Mechanically attached to another device

Industry

CPC
H05K2201/105

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00

Current Industry

H05K2201/105Mechanically attached to another device

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bus bar link for battery cell interconnections in a battery module
- Patent number 12,134,323
- Issue date Nov 5, 2024
- CPS Technology Holdings LLC
- Matthew R. Tyler
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Circuit board and display device including the same
- Patent number 12,130,979
- Issue date Oct 29, 2024
- Samsung Display Co., Ltd.
- Min-Hong Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic shelf label and method for assembling the same
- Patent number 12,131,670
- Issue date Oct 29, 2024
- BOE Technology Group Co., Ltd.
- Xinxin Yang
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Heatsink clamp for multiple electronic components
- Patent number 12,127,378
- Issue date Oct 22, 2024
- Nidec Motor Corporation
- James L. Skinner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Press-fit power module and related methods
- Patent number 12,119,576
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jie Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible jumper with a mounting frame
- Patent number 12,120,821
- Issue date Oct 15, 2024
- Ennovi Industries, Inc.
- Richard Schneider
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer capacitor and circuit board containing the same
- Patent number 12,112,891
- Issue date Oct 8, 2024
- KYOCERA AVX Components Corporation
- Jeffrey Cain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mouth guard having user-notification feature of impact force
- Patent number 12,109,045
- Issue date Oct 8, 2024
- Force Impact Technologies, Inc.
- Anthony M. Gonzales
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power electronics assemblies having embedded power electronics devices
- Patent number 12,108,563
- Issue date Oct 1, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reciprocal PCB manufacturing process
- Patent number 12,096,566
- Issue date Sep 17, 2024
- Intel Corporation
- Tyler Leuten
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate module or light emitting module
- Patent number 12,096,560
- Issue date Sep 17, 2024
- Nichia Corporation
- Kazuma Kozuru
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and memory system
- Patent number 12,082,340
- Issue date Sep 3, 2024
- Kioxia Corporation
- Yuta Tsubouchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, printed circuit board (PCB), and method of in...
- Patent number 12,080,634
- Issue date Sep 3, 2024
- The Noco Company
- James P. McBride
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level printed circuit boards and memory modules including the...
- Patent number 12,075,560
- Issue date Aug 27, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic wave transmission board comprising an inner board w...
- Patent number 12,074,357
- Issue date Aug 27, 2024
- BOARDTEK ELECTRONICS CORPORATION
- Chung-Hsing Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board assembly
- Patent number 12,068,552
- Issue date Aug 20, 2024
- Hitachi Astemo, Ltd.
- Shinya Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structural and thermal management of an integrated circuit
- Patent number 12,046,534
- Issue date Jul 23, 2024
- Apple Inc.
- Simon J. Trivett
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Camera module and array camera module based on integral packaging t...
- Patent number 12,035,029
- Issue date Jul 9, 2024
- NINGBO SUNNY OPOTECH CO., LTD.
- Mingzhu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for assembling processor systems
- Patent number 12,033,996
- Issue date Jul 9, 2024
- 1372934 B.C. LTD
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable via package and method
- Patent number 12,035,472
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Ptd. Ltd.
- Akito Yoshida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting structure for inductors
- Patent number 12,035,460
- Issue date Jul 9, 2024
- Murata Manufacturing Co., Ltd.
- Tarou Higuchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device
- Patent number 12,027,444
- Issue date Jul 2, 2024
- Lenovo (Singapore) Pte. Ltd.
- Seiji Yamasaki
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical assembly with a temperature monitoring device
- Patent number 12,028,961
- Issue date Jul 2, 2024
- PHOENIX CONTACT E-MOBILITY GMBH
- Thomas Fuehrer
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor module and semiconductor device
- Patent number 12,027,492
- Issue date Jul 2, 2024
- AISIN CORPORATION
- Takanobu Naruse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ambient temperature sensor which may be coupled to a printed circui...
- Patent number 12,025,506
- Issue date Jul 2, 2024
- STMicroelectronics S.r.l.
- Massimiliano Pesaturo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Switched capacitor converter package structure and method
- Patent number 12,028,980
- Issue date Jul 2, 2024
- Halo Microelectronics International
- Rui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip module
- Patent number 12,022,619
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Jong-Hyun Seok
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module
- Patent number 12,021,323
- Issue date Jun 25, 2024
- Fuji Electric Co., Ltd.
- Mayumi Shiohara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Using a thermoelectric component to improve memory sub-system perfo...
- Patent number 12,013,734
- Issue date Jun 18, 2024
- Micron Technology, Inc.
- Michael R. Spica
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS
- Publication number 20240387496
- Publication date Nov 21, 2024
- 1372934 B.C. Ltd.
- Kelly T. R. Boothby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONTROL DEVICE
- Publication number 20240389228
- Publication date Nov 21, 2024
- Hitachi Astemo, Ltd.
- Akira ISHII
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE
- Publication number 20240389244
- Publication date Nov 21, 2024
- Darwin Precisions Corporation
- Keng-Kuei Liang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...
- Publication number 20240388019
- Publication date Nov 21, 2024
- HARTING ELECTRONICS GMBH
- Markus FRIESEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...
- Publication number 20240365464
- Publication date Oct 31, 2024
- Canon Kabushiki Kaisha
- HIROYUKI YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMIZED CABLE SOLUTION
- Publication number 20240364062
- Publication date Oct 31, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- Ku-Hsu Nien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
KEY MODULE AND KEYBOARD
- Publication number 20240355557
- Publication date Oct 24, 2024
- WISTRON CORP.
- SHIH TING TING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITANCE MODULE
- Publication number 20240357746
- Publication date Oct 24, 2024
- INNODISK CORPORATION
- CHIH-CHIEH KAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assembly
- Publication number 20240347939
- Publication date Oct 17, 2024
- TE Connectivity Solutions GMBH
- Wei (David) Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS
- Publication number 20240334588
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Jichul KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC CIGARETTE
- Publication number 20240324689
- Publication date Oct 3, 2024
- AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO., LTD
- Jinyang Li
- G01 - MEASURING TESTING
Information Patent Application
MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS
- Publication number 20240334591
- Publication date Oct 3, 2024
- Murata Manufacturing Co., Ltd.
- Takeshi FURUKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD
- Publication number 20240321762
- Publication date Sep 26, 2024
- Intel Corporation
- Mihir K. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT IN DATA STORAGE DEVICE
- Publication number 20240324136
- Publication date Sep 26, 2024
- Western Digital Technologies, Inc.
- Tew Wei Hong
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...
- Publication number 20240321483
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Jaehoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE
- Publication number 20240306304
- Publication date Sep 12, 2024
- HYUNDAI MOBIS CO., LTD.
- Chan Yang CHOE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS
- Publication number 20240305184
- Publication date Sep 12, 2024
- SCHNEIDER ELECTRIC IT CORPORATION
- Indra Prakash
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Multicomponent Connector
- Publication number 20240292540
- Publication date Aug 29, 2024
- KYOCERA AVX Components Corporation
- Ronald Demcko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...
- Publication number 20240292541
- Publication date Aug 29, 2024
- Black & Decker Inc.
- Joshua M. Lewis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Board Assembly and Electronic Device
- Publication number 20240292581
- Publication date Aug 29, 2024
- Honor Device Co., Ltd.
- Jianqiang Guo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Pluggable CPU Modules with Vertical Power
- Publication number 20240290763
- Publication date Aug 29, 2024
- Google LLC
- Houle Gan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Battery Connector
- Publication number 20240283179
- Publication date Aug 22, 2024
- Google LLC
- David Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...
- Publication number 20240266300
- Publication date Aug 8, 2024
- INFINEON TECHNOLOGIES AG
- Marco Bäßler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD ARRANGEMENT
- Publication number 20240268028
- Publication date Aug 8, 2024
- HARTING ELECTRONICS GMBH
- Marc GENAU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRESS APPARATUS AND PRESSING METHOD THEREOF
- Publication number 20240268035
- Publication date Aug 8, 2024
- SAMSUNG DISPLAY CO., LTD.
- Jae Uk CHO
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
EMBEDDED DUAL IN-LINE MEMORY MODULE
- Publication number 20240260195
- Publication date Aug 1, 2024
- Walton Advanced Engineering, Inc
- HONG-CHI YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION
- Publication number 20240260237
- Publication date Aug 1, 2024
- Western Digital Technologies, Inc.
- Wei Hong Tew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLING CAPACITOR BOOSTER MODULE
- Publication number 20240260193
- Publication date Aug 1, 2024
- Intel Corporation
- Herh Nan Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DISPLAY DEVICE
- Publication number 20240260192
- Publication date Aug 1, 2024
- SAMSUNG DISPLAY CO., LTD.
- KYUNG-MOK LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING MODULE WITH COMPACT CONVERTER CIRCUIT
- Publication number 20240255132
- Publication date Aug 1, 2024
- Valeo Vision
- Alexandre VAL
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Mechanically attached to another device

