Mechanically attached to another device

Industry

CPC
H05K2201/105

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/105Mechanically attached to another device

Industries

Patents Grantslast 30 patents

Information Patent Grant
High density coil design and process
- Patent number 12,308,157
- Issue date May 20, 2025
- Hutchinson Technology Incorporated
- John L. Schumann
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic device
- Patent number 12,309,931
- Issue date May 20, 2025
- Innolux Corporation
- Chin-Cheng Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Densely packed electronic systems
- Patent number 12,302,497
- Issue date May 13, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked electronic structure
- Patent number 12,300,424
- Issue date May 13, 2025
- Cyntec Co., Ltd.
- Wenyu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate module and power module for transformer
- Patent number 12,289,835
- Issue date Apr 29, 2025
- LG Innotek Co., Ltd
- Soo San Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-in machine for pressing components into a substrate, in parti...
- Patent number 12,284,768
- Issue date Apr 22, 2025
- ERSA GmbH
- Kevin Friedrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate frame design for three-dimensional stacked electronic ass...
- Patent number 12,278,172
- Issue date Apr 15, 2025
- Applied Materials, Inc.
- Akash Agrawal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitor-wire-embedded wiring board
- Patent number 12,267,962
- Issue date Apr 1, 2025
- Samsung Electronics Co., Ltd.
- Soojae Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielding case, circuit board assembly, and electronic device
- Patent number 12,256,526
- Issue date Mar 18, 2025
- HONOR DEVICE CO., LTD.
- Jiuliang Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Nitride-based semiconductor module and method for manufacturing the...
- Patent number 12,255,169
- Issue date Mar 18, 2025
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Weigang Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current surface mount toroid inductor
- Patent number 12,255,002
- Issue date Mar 18, 2025
- Steering Solutions IP Holding Corporation
- Michael C. Hallman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rapid implementation of high-temperature analog interface electronics
- Patent number 12,256,493
- Issue date Mar 18, 2025
- Ian Getreu
- G01 - MEASURING TESTING
Information Patent Grant
Capacitor bank assembly
- Patent number 12,250,771
- Issue date Mar 11, 2025
- Rockwell Collins, Inc.
- Martin J. Jennings
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mouth guard having internal components for sensing impact forces
- Patent number 12,232,889
- Issue date Feb 25, 2025
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Decoupled PCB structure to parallel power transistors
- Patent number 12,237,760
- Issue date Feb 25, 2025
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Chip-on-film package and display apparatus including the same
- Patent number 12,230,576
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor storage device
- Patent number 12,232,265
- Issue date Feb 18, 2025
- Kioxia Corporation
- Koji Ueno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Assembly structure
- Patent number 12,232,288
- Issue date Feb 18, 2025
- Delta Electronics, Inc.
- Haoyi Ye
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electro-optical device and electronic apparatus
- Patent number 12,222,614
- Issue date Feb 11, 2025
- Seiko Epson Corporation
- Shinsuke Fujikawa
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and power module
- Patent number 12,217,899
- Issue date Feb 4, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board and electronic device
- Patent number 12,219,712
- Issue date Feb 4, 2025
- Canon Kabushiki Kaisha
- Noritake Tsuboi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mouth guard having low-profile printed circuit board for sensing an...
- Patent number 12,213,805
- Issue date Feb 4, 2025
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Battery module printed circuit board assembly system and method
- Patent number 12,208,694
- Issue date Jan 28, 2025
- CPS Technology Holdings LLC
- Ronald J. Dulle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 12,211,821
- Issue date Jan 28, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Battery charger including an isolating member
- Patent number 12,212,169
- Issue date Jan 28, 2025
- Milwaukee Electric Tool Corporation
- Wyatt R. Silha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform supports the shortest electrical connection between two QS...
- Patent number 12,207,403
- Issue date Jan 21, 2025
- Shuang Jin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductors including electrically conductive standoffs
- Patent number 12,198,844
- Issue date Jan 14, 2025
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating unit for circuit board
- Patent number 12,200,856
- Issue date Jan 14, 2025
- HARTING Electric Stiftung & Co. KG
- Norbert Kropiewnicki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED CIRCUIT BOARD ASSEMBLY
- Publication number 20250159810
- Publication date May 15, 2025
