Mechanically attached to another device

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CPC
H05K2201/105

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HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/105Mechanically attached to another device

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Stretchable mounting substrate
- Patent number 12,363,823
- Issue date Jul 15, 2025
- Murata Manufacturing Co., Ltd.
- Tadahiko Matsumoto
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Electronic substrate and electronic device
- Patent number 12,362,300
- Issue date Jul 15, 2025
- INNOLUX CORPORATION
- Chueh Yuan Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module
- Patent number 12,356,538
- Issue date Jul 8, 2025
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module
- Patent number 12,349,327
- Issue date Jul 1, 2025
- Murata Manufacturing Co., Ltd.
- Shota Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile SODIMM (small outline dual inline memory module)
- Patent number 12,349,274
- Issue date Jul 1, 2025
- Intel Corporation
- Raghavendra Rao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Voltage regulator module
- Patent number 12,348,141
- Issue date Jul 1, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Technologies for radio frequency optimized interconnects for a quan...
- Patent number 12,349,604
- Issue date Jul 1, 2025
- Intel Corporation
- Hubert C. George
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Radio frequency module and communication device
- Patent number 12,336,089
- Issue date Jun 17, 2025
- Murata Manufacturing Co., Ltd.
- Yuji Takematsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Array substrate, display panel and display module
- Patent number 12,334,426
- Issue date Jun 17, 2025
- Kunshan Go-Visionox Opto-Electronics Co., Ltd.
- Chuanzhi Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection element for electrically connecting two circuit carriers
- Patent number 12,328,819
- Issue date Jun 10, 2025
- Robert Bosch GmbH
- Joerg Offterdinger
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Baffles for electronic circuits immersed in cooling fluid in a tank
- Patent number 12,322,676
- Issue date Jun 3, 2025
- Auradine, Inc.
- Anuya Reddy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device including staggered semiconductor memo...
- Patent number 12,324,102
- Issue date Jun 3, 2025
- SanDisk Technologies, Inc.
- Fu Xing Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single circuit board assembly with logic and power components
- Patent number 12,324,093
- Issue date Jun 3, 2025
- Steering Solutions IP Holding Corporation
- Ryan D. Yaklin
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Methods and apparatus for package with interposers
- Patent number 12,322,670
- Issue date Jun 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Lin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting module with compact converter circuit
- Patent number 12,313,249
- Issue date May 27, 2025
- Valeo Vision
- Alexandre Val
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed electronic systems
- Patent number 12,302,497
- Issue date May 13, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked electronic structure
- Patent number 12,300,424
- Issue date May 13, 2025
- Cyntec Co., Ltd.
- Wenyu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate module and power module for transformer
- Patent number 12,289,835
- Issue date Apr 29, 2025
- LG Innotek Co., Ltd
- Soo San Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-in machine for pressing components into a substrate, in parti...
- Patent number 12,284,768
- Issue date Apr 22, 2025
- ERSA GmbH
- Kevin Friedrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate frame design for three-dimensional stacked electronic ass...
- Patent number 12,278,172
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- Akash Agrawal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding case, circuit board assembly, and electronic device
- Patent number 12,256,526
- Issue date Mar 18, 2025
- HONOR DEVICE CO., LTD.
- Jiuliang Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High current surface mount toroid inductor
- Patent number 12,255,002
- Issue date Mar 18, 2025
- Steering Solutions IP Holding Corporation
- Michael C. Hallman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 12,256,493
- Issue date Mar 18, 2025
- Ian Getreu
- G01 - MEASURING TESTING
Information Patent Grant
Capacitor bank assembly
- Patent number 12,250,771
- Issue date Mar 11, 2025
- Rockwell Collins, Inc.
- Martin J. Jennings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mouth guard having internal components for sensing impact forces
- Patent number 12,232,889
- Issue date Feb 25, 2025
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PACKAGING ARCHITECTURE FOR A HIGH FREQUENCY ACTIVE ELECTRONICALLY S...
- Publication number 20250227848
- Publication date Jul 10, 2025
- Rockwell Collins, Inc.
- Ross K. Wilcoxon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA
- Publication number 20250220804
- Publication date Jul 3, 2025
- Prime World International Holdings Ltd.
- Chao-Hung TSAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...
- Publication number 20250220819
- Publication date Jul 3, 2025
- Intel Corporation
- Pratyasha MOHAPATRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250212327
- Publication date Jun 26, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Kyeong Yub Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS
- Publication number 20250210449
- Publication date Jun 26, 2025
- Monolithic Power Systems, Inc.
- Xin Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL FOOTPRINT POWER SWITCH
- Publication number 20250212333
- Publication date Jun 26, 2025
- VISIC TECHNOLOGIES LTD
- Guillermo Romero
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20250212334
- Publication date Jun 26, 2025
- Mitsubishi Electric Corporation
- Taketoshi SHIKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION
- Publication number 20250212372
- Publication date Jun 26, 2025
- PANJIT INTERNATIONAL INC.
- CHIEN-CHUN WANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION
- Publication number 20250203773
- Publication date Jun 19, 2025
- Micron Technology, Inc.
- Kelvin Aik Boo TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND IMAGE FORMING APPARATUS
- Publication number 20250189923
- Publication date Jun 12, 2025
- Canon Kabushiki Kaisha
- YOSHIFUMI TAKAO
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
VIBRATION SENSOR, ELECTRONIC DEVICE AND VIBRATION DETECTION METHOD
- Publication number 20250194002
- Publication date Jun 12, 2025
- GOERTEK MICROELECTRONICS INC.
- Tangliu Yan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME
- Publication number 20250194006
- Publication date Jun 12, 2025
- Samsung Electronics Co., Ltd.
- DONGYOON SEO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP ELECTRONIC COMPONENT
- Publication number 20250191845
- Publication date Jun 12, 2025
- Murata Manufacturing Co., Ltd.
- Tatsunori YASUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHIELDING CASE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE
- Publication number 20250185224
- Publication date Jun 5, 2025
- Honor Device Co., Ltd.
- Jiuliang Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...
- Publication number 20250185169
- Publication date Jun 5, 2025
- Arista Networks, Inc.
- Robert Morris Wilcox
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BATTERY CHARGER
- Publication number 20250175021
- Publication date May 29, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. SILHA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250176109
- Publication date May 29, 2025
- VERTIV CORPORATION
- RAJAN SURESH BOROLE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250168984
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- Jin Duck PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250159810
- Publication date May 15, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...
- Publication number 20250159795
- Publication date May 15, 2025
- AGC Inc.
- Kenji FUJITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250159811
- Publication date May 15, 2025
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE HAVING A CIRCUIT CARRIER AND POWER MODULE BRIDGE HAVIN...
- Publication number 20250140662
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BUSBAR
- Publication number 20250142710
- Publication date May 1, 2025
- Analog Devices, Inc.
- Hien Minh Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250126717
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Cheolmin Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink Fixing Structure and Heat Dissipation Apparatus
- Publication number 20250125219
- Publication date Apr 17, 2025
- ZTE Corporation
- Weifeng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250120006
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Chul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSELY PACKED ELECTRONIC SYSTEMS
- Publication number 20250120018
- Publication date Apr 10, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANS-INDUCTANCE VOLTAGE REGULATORS AND TRANSFORMER ASSEMBLIES
- Publication number 20250111991
- Publication date Apr 3, 2025
- Infineon Technologies Austria AG
- Luca Peluso
- H01 - BASIC ELECTRIC ELEMENTS

