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H01L2224/065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/065Material

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and electronic device
- Patent number 12,354,976
- Issue date Jul 8, 2025
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating same
- Patent number 12,347,765
- Issue date Jul 1, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ling-Yi Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device comprising PN junction diode and Schottky barr...
- Patent number 12,341,135
- Issue date Jun 24, 2025
- Rohm Co., Ltd.
- Keiji Okumura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 12,334,465
- Issue date Jun 17, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating features for laser drilling process
- Patent number 12,322,716
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,300,649
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus including integrated pads and methods of manufacturing th...
- Patent number 12,300,647
- Issue date May 13, 2025
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding pads and methods of forming the same
- Patent number 12,300,644
- Issue date May 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wen-Hsiung Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having hybrid bonding pad
- Patent number 12,293,982
- Issue date May 6, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor redistribution structure with integrated test pad and...
- Patent number 12,288,759
- Issue date Apr 29, 2025
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Chih-Cheng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips stacked via con...
- Patent number 12,272,661
- Issue date Apr 8, 2025
- Samsung Electronics Co., Ltd.
- Eunsu Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having hybrid bondi...
- Patent number 12,266,622
- Issue date Apr 1, 2025
- NANYA TECHNOLOGY CORPORATION
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,255,161
- Issue date Mar 18, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structure with bifunctional routing and assembly compris...
- Patent number 12,249,572
- Issue date Mar 11, 2025
- Commissariat a l'Energie Atomique et Aux Energies Alternatives
- Candice Thomas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure comprising dummy feature interposed between...
- Patent number 12,237,284
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clamped semiconductor wafers and semiconductor devices
- Patent number 12,224,259
- Issue date Feb 11, 2025
- SanDisk Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,218,087
- Issue date Feb 4, 2025
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate comprising a binding region having a binding zone a...
- Patent number 12,218,154
- Issue date Feb 4, 2025
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Xiaoyuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,199,061
- Issue date Jan 14, 2025
- SK hynix Inc.
- Ha Gyeong Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages having stress-relieving features
- Patent number 12,191,268
- Issue date Jan 7, 2025
- Apogee Semiconductor, Inc.
- David A. Grant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of three-dimensional stacking structure
- Patent number 12,191,283
- Issue date Jan 7, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of semiconductor device
- Patent number 12,148,723
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission circuit, interface circuit, and memory
- Patent number 12,132,018
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Feng Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package with increased thermal radiation efficiency
- Patent number 12,113,050
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,080,701
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection pad structure for analysis in a semiconductor device
- Patent number 12,072,374
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND M...
- Publication number 20250239495
- Publication date Jul 24, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- Ming Jun Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250239552
- Publication date Jul 24, 2025
- Samsung Electronics Co., Ltd.
- Yong Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...
- Publication number 20250233091
- Publication date Jul 17, 2025
- SANDISK TECHNOLOGIES LLC
- Adarsh Rajashekhar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME
- Publication number 20250226269
- Publication date Jul 10, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- MING-CHUNG WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210556
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Keumhee MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250210580
- Publication date Jun 26, 2025
- Samsung Electronics Co., Ltd.
- Hee Woo AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20250210553
- Publication date Jun 26, 2025
- UNITED MICROELECTRONICS CORP.
- Yao-Hsien Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250201727
- Publication date Jun 19, 2025
- CXMT Corporation
- Qingchun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...
- Publication number 20250192035
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- Keunyoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20250183207
- Publication date Jun 5, 2025
- SOCIONEXT INC.
- Toru MATSUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE
- Publication number 20250167149
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Yu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...
- Publication number 20250157962
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- HANSUNG RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...
- Publication number 20250157965
- Publication date May 15, 2025
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Keisuke IZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250149481
- Publication date May 8, 2025
- Samsung Electronics Co., Ltd.
- Youngbae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250132275
- Publication date Apr 24, 2025
- Samsung Electronics Co., Ltd.
- Sangho Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250118714
- Publication date Apr 10, 2025
- Samsung Electronics Co., Ltd.
- Keumhee Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250105169
- Publication date Mar 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Leu-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure and alignment method thereof
- Publication number 20250105166
- Publication date Mar 27, 2025
- UNITED MICROELECTRONICS CORP.
- Chiao-Yi Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20250105184
- Publication date Mar 27, 2025
- MEDIATEK INC.
- Kai-Lun KUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE
- Publication number 20250105183
- Publication date Mar 27, 2025
- Samsung Electronics Co., Ltd.
- Hyung Chul SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING DUMMY PAD AND METHOD FOR FORMING THE SAME
- Publication number 20250105141
- Publication date Mar 27, 2025
- Yangtze Memory Technologies Co., Ltd.
- Fanfan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250096204
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20250087543
- Publication date Mar 13, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd. Hsinchu
- Yi-Hsiu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE FOR INCREASING BONDING RELIABILITY
- Publication number 20250079365
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jing Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED STRUCTURES
- Publication number 20250079385
- Publication date Mar 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250062257
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Young-Deuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20250062183
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Sujung Hyung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVER BACKPLANE, DISPLAY PANEL, SPLICING SCREEN AND ELECTRONIC APP...
- Publication number 20250056951
- Publication date Feb 13, 2025
- Chengdu Vistar Optoelectronics Co., Ltd.
- Chen SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...
- Publication number 20250054888
- Publication date Feb 13, 2025
- Huawei Technologies Co., Ltd
- Ran He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250044510
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- G02 - OPTICS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and electronic device

