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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L2924/00
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Patents Grants
last 30 patents
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Patent Grant
Packaged integrated circuit devices with through-body conductive vi...
Patent number
12,087,738
Issue date
Sep 10, 2024
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor die contact structure and method
Patent number
12,074,127
Issue date
Aug 27, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and inspection device
Patent number
12,040,303
Issue date
Jul 16, 2024
Kabushiki Kaisha Toshiba
Mitsuaki Kato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and electronic device
Patent number
12,033,922
Issue date
Jul 9, 2024
Denso Corporation
Akihiro Fukatsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal interface material, an integrated circuit formed therewith,...
Patent number
12,027,442
Issue date
Jul 2, 2024
ARIECA INC.
Jeffrey Gelorme
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Impedance controlled electrical interconnection employing meta-mate...
Patent number
12,027,465
Issue date
Jul 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures for low temperature bonding using nanoparticles
Patent number
12,027,487
Issue date
Jul 2, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
Patent number
RE49987
Issue date
May 28, 2024
Invensas LLC
Cyprian Emeka Uzoh
Information
Patent Grant
Manufacturing method and electronic module with new routing possibi...
Patent number
RE49970
Issue date
May 14, 2024
IMBERATEK, LLC
Antti Kivikero
Information
Patent Grant
Methods for low temperature bonding using nanoparticles
Patent number
11,973,056
Issue date
Apr 30, 2024
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,967,570
Issue date
Apr 23, 2024
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having electrode pads arranged between groups...
Patent number
11,901,251
Issue date
Feb 13, 2024
Rohm Co., Ltd.
Kunihiro Komiya
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for manufacturing a chip-card module with soldered electron...
Patent number
11,894,295
Issue date
Feb 6, 2024
Linxens Holding
Christophe Mathieu
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor components having conductive vias with aligned back s...
Patent number
11,869,809
Issue date
Jan 9, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming a semiconductor device having TSV formed through...
Patent number
11,854,990
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hsien-Pin Hu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with sealed semiconductor chip
Patent number
11,854,946
Issue date
Dec 26, 2023
Kioxia Corporation
Isao Ozawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder material and method for die attachment
Patent number
11,842,974
Issue date
Dec 12, 2023
Alpha Assembly Solutions Inc.
Angelo Gulino
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Package-on-package assembly with wire bonds to encapsulation surface
Patent number
11,830,845
Issue date
Nov 28, 2023
TESSERA LLC
Hiroaki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
BGA STIM package architecture for high performance systems
Patent number
11,817,364
Issue date
Nov 14, 2023
Intel Corporation
Rajasekaran Swaminathan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Silicon interposer sandwich structure for ESD, EMC, and EMC shieldi...
Patent number
11,810,893
Issue date
Nov 7, 2023
International Business Machines Corporation
William Emmett Bernier
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Light emitting diode package and method for fabricating same
Patent number
11,791,442
Issue date
Oct 17, 2023
CreeLED, Inc.
Bernd Keller
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Diffusion soldering preform with varying surface profile
Patent number
11,764,185
Issue date
Sep 19, 2023
Infineon Technologies Austria AG
Kirill Trunov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of room temperature covalent bonding
Patent number
11,760,059
Issue date
Sep 19, 2023
ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Qin-Yi Tong
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Semiconductor memory device structure
Patent number
11,742,307
Issue date
Aug 29, 2023
OVONYX MEMORY TECHNOLOGY, LLC
John Moore
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Shielded fan-out packaged semiconductor device and method of manufa...
Patent number
11,742,252
Issue date
Aug 29, 2023
Micron Technology, Inc.
Fumitomo Watanabe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method for production of semiconductor device
Patent number
11,715,752
Issue date
Aug 1, 2023
Sony Group Corporation
Atsushi Okuyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for manufacturing an electronic module and electronic module
Patent number
11,716,816
Issue date
Aug 1, 2023
IMBERATEK, LLC
Antti Iihola
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Structures and methods for low temperature bonding using nanoparticles
Patent number
11,710,718
Issue date
Jul 25, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having improved thermal interface between sem...
Patent number
11,705,413
Issue date
Jul 18, 2023
Mediatek Inc.
Chia-Hao Hsu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for attachment and devices produced using the methods
Patent number
11,699,632
Issue date
Jul 11, 2023
Alpha Assembly Solutions Inc.
Monnir Boureghda
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20240282744
Publication date
Aug 22, 2024
Fuji Electric Co., Ltd.
