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H01L24/43

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/43Manufacturing methods

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package comprising conductive layer connected electrode...
- Patent number 12,368,081
- Issue date Jul 22, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, manufacturing method therefor, and circuit board assembly
- Patent number 12,308,252
- Issue date May 20, 2025
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Man-Zhi Peng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature-stable composite of a stranded wire having a contact pad
- Patent number 12,308,588
- Issue date May 20, 2025
- Yageo Nexensos GmbH
- Matthias Muziol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,300,663
- Issue date May 13, 2025
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including conductive element on side surface of s...
- Patent number 12,300,641
- Issue date May 13, 2025
- INNOLUX CORPORATION
- Shuhei Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,293,952
- Issue date May 6, 2025
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module with bond wire loop exposed from a molded body...
- Patent number 12,283,563
- Issue date Apr 22, 2025
- Infineon Technologies Austria AG
- Ivan Nikitin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
- Patent number 12,283,559
- Issue date Apr 22, 2025
- Texas Instruments Incorporated
- Lin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,261,146
- Issue date Mar 25, 2025
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor fuse with multi-bond wire
- Patent number 12,191,252
- Issue date Jan 7, 2025
- Texas Instruments Incorporated
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,166,006
- Issue date Dec 10, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electro-optical package and method of fabrication
- Patent number 12,165,944
- Issue date Dec 10, 2024
- Rockley Photonics Limited
- Shuhe Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement comprising a semiconductor element, a sub...
- Patent number 12,136,603
- Issue date Nov 5, 2024
- Siemens Aktiengesellschaft
- Bernd Kürten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 12,132,026
- Issue date Oct 29, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 12,107,082
- Issue date Oct 1, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising wire inside an electronic component
- Patent number 12,100,633
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Al bonding wire
- Patent number 12,090,578
- Issue date Sep 17, 2024
- Nippon Micrometal Corporation
- Takashi Yamada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Palladium-coated copper bonding wire and method for manufacturing same
- Patent number 12,087,724
- Issue date Sep 10, 2024
- Tanaka Denshi Kogyo K.K.
- Hiroyuki Amano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising multiple wires inside an electronic c...
- Patent number 12,068,211
- Issue date Aug 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming wire interconnect structures and related wire bo...
- Patent number 12,057,431
- Issue date Aug 6, 2024
- Kulicke and Soffa Industries, Inc.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond pad design for compact stacked-die package
- Patent number 12,051,660
- Issue date Jul 30, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic package comprising a wire within...
- Patent number 12,014,967
- Issue date Jun 18, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated copper bonding wire, manufacturing method of palla...
- Patent number 11,996,382
- Issue date May 28, 2024
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Offset interposers for large-bottom packages and large-die package-...
- Patent number 11,978,730
- Issue date May 7, 2024
- Intel Corporation
- Russell K. Mortensen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nonvolatile semiconductor memory device and fabrication method of t...
- Patent number 11,963,371
- Issue date Apr 16, 2024
- Kioxia Corporation
- Kotaro Noda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
- Patent number 11,955,457
- Issue date Apr 9, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding wire for semiconductor devices
- Patent number 11,929,343
- Issue date Mar 12, 2024
- Nippon Micrometal Corporation
- Daizo Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with isolated heat spreader
- Patent number 11,923,281
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain regions in integrated circuit structures
- Patent number 11,916,106
- Issue date Feb 27, 2024
- Intel Corporation
- Sean T. Ma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20250239567
- Publication date Jul 24, 2025
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PER...
- Publication number 20250226352
- Publication date Jul 10, 2025
- Lumentum Technology (UK) Limited
- Angelito Pizarro LAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250201673
- Publication date Jun 19, 2025
- RENESAS ELECTRONICS CORPORATION
- Kazuki MATSUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT
- Publication number 20250140734
- Publication date May 1, 2025
- Infineon Technologies Austria AG
- Lee Siang Tey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING DOUBLE ADHESIVE...
- Publication number 20250022830
- Publication date Jan 16, 2025
- SK HYNIX INC.
- Mina PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL-BOND ARRANGEMENT
- Publication number 20250015037
- Publication date Jan 9, 2025
- Heraeus Materials Singapore Pte. Ltd.
- Yee Weon LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...
- Publication number 20240421055
- Publication date Dec 19, 2024
- STMicroelectronics International N.V.
- Loic Pierre Louis RENARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS
- Publication number 20240404980
- Publication date Dec 5, 2024
- Western Digital Technologies, Inc.
- MUHAMAD RIDHWAN HAFIZ BIN ROSDI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379477
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...
- Publication number 20240363583
- Publication date Oct 31, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Basil Milton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...
- Publication number 20240339368
- Publication date Oct 10, 2024
- FUJIFILM CORPORATION
- Atsushi NAKAMURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240332242
- Publication date Oct 3, 2024
- Mitsubishi Electric Corporation
- Toma TAKAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240297142
- Publication date Sep 5, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290675
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290743
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240290745
- Publication date Aug 29, 2024
- NIPPON MICROMETAL CORPORATION
- Daizo ODA
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290674
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...
- Publication number 20240266312
- Publication date Aug 8, 2024
- SIEMENS AKTIENGESELLSCHAFT
- BERND KÜRTEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240266313
- Publication date Aug 8, 2024
- NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
- Tomohiro UNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...
- Publication number 20240250063
- Publication date Jul 25, 2024
- KULICKE AND SOFFA INDUSTRIES, INC.
- Hui Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240243039
- Publication date Jul 18, 2024
- Advanced Semiconductor Engineering, Inc.
- Ying-Chung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
- Publication number 20240222350
- Publication date Jul 4, 2024
- Intel Corporation
- Russell K. MORTENSEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...
- Publication number 20240222325
- Publication date Jul 4, 2024
- Micron Technology, Inc.
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES
- Publication number 20240162289
- Publication date May 16, 2024
- Intel Corporation
- Sean T. Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
- Publication number 20240128149
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Chieh HSIEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240105649
- Publication date Mar 28, 2024
- Innolux Corporation
- Shuhei Hosaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...
- Publication number 20240105557
- Publication date Mar 28, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Laura May Antoinette Clemente
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
- Publication number 20240071978
- Publication date Feb 29, 2024
- NIPPON MICROMETAL CORPORATION
- Yuya SUTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240071996
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Wonil SEO
- H01 - BASIC ELECTRIC ELEMENTS

Manufacturing methods

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Electronic package comprising conductive layer connected electrode...

Interposer, manufacturing method therefor, and circuit board assembly

Temperature-stable composite of a stranded wire having a contact pad

Methods of forming wire interconnect structures and related wire bo...

Electronic device including conductive element on side surface of s...

Electronic package and manufacturing method thereof

Semiconductor module with bond wire loop exposed from a molded body...

Copper wire bond on gold bump on semiconductor die bond pad

Semiconductor package

Package-on-package assembly with wire bond vias

Semiconductor fuse with multi-bond wire

Bonding wire for semiconductor devices

Electro-optical package and method of fabrication

Semiconductor arrangement comprising a semiconductor element, a sub...

Bonding wire for semiconductor devices

Offset interposers for large-bottom packages and large-die package-...

Electronic package comprising wire inside an electronic component

Al bonding wire

Palladium-coated copper bonding wire and method for manufacturing same

Electronic package comprising multiple wires inside an electronic c...

Methods of forming wire interconnect structures and related wire bo...

Wire bond pad design for compact stacked-die package

Manufacturing method of electronic package comprising a wire within...

Palladium-coated copper bonding wire, manufacturing method of palla...

Offset interposers for large-bottom packages and large-die package-...

Nonvolatile semiconductor memory device and fabrication method of t...

Semiconductor assemblies using edge stacking and methods of manufac...

Bonding wire for semiconductor devices

Semiconductor package with isolated heat spreader

Source/drain regions in integrated circuit structures

Patents Applicationslast 30 patents

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

V-BONDING USING DOUBLE STACKED STAND-OFF-STITCH FOR IMPROVED RF PER...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MOLDED POWER DIE PACKAGE WITH VERTICAL INTERCONNECT

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING DOUBLE ADHESIVE...

BALL-BOND ARRANGEMENT

SEMICONDUCTOR PACKAGING WITH EMBEDDED EMF SHIELDING PROTECTION USIN...

BOND WIRE HAVING A RECYCLED THERMOPLASTIC CORE WITH CONDUCTIVE FILLERS

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHODS OF FORMING WIRE INTERCONNECT STRUCTURES AND RELATED WIRE BO...

MANUFACTURING METHOD FOR BONDED BODY, BONDED BODY, MANUFACTURING ME...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

BONDING WIRE FOR SEMICONDUCTOR DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

BONDING WIRE FOR SEMICONDUCTOR DEVICES

BONDING WIRE FOR SEMICONDUCTOR DEVICES

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ARRANGEMENT COMPRISING A SEMICONDUCTOR ELEMENT, A SUB...

BONDING WIRE FOR SEMICONDUCTOR DEVICES

METHODS OF AUTOMATIC RECOVERY FOR PROCESS ERRORS IN OPERATING WIRE...

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...

SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFAC...

SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES

COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE

ELECTRONIC DEVICE

NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...

Al BONDING WIRE FOR SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...