Semiconductor structure and method for fabricating same

Semiconductor device comprising PN junction diode and Schottky barr...

Semiconductor package and method of forming same

Heat dissipating features for laser drilling process

Semiconductor package

Apparatus including integrated pads and methods of manufacturing th...

Die bonding pads and methods of forming the same

Semiconductor structure having hybrid bonding pad

Semiconductor redistribution structure with integrated test pad and...

Semiconductor package including semiconductor chips stacked via con...

Method of manufacturing semiconductor structure having hybrid bondi...

Semiconductor device with composite conductive features and method...

Integrated structure with bifunctional routing and assembly compris...

Semiconductor structure comprising dummy feature interposed between...

Clamped semiconductor wafers and semiconductor devices

Semiconductor device with composite conductive features and method...

Array substrate comprising a binding region having a binding zone a...

Semiconductor packages

Integrated circuit packages having stress-relieving features

Manufacturing method of three-dimensional stacking structure

Structure of semiconductor device

Transmission circuit, interface circuit, and memory

Semiconductor package with increased thermal radiation efficiency

Split RDL connection between die and UBM

Bonded structures

Semiconductor package including test pad and bonding pad structure...

Semiconductor device assembly with surface-mount die support struct...

Semiconductor package

Detection pad structure for analysis in a semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DIE AND WAFER BONDING CRACK DETECTOR STRUCTURES AND M...

SEMICONDUCTOR PACKAGE

INTEGRATED BONDING PADS WITH CONVEX SIDEWALLS AND METHODS FOR FORMI...

TEST PAD STRUCTURE AND METHOD OF MANUFACTURING AND OPERATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR CHIP WITH DUAL CHIP-PAD STRUCTURE AND SEMICONDUCTOR P...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE

SEMICONDUCTOR PACKAGE INCLUDING DUMMY PADS AND MANUFACTURING METHOD...

BONDING STRUCTURES FOR HIGH-DENSITY METAL-TO-METAL BONDING AND METH...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor structure and alignment method thereof

ELECTRONIC DEVICE

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE HAVING DUMMY PAD AND METHOD FOR FORMING THE SAME

THREE-DIMENSIONAL STACKING STRUCTURE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE FOR INCREASING BONDING RELIABILITY

BONDED STRUCTURES

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

DRIVER BACKPLANE, DISPLAY PANEL, SPLICING SCREEN AND ELECTRONIC APP...

INTEGRATED CIRCUIT AND PREPARATION METHOD THEREOF, THREE-DIMENSIONA...

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME