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Manufacturing methods of high density interconnect preforms
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SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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Manufacturing methods of high density interconnect preforms
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last 30 patents
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Patent Grant
Molded direct contact interconnect structure without capture pads a...
Patent number
11,973,051
Issue date
Apr 30, 2024
Deca Technologies USA, Inc.
Robin Davis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Image sensor device
Patent number
11,935,907
Issue date
Mar 19, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Rajesh Katkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Arrangement of power-grounds in package structures
Patent number
11,929,340
Issue date
Mar 12, 2024
Taiwan Semiconductor Manufacturing Co., Ltd
Ting-Yu Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structures and method of forming the same
Patent number
11,908,795
Issue date
Feb 20, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,901,320
Issue date
Feb 13, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,869,863
Issue date
Jan 9, 2024
Shinko Electric Industries Co., Ltd.
Takashi Ito
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metal oxide layered structure and methods of forming the same
Patent number
11,854,826
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Jing-Cheng Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semicondutor package substrate with die cavity and redistribution l...
Patent number
11,854,922
Issue date
Dec 26, 2023
Texas Instruments Incorporated
Vivek Swaminathan Sridharan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure and fabrication method thereof
Patent number
11,842,941
Issue date
Dec 12, 2023
Samsung Electronics Co., Ltd.
Youngho Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor devices with wireless charging means
Patent number
11,837,517
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming semiconductor packages having through package vias
Patent number
11,837,550
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die corner removal for underfill crack suppression in semiconductor...
Patent number
11,824,032
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Limited
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,817,399
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Zi-Jheng Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure comprising via structure and redist...
Patent number
11,817,413
Issue date
Nov 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Neng-Chieh Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device and manufacturing method thereof
Patent number
11,798,875
Issue date
Oct 24, 2023
Innolux Corporation
Chung-Chun Cheng
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Fingerprint sensor in info structure and formation method
Patent number
11,741,737
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Hua Chen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device package
Patent number
11,728,252
Issue date
Aug 15, 2023
Advanced Semiconductor Engineering, Inc.
Hui Hua Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package structure and method of forming same
Patent number
11,728,217
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package pad and methods of forming
Patent number
11,721,559
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure with warpage-control element
Patent number
11,721,659
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hao-Jan Pei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,682,629
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Kai-Chiang Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Discrete polymer in fan-out packages
Patent number
11,676,939
Issue date
Jun 13, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light-emitting dies incorporating wavelength-conversion materials a...
Patent number
11,677,047
Issue date
Jun 13, 2023
Epistar Corporation
Michael A. Tischler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System on integrated chips and methods of forming same
Patent number
11,658,150
Issue date
May 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Sung-Feng Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multilayer hybrid battery separators for lithium ion secondary batt...
Patent number
11,626,349
Issue date
Apr 11, 2023
Celgard, LLC
Lie Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and methods of manufacture
Patent number
11,605,607
Issue date
Mar 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Hung-Chun Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package structure
Patent number
11,532,498
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor devices and methods of packaging semiconduct...
Patent number
11,527,417
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Contact pad for semiconductor device
Patent number
11,527,502
Issue date
Dec 13, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chang-Chia Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layers in semiconductor packages and methods of form...
Patent number
11,508,695
Issue date
Nov 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240162101
Publication date
May 16, 2024
Siliconware Precision Industries Co., Ltd.
Yung-Ta LI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULE AND METHOD FOR MANUFACTURING SAME
Publication number
20240164119
Publication date
May 16, 2024
UltraMemory Inc.
Shigeru NAKAHARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE INCLUDING IC DIES ARRANGED IN INVERTED RELATIVE...
Publication number
20240153921
Publication date
May 9, 2024
MICROCHIP TECHNOLOGY INCORPORATED
Randy Yach
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME
Publication number
20240153872
Publication date
May 9, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED INTEGRATED CIRCUIT DIES AND INTERCONNECT STRUCTURES
Publication number
20240145515
Publication date
May 2, 2024
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Swarnal BORTHAKUR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
Publication number
20240145433
Publication date
May 2, 2024
Taiwan Semiconductor Manufacturiing Co., Ltd.
Po-Yao Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20240145256
Publication date
May 2, 2024
Resonac Corporation
Hiroaki MATSUBARA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE ASSEMBLY WITH EDGE...
Publication number
20240128208
Publication date
Apr 18, 2024
nD-HI Technologies Lab, Inc.
Ho-Ming TONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ASSEMBLY OF AN INTEGRATED CIRCUIT IN A CHIP SCALE BALL GRID ARRAY
Publication number
20240113062
Publication date
Apr 4, 2024
Azimuth Industrial Company, Inc.
David Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package and Method
Publication number
20240113071
Publication date
Apr 4, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE, METHOD OF FORMING A CHIP PACKAGE, AND CHIP SYSTEM
Publication number
20240105678
Publication date
Mar 28, 2024
INFINEON TECHNOLOGIES AG
Thorsten MEYER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
Publication number
20240097090
Publication date
Mar 21, 2024
CORETRONIC CORPORATION
Ming-Chuan Chih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH MIXED COPPER AND SOLDER INTERCONNEC...
Publication number
20240096809
Publication date
Mar 21, 2024
Intel Corporation
Hiroki Tanaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096811
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Chung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP HIGH-DENSITY INTERCONNECTION PACKAGE STRUCTURE AND MANUFACTURI...
Publication number
20240096836
Publication date
Mar 21, 2024
Zhuhai ACCESS Semiconductor Co., Ltd
Xianming CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH ANTENNA
Publication number
20240088083
Publication date
Mar 14, 2024
Fujitsu Limited
Junya IKEDA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, WIRING BOARD, AND SEMICO...
Publication number
20240088051
Publication date
Mar 14, 2024
Resonac Corporation
Kazuyuki MITSUKURA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Die Structures and Methods of Forming the Same
Publication number
20240079364
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER REWIRING DOUBLE VERIFICATION STRUCTURE, AND MANUFACTURING MET...
Publication number
20240079271
Publication date
Mar 7, 2024
CHIPMORE TECHNOLOGY CORPORATION LIMITED
Wenjie HUANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE COMPRISING A CHIPLET LOCATED BETWEEN AN INTEGRATED DEVICE A...
Publication number
20240072032
Publication date
Feb 29, 2024
QUALCOMM Incorporated
Yanmei SONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED FAN-OUT PLATFORM AND MANUFACTURING METHOD FOR SEMICONDUC...
Publication number
20240071998
Publication date
Feb 29, 2024
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
Publication number
20240063208
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Tsung-Yen Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Publication number
20240065002
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240063131
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Jaeean Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF
Publication number
20240064901
Publication date
Feb 22, 2024
Unimicron Technology Corp.
Yu-Shen Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
QUASI-MONOLITHIC DIE ARCHITECTURES
Publication number
20240063179
Publication date
Feb 22, 2024
Intel Corporation
Adel A. Elsherbini
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
Publication number
20240047403
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Neng-Chieh CHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20240047327
Publication date
Feb 8, 2024
Samsung Electronics Co., Ltd.
Gun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
Publication number
20240047446
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Mao-Yen Chang
H01 - BASIC ELECTRIC ELEMENTS