- ROLLS-ROYCE DEUTSCHLAND LTD & CO KG
- Uwe WALTRICH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...
- Publication number 20250159795
- Publication date May 15, 2025
- AGC Inc.
- Kenji FUJITA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE
- Publication number 20250159811
- Publication date May 15, 2025
- KIOXIA Corporation
- Koji UENO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER MODULE HAVING A CIRCUIT CARRIER AND POWER MODULE BRIDGE HAVIN...
- Publication number 20250140662
- Publication date May 1, 2025
- ROBERT BOSCH GmbH
- Irfan AYDOGMUS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component Carrier With Embedded Electronic Switch Components and a...
- Publication number 20250142713
- Publication date May 1, 2025
- AT&S Austria Technologie & Systemtechnik AG
- Gerald WEIS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEATSINK BUSBAR
- Publication number 20250142710
- Publication date May 1, 2025
- Analog Devices, Inc.
- Hien Minh Pham
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE
- Publication number 20250126717
- Publication date Apr 17, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Cheolmin Shin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink Fixing Structure and Heat Dissipation Apparatus
- Publication number 20250125219
- Publication date Apr 17, 2025
- ZTE Corporation
- Weifeng ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20250118705
- Publication date Apr 10, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250120006
- Publication date Apr 10, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Chul CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSELY PACKED ELECTRONIC SYSTEMS
- Publication number 20250120018
- Publication date Apr 10, 2025
- Peter C. Salmon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANS-INDUCTANCE VOLTAGE REGULATORS AND TRANSFORMER ASSEMBLIES
- Publication number 20250111991
- Publication date Apr 3, 2025
- Infineon Technologies Austria AG
- Luca Peluso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND SEMICONDUCTOR DEVICE
- Publication number 20250113438
- Publication date Apr 3, 2025
- Shinko Electric Industries Co., Ltd.
- Tomoyuki SHIMODAIRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE
- Publication number 20250113454
- Publication date Apr 3, 2025
- DELTA ELECTRONICS,INC.
- Haoyi YE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...
- Publication number 20250106998
- Publication date Mar 27, 2025
- Canon Kabushiki Kaisha
- TAKASHI NUMAGI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY
- Publication number 20250107003
- Publication date Mar 27, 2025
- Intel Corporation
- Chin Mian Choong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF POWER MODULE
- Publication number 20250104902
- Publication date Mar 27, 2025
- Delta Electronics, Inc.
- Yahong Xiong
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
INDUCTORS INCLUDING ELECTRICALLY CONDUCTIVE STANDOFFS
- Publication number 20250095904
- Publication date Mar 20, 2025
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT
- Publication number 20250098068
- Publication date Mar 20, 2025
- KIOXIA Corporation
- Kiyohito NISHIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STORAGE DEVICE
- Publication number 20250089170
- Publication date Mar 13, 2025
- Samsung Electronics Co., Ltd.
- Suin KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED COIL MODULE
- Publication number 20250071904
- Publication date Feb 27, 2025
- TAI-TECH ADVANCED ELECTRONICS CO., LTD.
- Ming-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF
- Publication number 20250071893
- Publication date Feb 27, 2025
- AMOSENSE CO., LTD.
- Jihyung LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...
- Publication number 20250062592
- Publication date Feb 20, 2025
- PRIMAX ELECTRONICS LTD.
- CHING-HUI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250063666
- Publication date Feb 20, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Dae Jung BYUN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Converter Package with Integrated Inductor
- Publication number 20250046684
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL CONTROL BOARD, AIR CONDITIONER OUTDOOR UNIT, AND AIR CON...
- Publication number 20250043967
- Publication date Feb 6, 2025
- GD MIDEA AIR-CONDITIONING EQUIPMENT CO., LTD.
- Zhiguo SHANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE WITH THE SAME
- Publication number 20250048555
- Publication date Feb 6, 2025
- Delta Electronics, Inc.
- Hung-Wen CHUEH
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD FOR AN AUTOMATION FIELD DEVICE
- Publication number 20250048578
- Publication date Feb 6, 2025
- Endress+Hauser SE+Co. KG
- Christian Strittmatter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20250048553
- Publication date Feb 6, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Tae Hong MIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND DYNAMIC BRAKE CIRCUIT COMPRISING SAME
- Publication number 20250040052
- Publication date Jan 30, 2025
- FANUC CORPORATION
- Shunta HAGA
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Mechanically attached to another device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

High density coil design and process

Electronic device

Electronic component module, sub-module, and method for manufacturi...

Densely packed electronic systems

Stacked electronic structure

Substrate module and power module for transformer

Press-in machine for pressing components into a substrate, in parti...

Substrate frame design for three-dimensional stacked electronic ass...

Capacitor-wire-embedded wiring board

Shielding case, circuit board assembly, and electronic device

Nitride-based semiconductor module and method for manufacturing the...

High current surface mount toroid inductor

Rapid implementation of high-temperature analog interface electronics

Capacitor bank assembly

Mouth guard having internal components for sensing impact forces

Decoupled PCB structure to parallel power transistors

Chip-on-film package and display apparatus including the same

Semiconductor storage device

Assembly structure

Electro-optical device and electronic apparatus

Apparatus and power module

Printed circuit board and electronic device

Mouth guard having low-profile printed circuit board for sensing an...

Battery module printed circuit board assembly system and method

Package-on-package assembly with wire bond vias

Battery charger including an isolating member

Platform supports the shortest electrical connection between two QS...

Inductors including electrically conductive standoffs

Insulating unit for circuit board

Module

Patents Applicationslast 30 patents

PRINTED CIRCUIT BOARD ASSEMBLY

WIRING-ATTACHED ADHESIVE SUBSTRATE, STACKED DEVICE, GLASS STACKED B...

SEMICONDUCTOR STORAGE DEVICE

POWER MODULE HAVING A CIRCUIT CARRIER AND POWER MODULE BRIDGE HAVIN...

Component Carrier With Embedded Electronic Switch Components and a...

HEATSINK BUSBAR

CIRCUIT BOARD AND ELECTRONIC COMPONENT PACKAGE

Heat Sink Fixing Structure and Heat Dissipation Apparatus

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

PRINTED CIRCUIT BOARD

DENSELY PACKED ELECTRONIC SYSTEMS

TRANS-INDUCTANCE VOLTAGE REGULATORS AND TRANSFORMER ASSEMBLIES

WIRING BOARD AND SEMICONDUCTOR DEVICE

ASSEMBLY STRUCTURE

PRINTED WIRING BOARD, PRINTED CIRCUIT BOARD, ELECTRONIC EQUIPMENT,...

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

MANUFACTURING METHOD OF POWER MODULE

INDUCTORS INCLUDING ELECTRICALLY CONDUCTIVE STANDOFFS

SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE UNIT

STORAGE DEVICE

INTEGRATED COIL MODULE

CERAMIC SUBSTRATE UNIT AND MANUFACTURING METHOD THEREOF

OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE...

PRINTED CIRCUIT BOARD

Converter Package with Integrated Inductor

ELECTRICAL CONTROL BOARD, AIR CONDITIONER OUTDOOR UNIT, AND AIR CON...

CIRCUIT BOARD MODULE AND ELECTRONIC DEVICE WITH THE SAME

PRINTED CIRCUIT BOARD FOR AN AUTOMATION FIELD DEVICE

PRINTED CIRCUIT BOARD

PRINTED CIRCUIT BOARD AND DYNAMIC BRAKE CIRCUIT COMPRISING SAME