- Samsung Electronics Co., Ltd.
- Youngho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual sides of metal routing
- Patent number 12,113,025
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shin-Puu Jeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor packages having through package vias
- Patent number 12,107,051
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna in embedded wafer-level ball-grid array package
- Patent number 12,094,843
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Pandi Chelvam Marimuthu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out interconnect structure and methods forming the same
- Patent number 12,033,883
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure comprising thermally conductive layer around the...
- Patent number 12,033,963
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Hao Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,021,051
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuits on soft substrates
- Patent number 11,996,380
- Issue date May 28, 2024
- 3M Innovative Properties Company
- Ankit Mahajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct contact interconnect structure without capture pads a...
- Patent number 11,973,051
- Issue date Apr 30, 2024
- Deca Technologies USA, Inc.
- Robin Davis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic device and method for manufacturing the same
- Publication number 20250174592
- Publication date May 29, 2025
- InnoLux Corporation
- Ker-Yih KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING REDISTRIBUTION PAD AND METHOD OF MANUFACTURING SE...
- Publication number 20250167153
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Okseon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...
- Publication number 20250167157
- Publication date May 22, 2025
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Pablo RENAUD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...
- Publication number 20250167065
- Publication date May 22, 2025
- SK HYNIX INC.
- Jun Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20250167159
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION
- Publication number 20250157973
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Hsiang-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING INTEGRATED DEVICE PACKAGES
- Publication number 20250157830
- Publication date May 15, 2025
- ASMPT SINGAPORE PTE. LTD
- Chun Ho FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20250157974
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149491
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Zi-Jheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...
- Publication number 20250149524
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chun-Sheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...
- Publication number 20250140676
- Publication date May 1, 2025
- Samsung Electronics Co., Ltd.
- Jeongrim SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140729
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES
- Publication number 20250140757
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250132224
- Publication date Apr 24, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Jung Chul GONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250132214
- Publication date Apr 24, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING BODY
- Publication number 20250125306
- Publication date Apr 17, 2025
- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
- Shijie ZHONG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PACKAGE COMPONENT AND FORMING METHOD THEREOF
- Publication number 20250118695
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-WEI PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20250118718
- Publication date Apr 10, 2025
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND TECHNIQUE OF PHOTO-DEFINED SEMICONDUCTOR DEVICE WITH...
- Publication number 20250117561
- Publication date Apr 10, 2025
- Applied Materials, Inc.
- Benjamin D. Briggs
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY
- Publication number 20250112100
- Publication date Apr 3, 2025
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD
- Publication number 20250112111
- Publication date Apr 3, 2025
- Zhuhai ACCESS Semiconductor Co., Ltd
- XIANMING CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...
- Publication number 20250096008
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20250096060
- Publication date Mar 20, 2025
- MICROCHIP TECHNOLOGY INCORPORATED
- Mankit Lam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULES AND PANEL-LEVEL METHODS OF MAKING THE SAME
- Publication number 20250096182
- Publication date Mar 20, 2025
- PEP INNOVATION PTE LTD.
- Hwee Seng CHEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250096201
- Publication date Mar 20, 2025
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20250087572
- Publication date Mar 13, 2025
- AaltoSemi Inc.
- Yin-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...
- Publication number 20250079380
- Publication date Mar 6, 2025
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING
- Publication number 20250079381
- Publication date Mar 6, 2025
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250079382
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250079251
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung Chang
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods of high density interconnect preforms

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device structure and method therefor

Circuit board assembly and manufacturing method thereof

Image sensor device

Semiconductor device with open cavity and method therefor

Fingerprint sensor in InFO structure and formation method

Semiconductor package structure comprising via structure and redist...

Semiconductor device and methods of manufacture

Semiconductor device with open cavity and method therefor

Integrated circuit package and method of forming same

Electronic component embedded substrate and circuit module using th...

Dummy structure of stacked and bonded semiconductor device

Power overlay module with thermal storage

Package structure with warpage-control element

Method for forming chip package structure with molding layer

Electronic component package and manufacuring method thereof

Packaged semiconductor devices and methods of packaging semiconduct...

Double resist structure for electrodeposition bonding

Negative photosensitive resin composition, production method for po...

Molded direct contact interconnect structure without capture pads a...

Semiconductor packaging method, semiconductor assembly and electron...

Light emitting diode constructions and methods for making the same

Semiconductor package structure and fabrication method thereof

Semiconductor package with dual sides of metal routing

Method of forming semiconductor packages having through package vias

Antenna in embedded wafer-level ball-grid array package

Fan-out interconnect structure and methods forming the same

Package structure comprising thermally conductive layer around the...

Semiconductor package and method of forming the same

Flexible circuits on soft substrates

Molded direct contact interconnect structure without capture pads a...

Patents Applicationslast 30 patents

Electronic device and method for manufacturing the same

METHOD OF FORMING REDISTRIBUTION PAD AND METHOD OF MANUFACTURING SE...

MICROELECTRONIC DEVICE OBTAINED BY 3D INTEGRATION AND CORRESPONDING...

SEMICONDUCTOR PACKAGE INCLUDING HEAT DISSIPATION MEMBER, AND METHOD...

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

SYSTEMS AND METHODS FOR REDUCING SEMICONDUCTOR DEVICE DELAMINATION

METHOD FOR MANUFACTURING INTEGRATED DEVICE PACKAGES

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

PACKAGE STRUCTURE INCLUDING A REDISTRIBUTION LAYER (RDL) STRUCTURE...

WIRING STRUCTURE, METHOD OF MANUFACTURING THE WIRING STRUCTURE, AND...

MOLDED POWER PACKAGE WITH VERTICAL INTERCONNECT

CHIP PACKAGE STRUCTURE WITH MULTIPLE CHIP STRUCTURES

PRINTED CIRCUIT BOARD

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGING METHOD AND PACKAGING BODY

PACKAGE COMPONENT AND FORMING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

STRUCTURE AND TECHNIQUE OF PHOTO-DEFINED SEMICONDUCTOR DEVICE WITH...

DIE EMBEDDED IN GLASS LAYER WITH TWO-SIDE CONNECTIVITY

FAN-OUT PANEL LEVEL PACKAGING STRUCTURE AND MANUFACTURING METHOD

PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF PACKAGING SEMICONDUCT...

INTEGRATED CIRCUIT DEVICE

POWER MODULES AND PANEL-LEVEL METHODS OF MAKING THE SAME

SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND FABRICATING METHOD THEREOF

Semiconductor Device and Method of Making Face-Up Wafer-Level Packa...

DOUBLE-SIDED MULTICHIP PACKAGES WITH DIRECT DIE-TO-DIE COUPLING

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF