Materials of the insulating layers or coatings

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H01L23/49894

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49894Materials of the insulating layers or coatings

Industries

Patents Grantslast 30 patents

Information Patent Grant
Package substrate having porous dielectric layer
- Patent number 11,973,017
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Jaimal Mallory Williamson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of overlapping power terminals in a semiconductor module
- Patent number 11,973,015
- Issue date Apr 30, 2024
- Fuji Electric Co., Ltd.
- Masashi Hoya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power module
- Patent number 11,973,064
- Issue date Apr 30, 2024
- Robert Bosch GmbH
- Christian Marc Lautensack
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-layer stacked 3D fan-out packaging structure and method maki...
- Patent number 11,973,070
- Issue date Apr 30, 2024
- SJ Semiconductor (Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,961,797
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Keun Soo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,742
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of assembly
- Patent number 11,948,878
- Issue date Apr 2, 2024
- Littelfuse, Inc.
- Stefan Steinhoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having pad with regular and irregular depress...
- Patent number 11,929,315
- Issue date Mar 12, 2024
- Samsung Electronics Co., Ltd.
- Junghoon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-chip package with high density interconnects
- Patent number 11,908,802
- Issue date Feb 20, 2024
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic IC device comprising integrated optical and electronic c...
- Patent number 11,901,278
- Issue date Feb 13, 2024
- STMicroelectronics (Crolles 2) SAS
- Jean-Pierre Carrere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,901,332
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,887,919
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Yun Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication methods
- Patent number 11,887,934
- Issue date Jan 30, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring formation method, method for manufacturing semiconductor dev...
- Patent number 11,869,866
- Issue date Jan 9, 2024
- Kioxia Corporation
- Ryoichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer layer in semiconductor device and method of manufacture
- Patent number 11,868,047
- Issue date Jan 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sih-Hao Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide layered structure and methods of forming the same
- Patent number 11,854,826
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with pass-through clock traces and associate...
- Patent number 11,855,048
- Issue date Dec 26, 2023
- Thomas H. Kinsley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered printed circuit board, method for manufacturing the sa...
- Patent number 11,848,263
- Issue date Dec 19, 2023
- LG Chem, Ltd.
- Seung Lak Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing assembly structure by using frame structur...
- Patent number 11,848,280
- Issue date Dec 19, 2023
- ADVANCED SEMlCONDUCTOR ENGINEERING, INC.
- Wen Hung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
- Patent number 11,837,458
- Issue date Dec 5, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 11,830,745
- Issue date Nov 28, 2023
- TAIWANN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-film package having redistribution pattern between semicond...
- Patent number 11,830,803
- Issue date Nov 28, 2023
- Samsung Electronics Co., Ltd.
- Kwanjai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Imaging module
- Patent number 11,826,025
- Issue date Nov 28, 2023
- Fujikura Ltd.
- Wataru Oishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 11,817,405
- Issue date Nov 14, 2023
- Samsung Electronics Co., Ltd.
- Sumin Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Warp mitigation using pattern-matched metal layers in organic subst...
- Patent number 11,817,359
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Hien Dang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,810,793
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...
- Publication number 20240145368
- Publication date May 2, 2024
- Intel Corporation
- Jackson Chung Peng KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20240145375
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER INCLUDING ALIGNMENT KEY PATTERN LAYER INCLUDING...
- Publication number 20240128198
- Publication date Apr 18, 2024
- SK HYNIX INC.
- Heon Yong CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240120252
- Publication date Apr 11, 2024
- RENESAS ELECTRONICS CORPORATION
- Nobuhiro KINOSHITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED INTERCONNECT STRUCTURES
- Publication number 20240113032
- Publication date Apr 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Fung CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES
- Publication number 20240113049
- Publication date Apr 4, 2024
- Intel Corporation
- Kristof Kuwawi Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240113003
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Yun Seok CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240113031
- Publication date Apr 4, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS
- Publication number 20240113046
- Publication date Apr 4, 2024
- Intel Corporation
- Jason Scott Steill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT
- Publication number 20240114627
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MAT...
- Publication number 20240112951
- Publication date Apr 4, 2024
- Intel Corporation
- Philip Yashar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...
- Publication number 20240112999
- Publication date Apr 4, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...
- Publication number 20240113005
- Publication date Apr 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES
- Publication number 20240113007
- Publication date Apr 4, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH...
- Publication number 20240105571
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS
- Publication number 20240105625
- Publication date Mar 28, 2024
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Local Interconnect and Chiplet Integration
- Publication number 20240105626
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Improving Package Creepage Distance
- Publication number 20240105447
- Publication date Mar 28, 2024
- NEXPERIA B.V.
- Hans-Juergen Funke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS
- Publication number 20240105568
- Publication date Mar 28, 2024
- QUALCOMM Incorporated
- Joan Rey Villarba BUOT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE
- Publication number 20240096776
- Publication date Mar 21, 2024
- AaltoSemi Inc.
- Andrew C. CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE
- Publication number 20240096782
- Publication date Mar 21, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Bo Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240096781
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Ti Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE
- Publication number 20240096771
- Publication date Mar 21, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Osvaldo Lopez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deposition of Thick Layers of Silicon Dioxide
- Publication number 20240096616
- Publication date Mar 21, 2024
- SPTS TECHNOLOGIES LIMITED
- Matt Edmonds
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...
- Publication number 20240088002
- Publication date Mar 14, 2024
- SJ Semiconductor(Jiangyin) Corporation
- Yenheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
- Publication number 20240079346
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Yang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS
- Publication number 20240079306
- Publication date Mar 7, 2024
- Micron Technology, Inc.
- Kelvin Tan Aik Boo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE HAVING REDISTRIBUTION PATTERN BETWEEN SEMICOND...
- Publication number 20240079312
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- KwanJai LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20240079250
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- JAEWON CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Materials of the insulating layers or coatings

