Matching arrangements

Industry

CPC
H01L2223/6655

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2223/00Details relating to semiconductor or other solid state devices covered by the group H01L23/00

Current Industry

H01L2223/6655Matching arrangements

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier with a power transistor and an electrostatic discha...
- Patent number 12,166,455
- Issue date Dec 10, 2024
- NXP USA, INC.
- David Cobb Burdeaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier, power amplifier circuit, and power amplifier device
- Patent number 12,160,207
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Kenichi Shimamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor with integrated passive components
- Patent number 12,159,845
- Issue date Dec 3, 2024
- NXP USA, INC.
- Humayun Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF amplifier package
- Patent number 12,142,583
- Issue date Nov 12, 2024
- Ampleon Netherlands B.V.
- Josephus Henricus Bartholomeus Van der Zanden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency module and communication apparatus
- Patent number 12,136,614
- Issue date Nov 5, 2024
- Murata Manufacturing Co., Ltd.
- Yukiya Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier device
- Patent number 12,119,311
- Issue date Oct 15, 2024
- Sumitomo Electric Device Innovations, Inc.
- Naoyuki Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Channelized filter using semiconductor fabrication
- Patent number 12,119,313
- Issue date Oct 15, 2024
- Northrop Grumman Systems Corporation
- Dah-Weih Duan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amplifier device packages incorporating internal couplers
- Patent number 12,113,482
- Issue date Oct 8, 2024
- MACOM Technology Solutions Holdings, Inc.
- Kenneth Brewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged RF power device with PCB routing outside protective member
- Patent number 12,100,630
- Issue date Sep 24, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of realizing a wide band impedance mat...
- Patent number 12,094,840
- Issue date Sep 17, 2024
- Sumitomo Electric Device Innovations, Inc.
- Masahiro Hirayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,087,711
- Issue date Sep 10, 2024
- Murata Manufacturing Co., Ltd.
- Satoshi Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packages with uniform components and methods of forming the...
- Patent number 12,074,149
- Issue date Aug 27, 2024
- MACOM Technology Solutions Holdings, Inc.
- Michael E. Watts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electrical device
- Patent number 12,074,628
- Issue date Aug 27, 2024
- Skyworks Solutions, Inc.
- Andrew Martin Kay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device having a coupled interstage transformer and process implemen...
- Patent number 12,068,265
- Issue date Aug 20, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 12,051,658
- Issue date Jul 30, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Yuan Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electronic component package
- Patent number 12,040,305
- Issue date Jul 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Ok Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency integrated circuit
- Patent number 12,040,290
- Issue date Jul 16, 2024
- National Tsing Hua University
- Rachit Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid power amplifier with GaN-on-Si and GaN-on-SiC circuits
- Patent number 12,028,022
- Issue date Jul 2, 2024
- MACOM Technology Solutions Holdings, Inc.
- Prity Kirit Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier with decreased RF return current losses
- Patent number 12,009,792
- Issue date Jun 11, 2024
- Ampleon Netherlands B.V.
- Vittorio Cuoco
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively shielded radio frequency modules
- Patent number 12,003,025
- Issue date Jun 4, 2024
- Skyworks Solutions, Inc.
- Hoang Mong Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency power transistor and high-frequency power amplifier
- Patent number 11,984,413
- Issue date May 14, 2024
- FERDINAND-BRAUN-INSTITUT GGMBH, LEIBNIZ-INSTITUT FÜR HÖCHSTFREQUENZTECHNIK
- Olof Bengtsson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency transmission line with finish plating on conductive...
- Patent number 11,984,423
- Issue date May 14, 2024
- Skyworks Solutions, Inc.
- Sandra Louise Petty-Weeks
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Output-integrated transistor device packages
- Patent number 11,967,936
- Issue date Apr 23, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modularized power amplifier devices and architectures
- Patent number 11,967,937
- Issue date Apr 23, 2024
- Viasat, Inc.
- Shih Peng Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module and communication device
- Patent number 11,955,933
- Issue date Apr 9, 2024
- Murata Manufacturing Co., Ltd.
- Atsushi Horita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Output-integrated transistor amplifier device packages incorporatin...
- Patent number 11,936,342
- Issue date Mar 19, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density flip chip package for wireless transceivers
- Patent number 11,923,323
- Issue date Mar 5, 2024
- QUALCOMM Incorporated
- Ibrahim Ramez Chamas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-package-antenna integrated structure based on substrate integr...
- Patent number 11,901,608
- Issue date Feb 13, 2024
- 38TH RESEARCH INSTITUTE, CHINA ELECTRONICS TECHNOLOGY GROUP CORPORATION
- Chuanming Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Launch structures for radio frequency integrated device packages
- Patent number 11,894,322
- Issue date Feb 6, 2024
- Analog Devices, Inc.
- Bruce E. Wilcox
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH FREQUENCY AMPLIFIER AND MATCHING CIRCUIT
- Publication number 20240413799
- Publication date Dec 12, 2024
- Mitsubishi Electric Corporation
- Eigo Kuwata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID POWER AMPLIFIER WITH GAN-ON-SI AND GAN-ON-SIC CIRCUITS
- Publication number 20240396500
- Publication date Nov 28, 2024
- MACOM Technology Solutions Holdings, Inc.
- Prity Kirit Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240387416
- Publication date Nov 21, 2024
- Sumitomo Electric Industries, Ltd.
- Koji TSUKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371711
- Publication date Nov 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Cheng-Ting CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...
- Publication number 20240371802
- Publication date Nov 7, 2024
- MACOM Technology Solutions Holdings, Inc.
- Marvin MARBELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...
- Publication number 20240363461
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsieh-Hung Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE
- Publication number 20240356501
- Publication date Oct 24, 2024
- ViaSat, Inc.
- Shih Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY POWER AMPLIFIER
- Publication number 20240291437
- Publication date Aug 29, 2024
- Ampleon Netherlands B.V.
- Yang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BULK COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR RADIO FREQUENCY SWITCH...
- Publication number 20240291446
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Ying CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER
- Publication number 20240282725
- Publication date Aug 22, 2024
- Mitsubishi Electric Corporation
- Yoshinobu SASAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE
- Publication number 20240213189
- Publication date Jun 27, 2024
- Mitsubishi Electric Corporation
- Yuta SUGIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER DEVICE WITH MULTI-STAGE AMPLIFIER PACKAGE
- Publication number 20240213927
- Publication date Jun 27, 2024
- NXP USA, Inc.
- Damien Scatamacchia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...
- Publication number 20240203912
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Jeffrey Spencer Roberts
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...
- Publication number 20240186212
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Stephen Reza Hiemstra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DEVICE HAVING VERTICAL DIE INTERCONNECT STRUCTURE
- Publication number 20240162861
- Publication date May 16, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...
- Publication number 20240154639
- Publication date May 9, 2024
- Skyworks Solutions, Inc.
- James Phillip YOUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER AND RADIO FREQUENCY MODULE
- Publication number 20240146262
- Publication date May 2, 2024
- Mitsubishi Electric Corporation
- Ko KANAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT
- Publication number 20240145414
- Publication date May 2, 2024
- Wolfspeed, Inc.
- Gerard Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240145413
- Publication date May 2, 2024
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Makoto NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFFICIENCY IMPROVEMENTS FOR MULTI-STAGE POWER AMPLIFIERS
- Publication number 20240113669
- Publication date Apr 4, 2024
- MACOM Technology Solutions Holdings, Inc.
- Gerard J.L Bouisse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Push-Pull Amplifying Unit and Doherty Amplifier Comprising the Same
- Publication number 20240106396
- Publication date Mar 28, 2024
- Technische Universiteit Delft
- Mohammad Reza BEIKMIRZA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTO...
- Publication number 20240106397
- Publication date Mar 28, 2024
- Wolfspeed, Inc.
- Marvin Marbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE MEASUREMENT WITHOUT DISCONNECTING FROM HIGH POWER CIRCUIT
- Publication number 20240096598
- Publication date Mar 21, 2024
- LAM RESEARCH CORPORATION
- Sunil Kapoor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240096824
- Publication date Mar 21, 2024
- Murata Manufacturing Co., Ltd.
- Masao KONDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED POWER AMPLIFIER DEVICE
- Publication number 20240071960
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED RF CIRCUIT TOPOLOGY USING TRANSISTOR DIE WITH THROUGH SILIC...
- Publication number 20240071962
- Publication date Feb 29, 2024
- Wolfspeed, Inc.
- Basim Noori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTE...
- Publication number 20240072740
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DIE INCLUDING MATCHING CIRCUIT
- Publication number 20240072732
- Publication date Feb 29, 2024
- Wolfspeed, Inc.
- Donald Farrell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged power amplifier device with air cavity over die
- Publication number 20240072739
- Publication date Feb 29, 2024
- NXP USA, Inc.
- Kevin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOHERTY AMPLIFIERS
- Publication number 20240063756
- Publication date Feb 22, 2024
- NXP USA, Inc.
- Qi Hua
- H01 - BASIC ELECTRIC ELEMENTS

Matching arrangements

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Power amplifier with a power transistor and an electrostatic discha...

Power amplifier, power amplifier circuit, and power amplifier device

Transistor with integrated passive components

RF amplifier package

Power amplifier modules including semiconductor resistor and tantal...

Radio frequency module and communication apparatus

Amplifier device

Channelized filter using semiconductor fabrication

Amplifier device packages incorporating internal couplers

Packaged RF power device with PCB routing outside protective member

Semiconductor device capable of realizing a wide band impedance mat...

Semiconductor device

Device packages with uniform components and methods of forming the...

Packaged electrical device

Device having a coupled interstage transformer and process implemen...

Semiconductor package structure and method for manufacturing the same

Shielded electronic component package

Radio frequency integrated circuit

Hybrid power amplifier with GaN-on-Si and GaN-on-SiC circuits

Power amplifier with decreased RF return current losses

Selectively shielded radio frequency modules

High-frequency power transistor and high-frequency power amplifier

Radio frequency transmission line with finish plating on conductive...

Output-integrated transistor device packages

Modularized power amplifier devices and architectures

High-frequency module and communication device

Output-integrated transistor amplifier device packages incorporatin...

High-density flip chip package for wireless transceivers

Chip-package-antenna integrated structure based on substrate integr...

Launch structures for radio frequency integrated device packages

Patents Applicationslast 30 patents

HIGH FREQUENCY AMPLIFIER AND MATCHING CIRCUIT

HYBRID POWER AMPLIFIER WITH GAN-ON-SI AND GAN-ON-SIC CIRCUITS

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE

DEVICE HAVING A COUPLED INTERSTAGE TRANSFORMER AND PROCESS IMPLEMEN...

Millimeter-Wave Passive Circuit Designs with Wafer-Level Chip-Scale...

MODULARIZED POWER AMPLIFIER DEVICES AND ARCHITECTURE

DOHERTY POWER AMPLIFIER

BULK COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR RADIO FREQUENCY SWITCH...

POWER AMPLIFIER

POWER AMPLIFICATION HIGH-FREQUENCY CIRCUIT DEVICE

AMPLIFIER DEVICE WITH MULTI-STAGE AMPLIFIER PACKAGE

AMPLIFIER MODULES AND SYSTEMS WITH GROUND TERMINALS ADJACENT TO POW...

POWER AMPLIFIER MODULE WITH TRANSISTOR DIES FOR MULTIPLE AMPLIFIER...

POWER AMPLIFIER DEVICE HAVING VERTICAL DIE INTERCONNECT STRUCTURE

DEVICES AND METHODS RELATED TO RADIO-FREQUENCY FILTERS ON SILICON-O...

POWER AMPLIFIER AND RADIO FREQUENCY MODULE

RF AMPLIFIERS WITH IMPROVED STABILITY BY SOURCE INDUCTANCE ADJUSTMENT

SEMICONDUCTOR DEVICE

EFFICIENCY IMPROVEMENTS FOR MULTI-STAGE POWER AMPLIFIERS

Push-Pull Amplifying Unit and Doherty Amplifier Comprising the Same

TRANSISTOR AMPLIFIER WITH PCB ROUTING AND SURFACE MOUNTED TRANSISTO...

CAPACITANCE MEASUREMENT WITHOUT DISCONNECTING FROM HIGH POWER CIRCUIT

SEMICONDUCTOR DEVICE

PACKAGED POWER AMPLIFIER DEVICE

STACKED RF CIRCUIT TOPOLOGY USING TRANSISTOR DIE WITH THROUGH SILIC...

POWER AMPLIFIER DEVICE HAVING DIES WITH ELONGATED BONDPADS CONNECTE...

TRANSISTOR DIE INCLUDING MATCHING CIRCUIT

Packaged power amplifier device with air cavity over die

DOHERTY AMPLIFIERS