Material of the auxiliary connecting means

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H01L2224/48499

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/48499Material of the auxiliary connecting means

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,943,871
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,497,664
- Issue date Dec 3, 2019
- Automated Assembly Corporation
- Robert Neuman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded wide I/O semiconductor device
- Patent number 10,249,592
- Issue date Apr 2, 2019
- SanDisk Technologies LLC
- Michael Mostovoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,141,269
- Issue date Nov 27, 2018
- Amkor Technology, Inc.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor chip package assembly and electronic device having sensor ch...
- Patent number 10,121,750
- Issue date Nov 6, 2018
- Shenzhen Goodix Technology Co., Ltd.
- Yuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 9,536,855
- Issue date Jan 3, 2017
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure of bonding wire
- Patent number 9,331,049
- Issue date May 3, 2016
- Nippon Steel & Sumikin Materials Co., Ltd.
- Tomohiro Uno
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,190,385
- Issue date Nov 17, 2015
- Carsem (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-in-packages and methods of formation thereof
- Patent number 9,147,628
- Issue date Sep 29, 2015
- Infineon Technoloiges Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 9,087,827
- Issue date Jul 21, 2015
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 9,024,454
- Issue date May 5, 2015
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with copper wire having different width portions
- Patent number 8,772,952
- Issue date Jul 8, 2014
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wire bonds in semiconductor devices
- Patent number 8,198,737
- Issue date Jun 12, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Changliang Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement having specially fashioned bond wires
- Patent number 8,174,104
- Issue date May 8, 2012
- Micronas GmbH
- Pascal Stumpf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed wire semiconductor lead frame package
- Patent number 8,105,932
- Issue date Jan 31, 2012
- Infineon Technologies AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,928,551
- Issue date Apr 19, 2011
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,889,513
- Issue date Feb 15, 2011
- Renesas Electronics Corporation
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure and manufacturing method thereof
- Patent number 7,859,123
- Issue date Dec 28, 2010
- Great Team Backend Foundry Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro universal serial bus (USB) memory package
- Patent number 7,709,946
- Issue date May 4, 2010
- Hana Micron Co., Ltd.
- Ki Tae Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wire bonds having pressure-absorbing balls
- Patent number 7,404,513
- Issue date Jul 29, 2008
- Texas Instruments Incorporated
- Sohichi Kadoguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 7,314,818
- Issue date Jan 1, 2008
- Seiko Epson Corporation
- Takuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming bump, semiconductor element having bumps and met...
- Patent number 7,176,570
- Issue date Feb 13, 2007
- Seiko Epson Corporation
- Takuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device circuit board, and electronic equipment
- Patent number 7,064,425
- Issue date Jun 20, 2006
- Seiko Epson Corporation
- Takuya Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250167164
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jiyeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20210143105
- Publication date May 13, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20190051616
- Publication date Feb 14, 2019
- Amkor Technology Inc.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20160035691
- Publication date Feb 4, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273353
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device With Wire Bond Connections
- Publication number 20130175677
- Publication date Jul 11, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Wade Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE
- Publication number 20120091568
- Publication date Apr 19, 2012
- INFINEON TECHNOLOGIES AG
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20110159644
- Publication date Jun 30, 2011
- Renesas Electronics Corporation
- Yoshihiko SHIMANUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE OF BONDING WIRE
- Publication number 20110104510
- Publication date May 5, 2011
- Nippon Steel Materials Co., Ltd.
- Tomohiro Uno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110074019
- Publication date Mar 31, 2011
- Renesas Electronics Corporation
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...
- Publication number 20110018135
- Publication date Jan 27, 2011
- STMicroelectronics (Grenoble 2) SAS
- Romain Coffy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING WIRE BONDS IN SEMICONDUCTOR DEVICES
- Publication number 20100314754
- Publication date Dec 16, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Changliang ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIREBOND STRUCTURES
- Publication number 20100301467
- Publication date Dec 2, 2010
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295180
- Publication date Nov 25, 2010
- GREAT TEAM BACKEND FOUNDRY INC.
- CHING HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100072619
- Publication date Mar 25, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND...
- Publication number 20090302447
- Publication date Dec 10, 2009
- Pascal Stumpf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20090096111
- Publication date Apr 16, 2009
- Elpida Memory, Inc.
- Reiko Fujiwara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Plastic Leadless Package with Exposed Metal Die Paddle
- Publication number 20090026594
- Publication date Jan 29, 2009
- Carsem (M) Sdn.Bhd.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed Wire Semiconductor Lead Frame Package
- Publication number 20090014848
- Publication date Jan 15, 2009
- Jenny Ong Wai Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS
- Publication number 20080272487
- Publication date Nov 6, 2008
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package using copper wires and wire bonding method fo...
- Publication number 20080265385
- Publication date Oct 30, 2008
- Siliconware Precision Industries Co., Ltd.
- Han-Lung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire Bonds Having Pressure-Absorbing Balls
- Publication number 20080251918
- Publication date Oct 16, 2008
- TEXAS INSTRUMENTS INCORPORATED
- SOHICHI KADOGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro universal serial bus memory package and manufacturing method...
- Publication number 20070295982
- Publication date Dec 27, 2007
- Hana Micron Co., Ltd.
- Ki Tae Ryu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device and a method of manufacturing the same
- Publication number 20070158392
- Publication date Jul 12, 2007
- RENESAS TECHNOLOGY CORP.
- Yoshihiko Shimanuki
- H01 - BASIC ELECTRIC ELEMENTS

