Mechanically attached to another device

Industry

CPC
H05K2201/105

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/105Mechanically attached to another device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Inductors including electrically conductive standoffs
- Patent number 12,198,844
- Issue date Jan 14, 2025
- Maxim Integrated Products, Inc.
- Alexandr Ikriannikov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating unit for circuit board
- Patent number 12,200,856
- Issue date Jan 14, 2025
- HARTING Electric Stiftung & Co. KG
- Norbert Kropiewnicki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,193,162
- Issue date Jan 7, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Separable interface cable structure for high voltage under-module p...
- Patent number 12,183,999
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Xin Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and light-emitting device
- Patent number 12,185,468
- Issue date Dec 31, 2024
- Nichia Corporation
- Soichiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit device, electrical drive device and motor vehicle
- Patent number 12,185,504
- Issue date Dec 31, 2024
- Audi AG
- Daniel Ruppert
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Module
- Patent number 12,177,982
- Issue date Dec 24, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plug-in connector device and method for producing a plug-in connect...
- Patent number 12,170,415
- Issue date Dec 17, 2024
- Vitesco Technologies GmbH
- Gregory Drew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Storage system
- Patent number 12,166,320
- Issue date Dec 10, 2024
- Kioxia Corporation
- Kazuyuki Matsuzaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 12,160,947
- Issue date Dec 3, 2024
- Murata Manufacturing Co., Ltd.
- Tadashi Nomura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Motor fan and guard for directing coolant air
- Patent number 12,160,158
- Issue date Dec 3, 2024
- Nidec Motor Corporation
- Richard L. Eason
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with single rank memory configuration using p...
- Patent number 12,154,891
- Issue date Nov 26, 2024
- GM CRUISE HOLDINGS LLC
- Ajith Sreenilayam
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Chip packaged battery
- Patent number 12,156,338
- Issue date Nov 26, 2024
- The Johns Hopkins University
- Konstantinos Gerasopoulos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and configuration for stacking multiple printed circuit boards
- Patent number 12,156,333
- Issue date Nov 26, 2024
- Mellanox Technologies, Ltd.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board and display device including the same
- Patent number 12,130,979
- Issue date Oct 29, 2024
- Samsung Display Co., Ltd.
- Min-Hong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic shelf label and method for assembling the same
- Patent number 12,131,670
- Issue date Oct 29, 2024
- BOE Technology Group Co., Ltd.
- Xinxin Yang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Heatsink clamp for multiple electronic components
- Patent number 12,127,378
- Issue date Oct 22, 2024
- Nidec Motor Corporation
- James L. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible jumper with a mounting frame
- Patent number 12,120,821
- Issue date Oct 15, 2024
- Ennovi Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mouth guard having user-notification feature of impact force
- Patent number 12,109,045
- Issue date Oct 8, 2024
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,108,563
- Issue date Oct 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate module or light emitting module
- Patent number 12,096,560
- Issue date Sep 17, 2024
- Nichia Corporation
- Kazuma Kozuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and memory system
- Patent number 12,082,340
- Issue date Sep 3, 2024
- Kioxia Corporation
- Yuta Tsubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 12,068,552
- Issue date Aug 20, 2024
- Hitachi Astemo, Ltd.
- Shinya Kawakita
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE
- Publication number 20250018798
- Publication date Jan 16, 2025
- CPS Technology Holdings LLC
- Matthew R. TYLER
- B60 - VEHICLES IN GENERAL
Information Patent Application
ELECTRONIC SUBASSEMBLY WITH IMPROVED MOUNTING OF A HEAT SINK
- Publication number 20250024583
- Publication date Jan 16, 2025
- SIEMENS AKTIENGESELLSCHAFT
- Peter Sturm
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS
- Publication number 20250024606
- Publication date Jan 16, 2025
- MELLANOX TECHNOLOGIES, LTD.
- Xiuzhuang Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEARING DEVICE, ELECTRONIC CIRCUIT, ELECTRONIC CIRCUIT BOARD, AND R...
- Publication number 20250016511
- Publication date Jan 9, 2025
- GN Hearing A/S
- Ragna Fanney HLÍFARSDÓTTIR
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DEFLECTION SPRING COMPRESSION MOUNTING
- Publication number 20250008661
- Publication date Jan 2, 2025
- Intel Corporation
- Arturo Navarro Alvarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...
- Publication number 20240431032
- Publication date Dec 26, 2024
- APAQ TECHNOLOGY CO., LTD.
- CHING-FENG LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE
- Publication number 20240422949
- Publication date Dec 19, 2024
- Delta Electronics, Inc.
- Po-Chen WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MODULE OR LIGHT EMITTING MODULE
- Publication number 20240414846
- Publication date Dec 12, 2024
- Nichia Corporation.
- Kazuma KOZURU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-BOARD CHARGER
- Publication number 20240407081
- Publication date Dec 5, 2024
- DELTA ELECTRONICS (SHANGHAI) CO., LTD.
- Suhua Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20240387496
- Publication date Nov 21, 2024
- 1372934 B.C. Ltd.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240389228
- Publication date Nov 21, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
- Publication number 20240389244
- Publication date Nov 21, 2024
- Darwin Precisions Corporation
- Keng-Kuei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...
- Publication number 20240388019
- Publication date Nov 21, 2024
- HARTING ELECTRONICS GMBH
- Markus FRIESEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED CABLE SOLUTION
- Publication number 20240364062
- Publication date Oct 31, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Ku-Hsu Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEY MODULE AND KEYBOARD
- Publication number 20240355557
- Publication date Oct 24, 2024
- WISTRON CORP.
- SHIH TING TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MODULE
- Publication number 20240357746
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assembly
- Publication number 20240347939
- Publication date Oct 17, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240324689
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- G01 - MEASURING TESTING
Information Patent Application
MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
- Publication number 20240334591
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN DATA STORAGE DEVICE
- Publication number 20240324136
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20240321483
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jaehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS
- Publication number 20240305184
- Publication date Sep 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Multicomponent Connector
- Publication number 20240292540
- Publication date Aug 29, 2024
- KYOCERA AVX Components Corporation
- Ronald Demcko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
- Publication number 20240292541
- Publication date Aug 29, 2024
- Black & Decker Inc.
- Joshua M. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Assembly and Electronic Device
- Publication number 20240292581
- Publication date Aug 29, 2024
- Honor Device Co., Ltd.
- Jianqiang Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS

