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H01L2224/065

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/065Material

Industries

Patents Grantslast 30 patents

Information Patent Grant
Structure of semiconductor device
- Patent number 12,148,723
- Issue date Nov 19, 2024
- United Microelectronics Corp.
- Zhirui Sheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transmission circuit, interface circuit, and memory
- Patent number 12,132,018
- Issue date Oct 29, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Feng Lin
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor package with increased thermal radiation efficiency
- Patent number 12,113,050
- Issue date Oct 8, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split RDL connection between die and UBM
- Patent number 12,107,058
- Issue date Oct 1, 2024
- STATS ChipPAC Pte. Ltd.
- Jian Zuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package including test pad and bonding pad structure...
- Patent number 12,094,844
- Issue date Sep 17, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device assembly with surface-mount die support struct...
- Patent number 12,087,720
- Issue date Sep 10, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,080,701
- Issue date Sep 3, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Detection pad structure for analysis in a semiconductor device
- Patent number 12,072,374
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jihoon Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film on surface between passivation...
- Patent number 12,057,416
- Issue date Aug 6, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pads between stacked semiconductor dies and associated syst...
- Patent number 12,033,980
- Issue date Jul 9, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure and testing method thereof
- Patent number 12,020,993
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display panel and display device
- Patent number 12,021,049
- Issue date Jun 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 12,009,323
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,002,786
- Issue date Jun 4, 2024
- Samsung Electronics Co., Ltd.
- Young Lyong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite conductive features and method...
- Patent number 12,002,772
- Issue date Jun 4, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure, and method for forming thereof
- Patent number 11,996,375
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid bonding with uniform pattern density
- Patent number 11,996,399
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming same
- Patent number 11,984,422
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure, electronic substrate and method of ma...
- Patent number 11,978,706
- Issue date May 7, 2024
- Advanced Semiconductor Engineering, Inc.
- Shun-Tsat Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and forming method thereof
- Patent number 11,955,441
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including a dummy pad
- Patent number 11,948,913
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Seunghyun Baik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including high thermal conductivity layer
- Patent number 11,948,851
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sunjae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of inspection of semiconductor packages including measureme...
- Patent number 11,935,873
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Joonho Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor testing device, and semiconduct...
- Patent number 11,927,622
- Issue date Mar 12, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Masashi Tokunaga
- G01 - MEASURING TESTING
Information Patent Grant
Silicon photonic interposer with two metal redistribution layers
- Patent number 11,923,327
- Issue date Mar 5, 2024
- Rockley Photonics Limited
- Michael Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,923,279
- Issue date Mar 5, 2024
- Sony Group Corporation
- Nobutoshi Fujii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,916,029
- Issue date Feb 27, 2024
- Sumitomo Electric Industries, Ltd.
- Mitsuhiko Sakai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact pad for semiconductor device
- Patent number 11,901,320
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chang-Chia Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...
- Publication number 20240363564
- Publication date Oct 31, 2024
- TOKYO ELECTRON LIMITED
- Soo Doo CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Including Test Pad and Bonding Pad Structure...
- Publication number 20240363565
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...
- Publication number 20240347511
- Publication date Oct 17, 2024
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240339420
- Publication date Oct 10, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- JU BIN SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS
- Publication number 20240332229
- Publication date Oct 3, 2024
- Micron Technology, Inc.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240312934
- Publication date Sep 19, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240290756
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- YOUNG LYONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240274559
- Publication date Aug 15, 2024
- Innolux Corporation
- Chia-Ping Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240274554
- Publication date Aug 15, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF
- Publication number 20240274560
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING WITH UNIFORM PATTERN DENSITY
- Publication number 20240266341
- Publication date Aug 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Szu-Ying Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240258263
- Publication date Aug 1, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Hsien Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...
- Publication number 20240250047
- Publication date Jul 25, 2024
- NANYA TECHNOLOGY CORPORATION
- Teng-Yen HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240234373
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234342
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS
- Publication number 20240234340
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Che Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234349
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER
- Publication number 20240222217
- Publication date Jul 4, 2024
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20240213180
- Publication date Jun 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jian-Hong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...
- Publication number 20240194643
- Publication date Jun 13, 2024
- Samsung Electronics Co., Ltd.
- Youngdeuk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE
- Publication number 20240178167
- Publication date May 30, 2024
- Huawei Technologies Co., Ltd
- Ran HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240153915
- Publication date May 9, 2024
- SK HYNIX INC.
- Hee Sun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...
- Publication number 20240153901
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...
- Publication number 20240153897
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Fu-Chiang Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136307
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240136327
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- AENEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...
- Publication number 20240136310
- Publication date Apr 25, 2024
- Micron Technology, Inc.
- Wei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136311
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- GWANGJAE JEON
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Structure of semiconductor device

Transmission circuit, interface circuit, and memory

Semiconductor package with increased thermal radiation efficiency

Split RDL connection between die and UBM

Bonded structures

Semiconductor package including test pad and bonding pad structure...

Semiconductor device assembly with surface-mount die support struct...

Semiconductor package

Detection pad structure for analysis in a semiconductor device

Semiconductor device with metal film on surface between passivation...

Thermal pads between stacked semiconductor dies and associated syst...

Test structure and testing method thereof

Display panel and display device

Semiconductor structure

Semiconductor package and method of fabricating the same

Semiconductor device with composite conductive features and method...

Integrated circuit structure, and method for forming thereof

Hybrid bonding with uniform pattern density

Semiconductor package and method of forming same

Electronic package structure, electronic substrate and method of ma...

Interconnect structure and forming method thereof

Semiconductor package including a dummy pad

Semiconductor package including high thermal conductivity layer

Array substrate, display panel and display device

Methods of inspection of semiconductor packages including measureme...

Semiconductor device, semiconductor testing device, and semiconduct...

Silicon photonic interposer with two metal redistribution layers

Semiconductor device

Semiconductor device

Contact pad for semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES WITH HYBRID BONDING LAYERS AND PROCESS OF MAK...

Semiconductor Package Including Test Pad and Bonding Pad Structure...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

THERMAL PADS BETWEEN STACKED SEMICONDUCTOR DIES AND ASSOCIATED SYST...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE WITH DUAL DAMASCENE AND DUMMY PADS

DISPLAY PANEL AND DISPLAY DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

INTEGRATED CIRCUIT STRUCTURE, AND METHOD FOR FORMING THEREOF

HYBRID BONDING WITH UNIFORM PATTERN DENSITY

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE WITH COMPOSITE CONDUCTIVE FEATURES AND METHOD...

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGES AND METHODS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING HIGH THERMAL CONDUCTIVITY LAYER

INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING A PLURALITY OF DIFFERENT STACKED CH...

CHIP PACKAGE STRUCTURE AND METHOD FOR PREPARING CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Methods of Integrated Chip of Ultra-Fine Pitch Bonding and Resultin...

SEMICONDUCTOR DEVICE WITH ADVANCED PAD STRUCTURE AND METHOD FOR FOR...

SEMICONDUCTOR PACKAGE

MEMORY DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

APPARATUS INCLUDING INTEGRATED SEGMENTS AND METHODS OF MANUFACTURIN...

SEMICONDUCTOR PACKAGE