Mechanical treatment

Industry

CPC
H01L2224/27602

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/27602Mechanical treatment

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Systems of applying materials to components
- Patent number 12,040,306
- Issue date Jul 16, 2024
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,867,878
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems of applying materials to components
- Patent number 10,741,519
- Issue date Aug 11, 2020
- Laird Technologies, Inc.
- Jason L. Strader
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Engineered polymer-based electronic materials
- Patent number 10,682,732
- Issue date Jun 16, 2020
- Alpha Assembly Solutions Inc.
- Ramakrishna Hosur Venkatagiriyappa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
- Patent number 10,600,760
- Issue date Mar 24, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive sheet, production method for thermally conduct...
- Patent number 10,526,519
- Issue date Jan 7, 2020
- Dexerials Corporation
- Hiroki Kanaya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dam for three-dimensional integrated circuit
- Patent number 10,020,236
- Issue date Jul 10, 2018
- Taiwan Semiconductar Manufacturing Campany
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing a semiconductor device
- Patent number 9,653,623
- Issue date May 16, 2017
- Samsung Electronics Co., Ltd.
- Yi-Koan Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,774,493
- Issue date Aug 10, 2004
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,566,234
- Issue date May 20, 2003
- Aguila Technologies, Inc.
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,518,677
- Issue date Feb 11, 2003
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip assembly with pre-applied encapsulating layers
- Patent number 6,297,560
- Issue date Oct 2, 2001
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
- Patent number 6,121,689
- Issue date Sep 19, 2000
- Miguel Albert Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230084360
- Publication date Mar 16, 2023
- InnoLux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
- Publication number 20220399317
- Publication date Dec 15, 2022
- Seoul Semiconductor Co., Ltd.
- Woo Gun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE
- Publication number 20200009845
- Publication date Jan 9, 2020
- FUJIFILM CORPORATION
- Shotaro OGAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermally Conductive Sheet, Production Method for Thermally Conduct...
- Publication number 20190055443
- Publication date Feb 21, 2019
- Dexerials Corporation
- Hiroki Kanaya
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Dam for Three-Dimensional Integrated Circuit
- Publication number 20180323118
- Publication date Nov 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Ding Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
- Publication number 20100159644
- Publication date Jun 24, 2010
- Rajiv Carl Dunne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20050218517
- Publication date Oct 6, 2005
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20030218261
- Publication date Nov 27, 2003
- M. A. Capote
- Miguel A. Capote
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
- Publication number 20020014703
- Publication date Feb 7, 2002
- Miguel A. Capote
- B32 - LAYERED PRODUCTS

Mechanical treatment

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Systems of applying materials to components

Dam for three-dimensional integrated circuit

Systems of applying materials to components

Engineered polymer-based electronic materials

Ultrathin layer for forming a capacitive interface between joined i...

Thermally conductive sheet, production method for thermally conduct...

Dam for three-dimensional integrated circuit

Methods of manufacturing a semiconductor device

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip assembly with pre-applied encapsulating layers

Semiconductor flip-chip package and method for the fabrication thereof

Patents Applicationslast 30 patents

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL

METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE

Thermally Conductive Sheet, Production Method for Thermally Conduct...

Dam for Three-Dimensional Integrated Circuit

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof

Semiconductor flip-chip package and method for the fabrication thereof