Mechanically attached to another device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Inductors including electrically conductive standoffs

Insulating unit for circuit board

Module

Separable interface cable structure for high voltage under-module p...

Wiring board and light-emitting device

Electrical circuit device, electrical drive device and motor vehicle

Module

Plug-in connector device and method for producing a plug-in connect...

Storage system

Electronic module

Motor fan and guard for directing coolant air

Printed circuit board with single rank memory configuration using p...

Chip packaged battery

Method and configuration for stacking multiple printed circuit boards

Bus bar link for battery cell interconnections in a battery module

Circuit board and display device including the same

Electronic shelf label and method for assembling the same

Heatsink clamp for multiple electronic components

Press-fit power module and related methods

Flexible jumper with a mounting frame

Multilayer capacitor and circuit board containing the same

Mouth guard having user-notification feature of impact force

Power electronics assemblies having embedded power electronics devices

Reciprocal PCB manufacturing process

Substrate module or light emitting module

Semiconductor device, printed circuit board (PCB), and method of in...

Semiconductor device and memory system

Multi-level printed circuit boards and memory modules including the...

Electromagnetic wave transmission board comprising an inner board w...

Circuit board assembly

Patents Applicationslast 30 patents

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

ELECTRONIC SUBASSEMBLY WITH IMPROVED MOUNTING OF A HEAT SINK

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

HEARING DEVICE, ELECTRONIC CIRCUIT, ELECTRONIC CIRCUIT BOARD, AND R...

DEFLECTION SPRING COMPRESSION MOUNTING

LATERALLY PLACED CAPACITOR PACKAGE ASSEMBLY AND ASSEMBLY METHOD THE...

HEAT DISSIPATION STRUCTURE OF ELECTRONIC DEVICE

SUBSTRATE MODULE OR LIGHT EMITTING MODULE

ON-BOARD CHARGER

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

ELECTRONIC CONTROL DEVICE

ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

OPTIMIZED CABLE SOLUTION

KEY MODULE AND KEYBOARD

HIGH CAPACITANCE MODULE

Electronic Assembly

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

ELECTRONIC CIGARETTE

MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

THERMAL MANAGEMENT IN DATA STORAGE DEVICE

WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS

Multicomponent Connector

ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...

Circuit Board Assembly and Electronic Device

Pluggable CPU Modules with Vertical Power