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H01L2224/48499
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/48499
Material of the auxiliary connecting means
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Patents Grants
last 30 patents
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Patent Grant
Packages with electrical fuses
Patent number
12,009,336
Issue date
Jun 11, 2024
Texas Instruments Incorporated
Mahmud Halim Chowdhury
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having conductive wire with increased attachme...
Patent number
11,804,447
Issue date
Oct 31, 2023
Amkor Technology Singapore Holding Pte Ltd.
Jun Ho Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Straight wirebonding of silicon dies
Patent number
11,456,272
Issue date
Sep 27, 2022
Western Digital Technologies, Inc.
Kirubakaran Periyannan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having conductive wire with increased attachme...
Patent number
10,943,871
Issue date
Mar 9, 2021
Amkor Technology Singapore Holding Pte Ltd.
Jun Ho Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonded electronic devices to round wire
Patent number
10,497,664
Issue date
Dec 3, 2019
Automated Assembly Corporation
Robert Neuman
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device, and alternator and power conversion device wh...
Patent number
10,319,849
Issue date
Jun 11, 2019
Hitachi Power Semiconductor Device, Ltd.
Tetsuya Ishimaru
H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information
Patent Grant
Discrete flexible interconnects for modules of integrated circuits
Patent number
10,297,572
Issue date
May 21, 2019
MC10, Inc.
Mitul Dalal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonded wide I/O semiconductor device
Patent number
10,249,592
Issue date
Apr 2, 2019
SanDisk Technologies LLC
Michael Mostovoy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
10,170,402
Issue date
Jan 1, 2019
Renesas Electronics Corporation
Yosuke Imazeki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having conductive wire with increased attachme...
Patent number
10,141,269
Issue date
Nov 27, 2018
Amkor Technology, Inc.
Jun Ho Jeon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Sensor chip package assembly and electronic device having sensor ch...
Patent number
10,121,750
Issue date
Nov 6, 2018
Shenzhen Goodix Technology Co., Ltd.
Yuping Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin plastic leadless package with exposed metal die paddle
Patent number
9,691,688
Issue date
Jun 27, 2017
CARSEM (M) SDN. BHD.
Mow Lum Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of fabricating same
Patent number
9,536,855
Issue date
Jan 3, 2017
Mitsubishi Electric Corporation
Koji Yamazaki
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Bonding structure of bonding wire
Patent number
9,331,049
Issue date
May 3, 2016
Nippon Steel & Sumikin Materials Co., Ltd.
Tomohiro Uno
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Thin plastic leadless package with exposed metal die paddle
Patent number
9,190,385
Issue date
Nov 17, 2015
Carsem (M) SDN. BHD.
Mow Lum Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-in-packages and methods of formation thereof
Patent number
9,147,628
Issue date
Sep 29, 2015
Infineon Technoloiges Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mixed wire semiconductor lead frame package
Patent number
9,087,827
Issue date
Jul 21, 2015
Infineon Technologies AG
Jenny Ong Wai Lian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
9,024,454
Issue date
May 5, 2015
Renesas Electronics Corporation
Masatoshi Yasunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with copper wire having different width portions
Patent number
8,772,952
Issue date
Jul 8, 2014
Renesas Electronics Corporation
Masatoshi Yasunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming wire bonds in semiconductor devices
Patent number
8,198,737
Issue date
Jun 12, 2012
FREESCALE SEMICONDUCTOR, INC.
Changliang Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor arrangement having specially fashioned bond wires
Patent number
8,174,104
Issue date
May 8, 2012
Micronas GmbH
Pascal Stumpf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mixed wire semiconductor lead frame package
Patent number
8,105,932
Issue date
Jan 31, 2012
Infineon Technologies AG
Jenny Ong Wai Lian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
7,928,551
Issue date
Apr 19, 2011
Elpida Memory, Inc.
Reiko Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
7,889,513
Issue date
Feb 15, 2011
Renesas Electronics Corporation
Yoshihiko Shimanuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding structure and manufacturing method thereof
Patent number
7,859,123
Issue date
Dec 28, 2010
Great Team Backend Foundry Inc.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Micro universal serial bus (USB) memory package
Patent number
7,709,946
Issue date
May 4, 2010
Hana Micron Co., Ltd.
Ki Tae Ryu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Wire bonds having pressure-absorbing balls
Patent number
7,404,513
Issue date
Jul 29, 2008
Texas Instruments Incorporated
Sohichi Kadoguchi
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
Patent number
7,314,818
Issue date
Jan 1, 2008
Seiko Epson Corporation
Takuya Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming bump, semiconductor element having bumps and met...
