Metallic layers on lead frames

Industry

CPC
H01L23/49582

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/49582Metallic layers on lead frames

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cavities at an interface of an encapsul...
- Patent number 12,224,251
- Issue date Feb 11, 2025
- STMicroelectronics, Inc.
- Ian Harvey Arellano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,211,764
- Issue date Jan 28, 2025
- Mitsubishi Electric Corporation
- Ken Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,211,704
- Issue date Jan 28, 2025
- Siliconix incorporated
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,663
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,183,701
- Issue date Dec 31, 2024
- Rohm Co., Ltd.
- Bungo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,165,960
- Issue date Dec 10, 2024
- Rohm Co., Ltd.
- Hiroaki Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices and corresponding sem...
- Patent number 12,165,880
- Issue date Dec 10, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device including a semiconductor chip
- Patent number 12,154,865
- Issue date Nov 26, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi Kawashiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with nickel-silver pre-plated leadframe
- Patent number 12,154,845
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for a package for a semiconductor device, semiconductor...
- Patent number 12,142,552
- Issue date Nov 12, 2024
- STMicroelectronics S.r.l.
- Fulvio Vittorio Fontana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor devices, corresponding appara...
- Patent number 12,125,803
- Issue date Oct 22, 2024
- STMicroelectronics S.r.l.
- Paolo Crema
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 12,125,774
- Issue date Oct 22, 2024
- Sumitomo Electric Device Innovations, Inc.
- Hisashi Shimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with roughened conductive components
- Patent number 12,119,289
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Yee Gin Tea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe package with pre-applied filler material
- Patent number 12,094,725
- Issue date Sep 17, 2024
- STMicroelectronics, Inc.
- Jefferson Talledo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with different types of semiconductor dies attached to a fl...
- Patent number 12,080,660
- Issue date Sep 3, 2024
- MACOM Technology Solutions Holdings, Inc.
- Xikun Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronics package assemblies and processes for making
- Patent number 12,074,099
- Issue date Aug 27, 2024
- Materion Corporation
- Ramesh Kothandapani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and corresponding method of manufacture
- Patent number 12,068,276
- Issue date Aug 20, 2024
- STMicroelectronics S.R.L.
- Giovanni Graziosi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and related methods
- Patent number 12,062,549
- Issue date Aug 13, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging of a semiconductor device with a plurality of leads
- Patent number 12,046,541
- Issue date Jul 23, 2024
- Rohm Co., Ltd.
- Katsuhiro Iwai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating wirebonded members on package surfaces
- Patent number 12,046,542
- Issue date Jul 23, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,040,301
- Issue date Jul 16, 2024
- Rohm Co., Ltd.
- Katsuhiko Yoshihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with surface contact wire extensions
- Patent number 12,040,260
- Issue date Jul 16, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure having a lead frame and a passive c...
- Patent number 12,033,923
- Issue date Jul 9, 2024
- Advanced Semiconductor Engineering, Inc.
- Chi-Tsung Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package, method of forming a chip package and method of formin...
- Patent number 12,033,972
- Issue date Jul 9, 2024
- Infineon Technologies AG
- Joachim Mahler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device
- Patent number 12,021,012
- Issue date Jun 25, 2024
- Rohm Co., Ltd.
- Kazuki Okuyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,009,333
- Issue date Jun 11, 2024
- Shinko Electric Industries Co., Ltd.
- Satoshi Shiraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a method for manufacturing of a semicondu...
- Patent number 11,990,394
- Issue date May 21, 2024
- Nexperia B.V.
- Kim Ng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD
- Publication number 20250054845
- Publication date Feb 13, 2025
- Shinko Electric Industries Co., Ltd.
- Kentaro Kaneko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER
- Publication number 20250054842
- Publication date Feb 13, 2025
- INFINEON TECHNOLOGIES AG
- Rowel TABAJONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND SEMICONDUCTOR DEVICE
- Publication number 20250054841
- Publication date Feb 13, 2025
- SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC.
- Ikuo NAKASHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH IMMERSION TIN ON FLANK
- Publication number 20250046621
- Publication date Feb 6, 2025
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20250029904
- Publication date Jan 23, 2025
- Samsung Electro-Mechanics Co., Ltd.
- Sijoong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS
- Publication number 20240429134
- Publication date Dec 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Yee Gin TEA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE
- Publication number 20240413120
- Publication date Dec 12, 2024
- STMicroelectronics S.r.l
- Giovanni GRAZIOSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME AND MANUFACTURING METHOD THEREOF
- Publication number 20240404928
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Masahiro NAGATA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ANTI-WHISKER COUNTER MEASURE USING A METHOD FOR MULTIPLE LAYER PLAT...
- Publication number 20240395680
- Publication date Nov 28, 2024
- STMicroelectronics S.r.l
- Paolo CREMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES
- Publication number 20240379509
- Publication date Nov 14, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20240371733
- Publication date Nov 7, 2024
- Ohkuchi Materials Co., Ltd.
- Keiichi Otaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...
- Publication number 20240363504
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Nazila Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND RELATED METHODS
- Publication number 20240355638
- Publication date Oct 24, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yong LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347426
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Katsuhiro IWAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME
- Publication number 20240339382
- Publication date Oct 10, 2024
- TEXAS INSTRUMENTS INCORPORATED
- YOU CHYE HOW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240312883
- Publication date Sep 19, 2024
- Rohm Co., Ltd.
- Kelvin Hadinata WIBOWO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME
- Publication number 20240297103
- Publication date Sep 5, 2024
- ADVANCED ASSEMBLY MATERIALS ANHUI LIMITED
- Ching Leung Lawrence KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Nitride Core-Shell Particle Die-Attach Material
- Publication number 20240282741
- Publication date Aug 22, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...
- Publication number 20240274572
- Publication date Aug 15, 2024
- STMicroelectronics International N.V.
- Jefferson Sismundo TALLEDO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless Die-Attach Process for Semiconductor Packaging
- Publication number 20240274514
- Publication date Aug 15, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS
- Publication number 20240266264
- Publication date Aug 8, 2024
- Semiconductor Components Industries, LLC
- Hui Min LER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR
- Publication number 20240266262
- Publication date Aug 8, 2024
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Feng Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...
- Publication number 20240258210
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Bob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...
- Publication number 20240258217
- Publication date Aug 1, 2024
- Wolfspeed, Inc.
- Afshin Dadvand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT
- Publication number 20240258288
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL COMPONENT
- Publication number 20240243045
- Publication date Jul 18, 2024
- MITSUI HIGH-TEC, INC.
- Kimihiko KUBO
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...
- Publication number 20240222139
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...
- Publication number 20240203839
- Publication date Jun 20, 2024
- Amkor Technology Singapore Holding Pte. Ltd
- Pedro Joel Rivera-Marty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW STRESS ASYMMETRIC DUAL SIDE MODULE
- Publication number 20240203846
- Publication date Jun 20, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Chee Hiong CHEW
- H01 - BASIC ELECTRIC ELEMENTS

Metallic layers on lead frames

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package having side wall plating

Semiconductor device having cavities at an interface of an encapsul...

Semiconductor device and method of manufacturing the same

Semiconductor package having side wall plating

Semiconductor device

Semiconductor device

Semiconductor device

Method of manufacturing semiconductor devices and corresponding sem...

Power semiconductor device including a semiconductor chip

Semiconductor package with nickel-silver pre-plated leadframe

Lead frame for a package for a semiconductor device, semiconductor...

Method of manufacturing semiconductor devices, corresponding appara...

Semiconductor device and method of manufacturing the same

Methods and apparatus for an improved integrated circuit package

Semiconductor packages with roughened conductive components

Leadframe package with pre-applied filler material

Package with different types of semiconductor dies attached to a fl...

Microelectronics package assemblies and processes for making

Semiconductor device and corresponding method of manufacture

Semiconductor packages and related methods

Packaging of a semiconductor device with a plurality of leads

Heat-dissipating wirebonded members on package surfaces

Semiconductor device

Electronic package with surface contact wire extensions

Semiconductor package structure having a lead frame and a passive c...

Chip package, method of forming a chip package and method of formin...

Layer structure with an intermetallic phase layer and a chip packag...

Semiconductor device

Semiconductor device

Semiconductor package and a method for manufacturing of a semicondu...

Patents Applicationslast 30 patents

LEAD FRAME, SEMICONDUCTOR DEVICE, AND LEAD FRAME MANUFACTURING METHOD

PACKAGE WITH CONCAVE WETTABILITY AND/OR METALLIZATION LAYER

PACKAGE AND SEMICONDUCTOR DEVICE

IC PACKAGE WITH IMMERSION TIN ON FLANK

SEMICONDUCTOR FRAME AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGES WITH ROUGHENED CONDUCTIVE COMPONENTS

SEMICONDUCTOR DEVICE AND CORRESPONDING METHOD OF MANUFACTURE

LEAD FRAME AND MANUFACTURING METHOD THEREOF

ANTI-WHISKER COUNTER MEASURE USING A METHOD FOR MULTIPLE LAYER PLAT...

HEAT-DISSIPATING WIREBONDED MEMBERS ON PACKAGE SURFACES

LEAD FRAME

ELECTRONIC DEVICE WITH POST MOLD PLATED NICKEL TUNGSTEN AND TIN BIL...

SEMICONDUCTOR PACKAGES AND RELATED METHODS

SEMICONDUCTOR DEVICE

MOLDED PACKAGE WITH AN INTERCHANGEABLE LEADFRAME

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

LEADFRAME

Metal Nitride Core-Shell Particle Die-Attach Material

POWER LEADFRAME PACKAGE WITH LEAD SIDEWALL SURFACE THAT IS FULLY SO...

Electroless Die-Attach Process for Semiconductor Packaging

SEMICONDUCTOR PACKAGES WITH WETTABLE FLANKS AND RELATED METHODS

CHIP-ON-CHIP POWER CARD HAVING EMBEDDED THERMAL CONDUCTOR

SEMICONDUCTOR PACKAGE SUBSTRATE WITH A SMOOTH GROOVE STRADDLING TOP...

SEMICONDUCTOR DEVICE PACKAGES INCLUDING MULTILAYER STACKS WITH IMPR...

SEMICONDUCTOR DEVICE PACKAGE WITH VERTICALLY STACKED PASSIVE COMPONENT

METAL COMPONENT

MICROELECTRONIC PACKAGE STRUCTURES WITH SOLDER JOINT ASSEMBLIES HAV...

METHOD OF FORMING A PACKAGED SEMICONDUCTOR DEVICE HAVING ENHANCED W...

LOW STRESS ASYMMETRIC DUAL SIDE MODULE