Means for bonding being attached to, or being formed on, the surface to be connected

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,842,972
- Issue date Dec 12, 2023
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 11,355,462
- Issue date Jun 7, 2022
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 11,296,015
- Issue date Apr 5, 2022
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optoelectronic semiconductor device having a side face as mounting...
- Patent number 11,276,803
- Issue date Mar 15, 2022
- OSRAM OLED GmbH
- Thomas Schwarz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 10,892,253
- Issue date Jan 12, 2021
- Fuji Electric Co., Ltd.
- Shun Ikenouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate design for semiconductor packages and method of forming same
- Patent number 10,867,949
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jung Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,832,992
- Issue date Nov 10, 2020
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,818,628
- Issue date Oct 27, 2020
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,804,179
- Issue date Oct 13, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,679,918
- Issue date Jun 9, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module including pressure contact adjustment screws
- Patent number 10,658,343
- Issue date May 19, 2020
- Fuji Electric Co., Ltd.
- Yuji Iizuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,636,720
- Issue date Apr 28, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,600,711
- Issue date Mar 24, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and stack body manufacturing apparatus
- Patent number 10,583,641
- Issue date Mar 10, 2020
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- B32 - LAYERED PRODUCTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,529,639
- Issue date Jan 7, 2020
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 10,522,494
- Issue date Dec 31, 2019
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and fabricating method thereof
- Patent number 10,515,909
- Issue date Dec 24, 2019
- BOE Technology Group Co., Ltd.
- Xiaodong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,490,476
- Issue date Nov 26, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach methods and semiconductor devices manufactured based on...
- Patent number 10,396,015
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and alternator using same
- Patent number 10,304,761
- Issue date May 28, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Kenya Kawano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 10,269,775
- Issue date Apr 23, 2019
- Shindengen Electric Manufacturing Co., Ltd.
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded intelligent power module
- Patent number 10,177,080
- Issue date Jan 8, 2019
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and casing of the semiconductor device
- Patent number 10,121,714
- Issue date Nov 6, 2018
- Fuji Electric Co., Ltd.
- Kousuke Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package with enhanced performance
- Patent number 10,109,550
- Issue date Oct 23, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with interlocked connection
- Patent number 10,090,216
- Issue date Oct 2, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 10,008,460
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company Limited
- An-Jhih Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring body assembly, structure with conductor layer, and touch sensor
- Patent number 9,983,448
- Issue date May 29, 2018
- Fujikura Ltd.
- Yuki Suto
- G02 - OPTICS
Information Patent Grant
Bonding apparatus and stack body manufacturing apparatus
- Patent number 9,925,749
- Issue date Mar 27, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu Ohno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit for semiconductor device
- Patent number 9,854,708
- Issue date Dec 26, 2017
- Fuji Electric Co., Ltd.
- Takafumi Yamada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor chip connected in a flip...
- Patent number 9,721,865
- Issue date Aug 1, 2017
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20240055384
- Publication date Feb 15, 2024
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20210013132
- Publication date Jan 14, 2021
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Attach Methods and Semiconductor Devices Manufactured based on...
- Publication number 20190348347
- Publication date Nov 14, 2019
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20190057922
- Publication date Feb 21, 2019
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180219004
- Publication date Aug 2, 2018
- SHINDENGEN ELECTRIC MANUFACTURING CO., LTD
- Kosuke Ikeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY APPARATUS AND FABRICATING METHOD THEREOF
- Publication number 20180190598
- Publication date Jul 5, 2018
- BOE TECHNOLOGY GROUP CO., LTD.
- Xiaodong Xie
- G02 - OPTICS
Information Patent Application
MOLDED INTELLIGENT POWER MODULE
- Publication number 20180108598
- Publication date Apr 19, 2018
- Alpha and Omega Semiconductor (Cayman) Ltd.
- Zhiqiang Niu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND STACK BODY MANUFACTURING APPARATUS
- Publication number 20180072033
- Publication date Mar 15, 2018
- Semiconductor Energy Laboratory Co., Ltd.
- Masakatsu OHNO
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE
- Publication number 20180047653
- Publication date Feb 15, 2018
- Qorvo US, Inc.
- Julio C. Costa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Producing a Plurality of Semico...
- Publication number 20170338384
- Publication date Nov 23, 2017
- Osram Opto Semiconductors GmbH
- Thomas SCHWARZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BODY ASSEMBLY, STRUCTURE WITH CONDUCTOR LAYER, AND TOUCH SENSOR
- Publication number 20170199412
- Publication date Jul 13, 2017
- FUJIKURA LTD.
- Yuki Suto
- G02 - OPTICS
Information Patent Application
Semiconductor Package With Interlocked Connection
- Publication number 20170170082
- Publication date Jun 15, 2017
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140332951
- Publication date Nov 13, 2014
- Hideyo Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20140246789
- Publication date Sep 4, 2014
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...
- Publication number 20130175708
- Publication date Jul 11, 2013
- Rohm Co., Ltd.
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20080246163
- Publication date Oct 9, 2008
- Kazumasa Tanida
- H01 - BASIC ELECTRIC ELEMENTS

Means for bonding being attached to, or being formed on, the surface to be connected

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with a semiconductor chip connected in a flip...

Semiconductor device with a semiconductor chip connected in a flip...

Die attach methods and semiconductor devices manufactured based on...

Optoelectronic semiconductor device having a side face as mounting...

Semiconductor device manufacturing method and semiconductor device

Substrate design for semiconductor packages and method of forming same

Die attach methods and semiconductor devices manufactured based on...

Semiconductor device with a semiconductor chip connected in a flip...

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Semiconductor module including pressure contact adjustment screws

Wafer-level package with enhanced performance

Wafer-level package with enhanced performance

Bonding apparatus and stack body manufacturing apparatus

Wafer-level package with enhanced performance

Semiconductor device with a semiconductor chip connected in a flip...

Display apparatus and fabricating method thereof

Wafer-level package with enhanced performance

Die attach methods and semiconductor devices manufactured based on...

Semiconductor device and alternator using same

Semiconductor device and method for manufacturing semiconductor device

Molded intelligent power module

Semiconductor device and casing of the semiconductor device

Wafer-level package with enhanced performance

Semiconductor package with interlocked connection

Semiconductor package and method of forming the same

Wiring body assembly, structure with conductor layer, and touch sensor

Bonding apparatus and stack body manufacturing apparatus

Unit for semiconductor device

Semiconductor device with a semiconductor chip connected in a flip...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

Die Attach Methods and Semiconductor Devices Manufactured based on...

Die Attach Methods and Semiconductor Devices Manufactured based on...

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

DISPLAY APPARATUS AND FABRICATING METHOD THEREOF

MOLDED INTELLIGENT POWER MODULE

BONDING APPARATUS AND STACK BODY MANUFACTURING APPARATUS

WAFER-LEVEL PACKAGE WITH ENHANCED PERFORMANCE

Semiconductor Device and Method for Producing a Plurality of Semico...

WIRING BODY ASSEMBLY, STRUCTURE WITH CONDUCTOR LAYER, AND TOUCH SENSOR

Semiconductor Package With Interlocked Connection

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP CONNECTED IN A FLIP...

Semiconductor Device