Mechanically attached to another device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Stretchable mounting substrate

Electronic substrate and electronic device

Electronic component module

Module

Low profile SODIMM (small outline dual inline memory module)

Voltage regulator module

Technologies for radio frequency optimized interconnects for a quan...

Radio frequency module and communication device

Array substrate, display panel and display module

Connection element for electrically connecting two circuit carriers

Baffles for electronic circuits immersed in cooling fluid in a tank

Semiconductor storage device including staggered semiconductor memo...

Single circuit board assembly with logic and power components

Methods and apparatus for package with interposers

Light-emitting module with compact converter circuit

Electronic device

High density coil design and process

Electronic component module, sub-module, and method for manufacturi...

Densely packed electronic systems

Stacked electronic structure

Substrate module and power module for transformer

Press-in machine for pressing components into a substrate, in parti...

Substrate frame design for three-dimensional stacked electronic ass...

Capacitor-wire-embedded wiring board

Nitride-based semiconductor module and method for manufacturing the...

Shielding case, circuit board assembly, and electronic device

High current surface mount toroid inductor

Rapid implementation of high-temperature analog interface electronics

Capacitor bank assembly

Mouth guard having internal components for sensing impact forces

Patents Applicationslast 30 patents

PACKAGING ARCHITECTURE FOR A HIGH FREQUENCY ACTIVE ELECTRONICALLY S...

OPTICAL TRANSCEIVER EQUIPPED WITH GROUND VIA

COMPONENT EMBEDDED IN MOLD MATERIAL FOR MITIGATING THICKNESS MISMAT...

PRINTED CIRCUIT BOARD

THERMAL-ENHANCED POWER MODULE WITH SEPARATE HEAT SPREADERS

SMALL FOOTPRINT POWER SWITCH

SEMICONDUCTOR MODULE

POWER SUPPLY UNIT WITH IMPROVED SPACE UTILIZATION AND HEAT DISSIPATION

SEMICONDUCTOR PACKAGE AND METHODS OF FORMATION

CIRCUIT BOARD AND IMAGE FORMING APPARATUS

VIBRATION SENSOR, ELECTRONIC DEVICE AND VIBRATION DETECTION METHOD

MEMORY MODULE AND ELECTRONIC DEVICE ASSEMBLY INCLUDING THE SAME

CHIP ELECTRONIC COMPONENT

SHIELDING CASE, CIRCUIT BOARD ASSEMBLY, AND ELECTRONIC DEVICE

DELIVERY OF POWER TO A CHIP THROUGH A DAUGHTER BOARD USING CONNECTI...

BATTERY CHARGER

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PRINTED CIRCUIT BOARD ASSEMBLY

WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...

SEMICONDUCTOR STORAGE DEVICE

POWER MODULE HAVING A CIRCUIT CARRIER AND POWER MODULE BRIDGE HAVIN...

Component Carrier With Embedded Electronic Switch Components and a...

HEATSINK BUSBAR

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

Heat Sink Fixing Structure and Heat Dissipation Apparatus

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PRINTED CIRCUIT BOARD

DENSELY PACKED ELECTRONIC SYSTEMS

TRANS-INDUCTANCE VOLTAGE REGULATORS AND TRANSFORMER ASSEMBLIES