Material of the auxiliary connecting means

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Packages with electrical fuses

Semiconductor device having conductive wire with increased attachme...

Straight wirebonding of silicon dies

Semiconductor device having conductive wire with increased attachme...

Wire bonded electronic devices to round wire

Semiconductor device, and alternator and power conversion device wh...

Discrete flexible interconnects for modules of integrated circuits

Wire bonded wide I/O semiconductor device

Semiconductor device

Semiconductor device having conductive wire with increased attachme...

Sensor chip package assembly and electronic device having sensor ch...

Thin plastic leadless package with exposed metal die paddle

Semiconductor device and method of fabricating same

Bonding structure of bonding wire

Thin plastic leadless package with exposed metal die paddle

Package-in-packages and methods of formation thereof

Mixed wire semiconductor lead frame package

Method of manufacturing semiconductor device

Semiconductor device with copper wire having different width portions

Method of forming wire bonds in semiconductor devices

Semiconductor arrangement having specially fashioned bond wires

Mixed wire semiconductor lead frame package

Semiconductor device and method of manufacturing the same

Semiconductor device

Wire bonding structure and manufacturing method thereof

Micro universal serial bus (USB) memory package

Wire bonds having pressure-absorbing balls

Semiconductor device and method of manufacturing the same, circuit...

Method for forming bump, semiconductor element having bumps and met...

Semiconductor device circuit board, and electronic equipment

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

PACKAGES WITH ELECTRICAL FUSES

SEMICONDUCTOR DEVICE

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

STRAIGHT WIREBONDING OF SILICON DIES

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

Package-In-Packages and Methods of Formation Thereof

Integrated Circuit Device With Wire Bond Connections

MIXED WIRE SEMICONDUCTOR LEAD FRAME PACKAGE

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

BONDING STRUCTURE OF BONDING WIRE

SEMICONDUCTOR DEVICE

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED...

METHOD OF FORMING WIRE BONDS IN SEMICONDUCTOR DEVICES

WIREBOND STRUCTURES

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR ARRANGEMENT HAVING SPECIALLY FASHIONED BOND WIRES AND...

Semiconductor device and method of manufacturing the same

Thin Plastic Leadless Package with Exposed Metal Die Paddle

Mixed Wire Semiconductor Lead Frame Package

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Semiconductor package using copper wires and wire bonding method fo...

Wire Bonds Having Pressure-Absorbing Balls

Micro universal serial bus memory package and manufacturing method...

Semiconductor device and a method of manufacturing the same