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Package substrate having porous dielectric layer

Method of manufacturing substrate structure with filling material f...

Plurality of overlapping power terminals in a semiconductor module

Semiconductor power module

Double-layer stacked 3D fan-out packaging structure and method maki...

Semiconductor package and fabricating method thereof

Semiconductor device and manufacturing method thereof

Semiconductor chip package and method of assembly

Semiconductor structure and manufacturing method thereof

Semiconductor package having pad with regular and irregular depress...

Fabrication method of substrate having electrical interconnection s...

Multi-chip package with high density interconnects

Electronic IC device comprising integrated optical and electronic c...

Semiconductor device and manufacturing method thereof

Manufacturing method of package structure

Semiconductor package

Package structure and fabrication methods

Wiring formation method, method for manufacturing semiconductor dev...

Polymer layer in semiconductor device and method of manufacture

Metal oxide layered structure and methods of forming the same

Semiconductor packages with pass-through clock traces and associate...

Multilayered printed circuit board, method for manufacturing the sa...

Method for manufacturing assembly structure by using frame structur...

Substrate with gradiated dielectric for reducing impedance mismatch

3D packages and methods for forming the same

Chip-on-film package having redistribution pattern between semicond...

Imaging module

Semiconductor device and method of fabricating the same

Warp mitigation using pattern-matched metal layers in organic subst...

Semiconductor packages and methods of forming same

Patents Applicationslast 30 patents

ELECTRONIC ASSEMBLY WITH POWER MODULE INTERPOSER AND METHODS OF FOR...

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR WAFER INCLUDING ALIGNMENT KEY PATTERN LAYER INCLUDING...

SEMICONDUCTOR DEVICE

PACKAGED INTERCONNECT STRUCTURES

PACKAGE SUBSTRATE WITH OPEN AIR GAP STRUCTURES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

POROUS POLYMER DIELECTRIC LAYER ON CORE

EMBEDDED THIN FILM VARISTOR IN THROUGH GLASS VIAS

ENHANCED SUBTRACTIVE ETCH ANISOTROPY USING ETCH RATE GRADIENT

INTEGRATED CIRCUIT INTERCONNECT STRUCTURES WITH NIOBIUM BARRIER MAT...

LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE I...

HYBRID BONDING TECHNOLOGIES WITH THERMAL EXPANSION COMPENSATION STR...

AIR GAP ARCHITECTURE FOR HIGH SPEED I/O SUBSTRATE TRACES

IMPLANTATION OF SPECIES ON GLASS CORE SURFACE FOR LOW LOSS AND HIGH...

OPEN CAVITY INTERCONNECTS FOR MIB CONNECTIONS

Semiconductor Package with Local Interconnect and Chiplet Integration

Method of Improving Package Creepage Distance

PACKAGE COMPRISING A SUBSTRATE WITH INTERCONNECTS

PACKAGE SUBSTRATE

PACKAGING DEVICE, PACKAGING MODULE, AND ELECTRONIC DEVICE

PACKAGE STRUCTURE

WAFER BASED MOLDED FLIP CHIP ROUTABLE IC PACKAGE

Deposition of Thick Layers of Silicon Dioxide

SYSTEM-LEVEL FAN-OUT PACKAGING STRUCTURE AND METHOD FOR MANUFACTURI...

ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF

MICROELECTRONIC DEVICE PACKAGES AND RELATED METHODS AND SYSTEMS

CHIP-ON-FILM PACKAGE HAVING REDISTRIBUTION PATTERN BETWEEN SEMICOND...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING