Membership
Tour
Register
Log in
Manufacturing methods
Follow
Industry
CPC
H01L24/43
This industry / category may be too specific. Please go to a parent level for more data
Parent Industries
H
ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L24/00
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
Current Industry
H01L24/43
Manufacturing methods
Industries
Overview
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,978,730
Issue date
May 7, 2024
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Nonvolatile semiconductor memory device and fabrication method of t...
Patent number
11,963,371
Issue date
Apr 16, 2024
Kioxia Corporation
Kotaro Noda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor assemblies using edge stacking and methods of manufac...
Patent number
11,955,457
Issue date
Apr 9, 2024
Micron Technology, Inc.
Thomas H. Kinsley
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Bonding wire for semiconductor devices
Patent number
11,929,343
Issue date
Mar 12, 2024
Nippon Micrometal Corporation
Daizo Oda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with isolated heat spreader
Patent number
11,923,281
Issue date
Mar 5, 2024
Texas Instruments Incorporated
Anindya Poddar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Source/drain regions in integrated circuit structures
Patent number
11,916,106
Issue date
Feb 27, 2024
Intel Corporation
Sean T. Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
11,901,337
Issue date
Feb 13, 2024
Kioxia Corporation
Yasuo Otsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including conductive element on side surface of s...
Patent number
11,887,947
Issue date
Jan 30, 2024
INNOLUX CORPORATION
Shuhei Hosaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring formation method, method for manufacturing semiconductor dev...
Patent number
11,869,866
Issue date
Jan 9, 2024
Kioxia Corporation
Ryoichi Suzuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package structure with heat sink and method preparing...
Patent number
11,842,976
Issue date
Dec 12, 2023
SJ Semiconductor (Jiangyin) Corporation
Hanlung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Offset interposers for large-bottom packages and large-die package-...
Patent number
11,798,932
Issue date
Oct 24, 2023
Intel Corporation
Russell K. Mortensen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-on-package assembly with wire bond vias
Patent number
11,735,563
Issue date
Aug 22, 2023
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package comprising wire inside an electronic component a...
Patent number
11,728,234
Issue date
Aug 15, 2023
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wirebond-constructed inductors
Patent number
11,715,722
Issue date
Aug 1, 2023
Wolfspeed, Inc.
Kenneth P. Brewer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming a semiconductor package
Patent number
11,715,719
Issue date
Aug 1, 2023
Infineon Technologies AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die with multiple contact pads electrically coupled t...
Patent number
11,688,715
Issue date
Jun 27, 2023
STMicroelectronics, Inc.
Rennier Rodriguez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder joints on nickel surface finishes without gold plating
Patent number
11,676,926
Issue date
Jun 13, 2023
Schlumberger Technology Corporation
Mark Alex Kostinovsky
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
Patent number
11,605,609
Issue date
Mar 14, 2023
General Electric Company
Arun Virupaksha Gowda
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Miniaturization of optical sensor modules through wirebonded ball s...
Patent number
11,552,053
Issue date
Jan 10, 2023
Apple Inc.
Bilal Mohamed Ibrahim Kani
G02 - OPTICS
Information
Patent Grant
Package comprising wire bonds configured as a heat spreader
Patent number
11,545,411
Issue date
Jan 3, 2023
QUALCOMM Incorporated
Wen Yin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor dev...
Patent number
11,545,460
Issue date
Jan 3, 2023
Fuji Electric Co., Ltd.
Takeyoshi Nishimura
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
11,532,590
Issue date
Dec 20, 2022
Mitsubishi Electric Corporation
Hiroyuki Masumoto
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper wire bond on gold bump on semiconductor die bond pad
Patent number
11,515,275
Issue date
Nov 29, 2022
Texas Instruments Incorporated
Lin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device including wire on side surface of substrate and m...
Patent number
11,515,271
Issue date
Nov 29, 2022
INNOLUX CORPORATION
Shuhei Hosaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for optimizing looping parameters and looping t...
Patent number
11,495,570
Issue date
Nov 8, 2022
Kulicke and Soffa Industries, Inc.
Ivy Wei Qin
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package structure with heat sink and method preparing...
Patent number
11,488,925
Issue date
Nov 1, 2022
SJ Semiconductor (Jiangyin) Corporation
Hanlung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
11,462,561
Issue date
Oct 4, 2022
Kioxia Corporation
Takashi Izumi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Source/drain regions in integrated circuit structures
Patent number
11,450,736
Issue date
Sep 20, 2022
Intel Corporation
Sean T. Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding apparatus and manufacturing method for semiconductor a...
Patent number
11,450,640
Issue date
Sep 20, 2022
Shinkawa Ltd.
Shinsuke Tei
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device having supporting resin and manufacturing method...
Patent number
11,417,624
Issue date
Aug 16, 2022
Rohm Co., Ltd.
Hideaki Yanagida
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SOURCE/DRAIN REGIONS IN INTEGRATED CIRCUIT STRUCTURES
Publication number
20240162289
Publication date
May 16, 2024
Intel Corporation
Sean T. Ma
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLING INTERFACE REGION FOR A SEMICONDUCTOR DIE PACKAGE
Publication number
20240128149
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Chieh HSIEH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20240105649
Publication date
Mar 28, 2024
Innolux Corporation
Shuhei Hosaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO-LEAD INTEGRATED CIRCUIT HAVING AN ABLATED MOLD COMPOUND AND EXTR...
Publication number
20240105557
Publication date
Mar 28, 2024
TEXAS INSTRUMENTS INCORPORATED
Laura May Antoinette Clemente
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Al BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20240071978
Publication date
Feb 29, 2024
NIPPON MICROMETAL CORPORATION
Yuya SUTO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
Publication number
20240071996
Publication date
Feb 29, 2024
Samsung Electronics Co., Ltd.
Wonil SEO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
Publication number
20240055393
Publication date
Feb 15, 2024
Invensas LLC
Ellis Chau
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD FOR FABRICATING SAME
Publication number
20240047437
Publication date
Feb 8, 2024
Changxin Memory Technologies, Inc.
Mingxing ZUO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR P...
Publication number
20240038720
Publication date
Feb 1, 2024
SK HYNIX INC.
Su Ji UM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-...
Publication number
20240006401
Publication date
Jan 4, 2024
Intel Corporation
Russell K. MORTENSEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240006354
Publication date
Jan 4, 2024
RENESAS ELECTRONICS CORPORATION
Shota OKABE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
Publication number
20230411226
Publication date
Dec 21, 2023
SK HYNIX INC.
Young Chan OH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING AT LEAST ONE ELECTRICALLY CONDUCTIVE S...
Publication number
20230402423
Publication date
Dec 14, 2023
INFINEON TECHNOLOGIES AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230387066
Publication date
Nov 30, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FAN-OUT STACKED SEMICONDUCTOR PACKAGE STRUCTURE AND PACKAGING METHO...
Publication number
20230352449
Publication date
Nov 2, 2023
SJ Semiconductor(Jiangyin) Corporation
Yenheng Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230343663
Publication date
Oct 26, 2023
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230343664
Publication date
Oct 26, 2023
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230343665
Publication date
Oct 26, 2023
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230335528
Publication date
Oct 19, 2023
NIPPON MICROMETAL COPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TEMPERATURE-STABLE COMPOSITE OF A STRANDED WIRE HAVING A CONTACT PAD
Publication number
20230318207
Publication date
Oct 5, 2023
Heraeus Nexensos GmbH
Matthias MUZIOL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Al WIRING MATERIAL
Publication number
20230299037
Publication date
Sep 21, 2023
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
Tomohiro UNO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING WIRE FOR SEMICONDUCTOR DEVICES
Publication number
20230245995
Publication date
Aug 3, 2023
NIPPON MICROMETAL CORPORATION
Daizo ODA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR FUSE WITH MULTI-BOND WIRE
Publication number
20230187348
Publication date
Jun 15, 2023
TEXAS INSTRUMENTS INCORPORATED
Enis TUNCER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20230140664
Publication date
May 4, 2023
Mitsubishi Electric Corporation
Yusuke KAJI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Bonding Wire and Method for Manufacturing the Same
Publication number
20230125151
Publication date
Apr 27, 2023
Nippon Telegraph and Telephone Corporation
Toshiki Kishi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER WIRE BOND ON GOLD BUMP ON SEMICONDUCTOR DIE BOND PAD
Publication number
20230086535
Publication date
Mar 23, 2023
TEXAS INSTRUMENTS INCORPORATED
Lin Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230060586
Publication date
Mar 2, 2023
Samsung Electronics Co., Ltd.
Seok Geun AHN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE
Publication number
20230046861
Publication date
Feb 16, 2023
InnoLux Corporation
Shuhei Hosaka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING...
Publication number
20230049487
Publication date
Feb 16, 2023
SJ Semiconductor (Jiangyin) Corporation
Hanlung TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20220359324
Publication date
Nov 10, 2022
Siliconware Precision Industries Co., Ltd.
Ho-Chuan Lin
H01 - BASIC ELECTRIC ELEMENTS