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bus bar link for battery cell interconnections in a battery module

Circuit board and display device including the same

Electronic shelf label and method for assembling the same

Heatsink clamp for multiple electronic components

Press-fit power module and related methods

Flexible jumper with a mounting frame

Multilayer capacitor and circuit board containing the same

Mouth guard having user-notification feature of impact force

Power electronics assemblies having embedded power electronics devices

Reciprocal PCB manufacturing process

Substrate module or light emitting module

Semiconductor device and memory system

Semiconductor device, printed circuit board (PCB), and method of in...

Multi-level printed circuit boards and memory modules including the...

Electromagnetic wave transmission board comprising an inner board w...

Circuit board assembly

Structural and thermal management of an integrated circuit

Camera module and array camera module based on integral packaging t...

Systems and methods for assembling processor systems

Stackable via package and method

Mounting structure for inductors

Electronic device

Electrical assembly with a temperature monitoring device

Semiconductor module and semiconductor device

Ambient temperature sensor which may be coupled to a printed circui...

Switched capacitor converter package structure and method

Printed circuit board with stacked passive components

Semiconductor chip module

Semiconductor module

Using a thermoelectric component to improve memory sub-system perfo...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

ELECTRONIC CONTROL DEVICE

ELECTRONIC DEVICE AND METHOD TO PRODUCE ELECTRONIC DEVICE

PRINTED CIRCUIT BOARD UNIT AND PRINTED CIRCUIT BOARD CONNECTION ELE...

CIRCUIT BOARD, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING CIRCU...

OPTIMIZED CABLE SOLUTION

KEY MODULE AND KEYBOARD

HIGH CAPACITANCE MODULE

Electronic Assembly

ELECTRONIC DEVICE COMPRISING PLURALITY OF PRINTED CIRCUIT BOARDS

ELECTRONIC CIGARETTE

MODULE AND SEMICONDUCTOR COMPOSITE APPARATUS

HIGH DENSITY ORGANIC BRIDGE DEVICE AND METHOD

THERMAL MANAGEMENT IN DATA STORAGE DEVICE

WIRE STRUCTURE, WIRE CAPACITOR, AND ELECTRONIC DEVICE INCLUDING THE...

APPARATUS AND METHOD FOR MANUFACTURING POWER MODULE

DECOUPLED PCB STRUCTURE TO PARALLEL POWER TRANSISTORS

Multicomponent Connector

ELECTRONIC SWITCH MODULE WITH OPPOSITELY-ARRANGED POWER SWITCHES AN...

Circuit Board Assembly and Electronic Device

Pluggable CPU Modules with Vertical Power

Battery Connector

POWER SEMICONDUCTOR MODULE WITH VIBRATION DAMPENERS AND POWER ELECT...

PRINTED CIRCUIT BOARD ARRANGEMENT

PRESS APPARATUS AND PRESSING METHOD THEREOF

EMBEDDED DUAL IN-LINE MEMORY MODULE

SEMICONDUCTOR STORAGE DEVICE INCLUDING PCB EDGE HEAT DISSIPATION

DECOUPLING CAPACITOR BOOSTER MODULE

DISPLAY DEVICE

LIGHT-EMITTING MODULE WITH COMPACT CONVERTER CIRCUIT