Takafumi YAMADA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND POWER CONVERTING DEVICE
Publication number
20240274557
Publication date
Aug 15, 2024
Mitsubishi Electric Corporation
Yo TANAKA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF MANUFACTURE OF A THERMAL INTERFACE MATERIAL, A THERMAL IN...
Publication number
20240243033
Publication date
Jul 18, 2024
Arieca Inc.
Navid Kazem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240234228
Publication date
Jul 11, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE
Publication number
20240203930
Publication date
Jun 20, 2024
Adeia Semiconductor Solutions LLC
Hiroaki Sato
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
Publication number
20240203754
Publication date
Jun 20, 2024
Arieca Inc.
Navid Kazem
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR COMPONENTS HAVING CONDUCTIVE VIAS WITH ALIGNED BACK S...
Publication number
20240145305
Publication date
May 2, 2024
Micron Technology, Inc.
Jin Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
Publication number
20240145420
Publication date
May 2, 2024
Intel Corporation
Bok Eng CHEAH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING ELECTRODE PADS ARRANGED BETWEEN GROUPS...
Publication number
20240136241
Publication date
Apr 25, 2024
Rohm Co., Ltd.
Kunihiro KOMIYA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Two-In-One Lead Frame Package
Publication number
20240071878
Publication date
Feb 29, 2024
Littelfuse Semiconductor (Wuxi) Co., Ltd
Lei Shi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
Publication number
20240065002
Publication date
Feb 22, 2024
Samsung Electronics Co., Ltd.
Dongkyu Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BGA STIM PACKAGE ARCHITECTURE FOR HIGH PERFORMANCE SYSTEMS
Publication number
20240030086
Publication date
Jan 25, 2024
Intel Corporation
Rajasekaran SWAMINATHAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STRUCTURES FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230335531
Publication date
Oct 19, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Superconducting Bump Bonds for Quantum Computing Systems
Publication number
20230207507
Publication date
Jun 29, 2023
Google LLC
Zhimin Jamie Yao
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
PACKAGED INTEGRATED CIRCUIT DEVICES WITH THROUGH-BODY CONDUCTIVE VI...
Publication number
20230197690
Publication date
Jun 22, 2023
Micron Technology, Inc.
Tongbi Jiang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT S...
Publication number
20230197679
Publication date
Jun 22, 2023
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME
Publication number
20230187275
Publication date
Jun 15, 2023
RENESAS ELECTRONICS CORPORATION
Katsuhiko HOTTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR LOW TEMPERATURE BONDING USING NANOPARTICLES
Publication number
20230132060
Publication date
Apr 27, 2023
ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Cyprian Emeka Uzoh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
Publication number
20230130092
Publication date
Apr 27, 2023
Infineon Technologies Austria AG
Alexander Heinrich
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20230111343
Publication date
Apr 13, 2023
Samsung Electronics Co., Ltd.
Choong Bin YIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Die Contact Structure and Method
Publication number
20230085696
Publication date
Mar 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chung-Shi Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
Publication number
20230060577
Publication date
Mar 2, 2023
Showa Denko Materials Co., Ltd.
Kunihiko AKAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIFFUSION SOLDERING PREFORM WITH VARYING SURFACE PROFILE
Publication number
20230065738
Publication date
Mar 2, 2023
Kirill Trunov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
Publication number
20230031099
Publication date
Feb 2, 2023
ADVANCED MICRO DEVICES, INC.
BRYAN BLACK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Impedance Controlled Electrical Interconnection Employing Meta-Mate...
Publication number
20230020310
Publication date
Jan 19, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Christopher Wyland
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20230005866
Publication date
Jan 5, 2023
CHANGXIN MEMORY TECHNOLOGIES, INC
Ling-Yi Chuang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HEAT INSULATING INTERCONNECT FEATURES IN A COMPONENT OF A COMPOSITE...
Publication number
20220415853
Publication date
Dec 29, 2022
Intel Corporation
Aleksandar Aleksov
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Producing Power Semiconductor Module and Power Semicondu...
Publication number
20220406679
Publication date
Dec 22, 2022
Huawei Digital Power Technologies Co., Ltd.
Ruoyang Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
Publication number
20220352053
Publication date
Nov 3, 2022
KIOXIA Corporation
Isao OZAWA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC DEVICES WITH THROUGH-SUBSTRATE INTERCONNECTS AND AS...
Publication number
20220336273
Publication date
Oct 20, 2022
Micron Technology, Inc.
Kyle K. Kirby
H01 - BASIC ELECTRIC ELEMENTS