Patent number
7,176,570
Issue date
Feb 13, 2007
Seiko Epson Corporation
Takuya Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device circuit board, and electronic equipment
Patent number
7,064,425
Issue date
Jun 20, 2006
Seiko Epson Corporation
Takuya Takahashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
PACKAGES WITH ELECTRICAL FUSES
Publication number
20240332243
Publication date
Oct 3, 2024
TEXAS INSTRUMENTS INCORPORATED
Mahmud Halim CHOWDHURY
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240321813
Publication date
Sep 26, 2024
Kabushiki Kaisha Toshiba
Syotaro Ono
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
Publication number
20230369284
Publication date
Nov 16, 2023
Pac Tech - Packaging Technologies GmbH
RICARDO GEELHAAR
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
Publication number
20220084979
Publication date
Mar 17, 2022
Western Digital Technologies, Inc.
Kirubakaran Periyannan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
Publication number
20210143105
Publication date
May 13, 2021
Amkor Technology Singapore Holding Pte. Ltd.
Jun Ho JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
Publication number
20190051616
Publication date
Feb 14, 2019
Amkor Technology Inc.
Jun Ho JEON
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
Publication number
20160035691
Publication date
Feb 4, 2016
MITSUBISHI ELECTRIC CORPORATION
Koji YAMAZAKI
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20140273353
Publication date
Sep 18, 2014
RENESAS ELECTRONICS CORPORATION
Masatoshi Yasunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
Publication number
20140175628
Publication date
Jun 26, 2014
Hua Pan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-In-Packages and Methods of Formation Thereof
Publication number
20140001615
Publication date
Jan 2, 2014
Infineon Technologies Austria AG
Ralf Otremba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Device With Wire Bond Connections
Publication number
20130175677
Publication date
Jul 11, 2013
TEXAS INSTRUMENTS INCORPORATED
Wade Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
Publication number
20120091568
Publication date
Apr 19, 2012
INFINEON TECHNOLOGIES AG
Jenny Ong Wai Lian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20110159644
Publication date
Jun 30, 2011
Renesas Electronics Corporation
Yoshihiko SHIMANUKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BONDING STRUCTURE OF BONDING WIRE
Publication number
20110104510
Publication date
May 5, 2011
Nippon Steel Materials Co., Ltd.
Tomohiro Uno
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20110074019
Publication date
Mar 31, 2011
Renesas Electronics Corporation
Masatoshi Yasunaga
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...
Publication number
20110018135
Publication date
Jan 27, 2011
STMicroelectronics (Grenoble 2) SAS
Romain Coffy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF FORMING WIRE BONDS IN SEMICONDUCTOR DEVICES
Publication number
20100314754
Publication date
Dec 16, 2010
FREESCALE SEMICONDUCTOR, INC.
Changliang ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIREBOND STRUCTURES
Publication number
20100301467
Publication date
Dec 2, 2010
Albert Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20100295180
Publication date
Nov 25, 2010
GREAT TEAM BACKEND FOUNDRY INC.
CHING HSING TZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20100072619
Publication date
Mar 25, 2010
GREAT TEAM BACKEND FOUNDRY, INC.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND...
Publication number
20090302447
Publication date
Dec 10, 2009
Pascal Stumpf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing the same
Publication number
20090096111
Publication date
Apr 16, 2009
Elpida Memory, Inc.
Reiko Fujiwara
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin Plastic Leadless Package with Exposed Metal Die Paddle
Publication number
20090026594
Publication date
Jan 29, 2009
Carsem (M) Sdn.Bhd.
Mow Lum Yee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mixed Wire Semiconductor Lead Frame Package
Publication number
20090014848
Publication date
Jan 15, 2009
Jenny Ong Wai Lian
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS
Publication number
20080272487
Publication date
Nov 6, 2008
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package using copper wires and wire bonding method fo...
Publication number
20080265385
Publication date
Oct 30, 2008
Siliconware Precision Industries Co., Ltd.
Han-Lung Tsai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wire Bonds Having Pressure-Absorbing Balls
Publication number
20080251918
Publication date
Oct 16, 2008
TEXAS INSTRUMENTS INCORPORATED
SOHICHI KADOGUCHI
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Micro universal serial bus memory package and manufacturing method...
Publication number
20070295982
Publication date
Dec 27, 2007
Hana Micron Co., Ltd.
Ki Tae Ryu
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Semiconductor device and a method of manufacturing the same
Publication number
20070158392
Publication date
Jul 12, 2007
RENESAS TECHNOLOGY CORP.
Yoshihiko Shimanuki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor device and method of manufacturing the same, circuit...
Publication number
20060189117
Publication date
Aug 24, 2006
SEIKO EPSON CORPORATION
Takuya Takahashi
H01 - BASIC ELECTRIC ELEMENTS