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H01L2224/27602
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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/27602
Mechanical treatment
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Patents Grants
last 30 patents
Information
Patent Grant
Dam for three-dimensional integrated circuit
Patent number
10,867,878
Issue date
Dec 15, 2020
Taiwan Semiconductor Manufacturing Company
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems of applying materials to components
Patent number
10,741,519
Issue date
Aug 11, 2020
Laird Technologies, Inc.
Jason L. Strader
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Engineered polymer-based electronic materials
Patent number
10,682,732
Issue date
Jun 16, 2020
Alpha Assembly Solutions Inc.
Ramakrishna Hosur Venkatagiriyappa
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultrathin layer for forming a capacitive interface between joined i...
Patent number
10,600,760
Issue date
Mar 24, 2020
Invensas Corporation
Belgacem Haba
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally conductive sheet, production method for thermally conduct...
Patent number
10,526,519
Issue date
Jan 7, 2020
Dexerials Corporation
Hiroki Kanaya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dam for three-dimensional integrated circuit
Patent number
10,020,236
Issue date
Jul 10, 2018
Taiwan Semiconductar Manufacturing Campany
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of manufacturing a semiconductor device
Patent number
9,653,623
Issue date
May 16, 2017
Samsung Electronics Co., Ltd.
Yi-Koan Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
Patent number
6,774,493
Issue date
Aug 10, 2004
M. A. Capote
Miguel A. Capote
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
Patent number
6,566,234
Issue date
May 20, 2003
Aguila Technologies, Inc.
Miguel A. Capote
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
Patent number
6,518,677
Issue date
Feb 11, 2003
Miguel A. Capote
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor flip-chip assembly with pre-applied encapsulating layers
Patent number
6,297,560
Issue date
Oct 2, 2001
Miguel A. Capote
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor flip-chip package and method for the fabrication thereof
Patent number
6,121,689
Issue date
Sep 19, 2000
Miguel Albert Capote
Miguel A. Capote
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20230084360
Publication date
Mar 16, 2023
InnoLux Corporation
Jen-Hai Chi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF REPAIRING A DISPLAY PANEL AND REPAIRED DISPLAY PANEL
Publication number
20220399317
Publication date
Dec 15, 2022
Seoul Semiconductor Co., Ltd.
Woo Gun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR MANUFACTURING MEMBER TO BE TREATED AND LAMINATE
Publication number
20200009845
Publication date
Jan 9, 2020
FUJIFILM CORPORATION
Shotaro OGAWA
B32 - LAYERED PRODUCTS
Information
Patent Application
Thermally Conductive Sheet, Production Method for Thermally Conduct...
Publication number
20190055443
Publication date
Feb 21, 2019
Dexerials Corporation
Hiroki Kanaya
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
Dam for Three-Dimensional Integrated Circuit
Publication number
20180323118
Publication date
Nov 8, 2018
Taiwan Semiconductor Manufacturing Company, Ltd.
Tsung-Ding Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PH...
Publication number
20100159644
Publication date
Jun 24, 2010
Rajiv Carl Dunne
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
Publication number
20050218517
Publication date
Oct 6, 2005
M. A. Capote
Miguel A. Capote
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
Publication number
20030218261
Publication date
Nov 27, 2003
M. A. Capote
Miguel A. Capote
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor flip-chip package and method for the fabrication thereof
Publication number
20020014703
Publication date
Feb 7, 2002
Miguel A. Capote
B32 - LAYERED PRODUCTS