Mirror array

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CPC
H01L2224/0615

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/0615Mirror array

Industries

Patents Grantslast 30 patents

Information Patent Grant
Bonded structures
- Patent number 12,100,684
- Issue date Sep 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and semiconductor module
- Patent number 12,080,664
- Issue date Sep 3, 2024
- NUVOTON TECHNOLOGY CORPORATION JAPAN
- Kouki Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,074,158
- Issue date Aug 27, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Array substrate, light-emitting substrate and display device
- Patent number 12,062,620
- Issue date Aug 13, 2024
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Qin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting device and method of manufacturing the same
- Patent number 12,040,349
- Issue date Jul 16, 2024
- Samsung Electronics Co., Ltd.
- Kiwon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SSD wafer device and method of manufacturing same
- Patent number 12,009,354
- Issue date Jun 11, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer body and method of manufacturing the same
- Patent number 12,002,779
- Issue date Jun 4, 2024
- Murata Manufacturing Co., Ltd.
- Takashi Iwamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,990,455
- Issue date May 21, 2024
- Rohm Co., Ltd.
- Hiroyuki Sakairi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal isolator having enhanced creepage characteristics
- Patent number 11,973,008
- Issue date Apr 30, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and method of mounting integrated circuit using the...
- Patent number 11,967,597
- Issue date Apr 23, 2024
- Samsung Display Co., Ltd.
- Dae Geun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,948,903
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor including a back via stack
- Patent number 11,935,908
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Mihye Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a display panel with multiple pads
- Patent number 11,894,294
- Issue date Feb 6, 2024
- Samsung Display Co., Ltd.
- Hanho Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip semiconductor package
- Patent number 11,848,319
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chia Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump of a semiconductor device and fabricating method th...
- Patent number 11,837,562
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chang-Pin Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for light emitting diode chips
- Patent number 11,817,537
- Issue date Nov 14, 2023
- CreeLED, Inc.
- Michael Check
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of direct bonding semiconductor components
- Patent number 11,810,892
- Issue date Nov 7, 2023
- Imec VZW
- Jaber Derakhshandeh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,810,869
- Issue date Nov 7, 2023
- Renesas Electronics Corporation
- Kazuo Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip, package substrate and electronic assembly
- Patent number 11,735,502
- Issue date Aug 22, 2023
- VIA LABS, INC.
- Sheng-Yuan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,699,698
- Issue date Jul 11, 2023
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 11,688,726
- Issue date Jun 27, 2023
- Kioxia Corporation
- Yasunori Iwashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display device having improved bonding between display panel and en...
- Patent number 11,678,502
- Issue date Jun 13, 2023
- SAMSUNG DISPLAY CO., LTD.
- Hyun A Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structures
- Patent number 11,670,615
- Issue date Jun 6, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Liang Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device
- Patent number 11,626,374
- Issue date Apr 11, 2023
- Renesas Electronics Corporation
- Tatsuaki Tsukuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,616,039
- Issue date Mar 28, 2023
- Samsung Electronics Co., Ltd.
- Sang-Sick Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Driving backplane and display apparatus
- Patent number 11,538,776
- Issue date Dec 27, 2022
- Hefei Xinsheng Optoelectronics Technology Co., Ltd.
- Tianyu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device
- Patent number 11,515,300
- Issue date Nov 29, 2022
- Kioxia Corporation
- Atsushi Oga
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20240387423
- Publication date Nov 21, 2024
- NEXPERIA B.V.
- Vasantha Kumar Vaddagere Nagaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device
- Publication number 20240363622
- Publication date Oct 31, 2024
- Rohm Co., Ltd.
- Naoki Takahashi
- B60 - VEHICLES IN GENERAL
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...
- Publication number 20240355858
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD
- Publication number 20240355765
- Publication date Oct 24, 2024
- OMNIVISION TECHNOLOGIES, INC.
- Takayuki Goto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...
- Publication number 20240348046
- Publication date Oct 17, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Mikito SAKAKIBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240332259
- Publication date Oct 3, 2024
- Rohm Co., Ltd.
- Keiji WADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME
- Publication number 20240332276
- Publication date Oct 3, 2024
- Western Digital Technologies, Inc.
- Ken Funaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
- Publication number 20240315098
- Publication date Sep 19, 2024
- CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bo ZHANG
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240304578
- Publication date Sep 12, 2024
- AUO Corporation
- Woei-Chyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240306303
- Publication date Sep 12, 2024
- Innolux Corporation
- Jen-Hai Chi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES
- Publication number 20240266348
- Publication date Aug 8, 2024
- Wolfspeed, Inc.
- Fabian Radulescu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS
- Publication number 20240258251
- Publication date Aug 1, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Katleen Fajardo TIMBOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240250093
- Publication date Jul 25, 2024
- CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Bin WAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20240251610
- Publication date Jul 25, 2024
- Wuhan China Star Optoelectronics Technology Co., Ltd.
- Shuya DONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVER IC AND DISPLAY DEVICE
- Publication number 20240243083
- Publication date Jul 18, 2024
- Huatao LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-FREQUENCY SEMICONDUCTOR PACKAGE
- Publication number 20240234338
- Publication date Jul 11, 2024
- Mitsubishi Electric Corporation
- Tetsunari SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS
- Publication number 20240234257
- Publication date Jul 11, 2024
- ALLEGRO MICROSYSTEMS, LLC
- Robert A. Briano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...
- Publication number 20240234443
- Publication date Jul 11, 2024
- SAMSUNG DISPLAY CO., LTD.
- Dae Geun LEE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SENSOR PACKAGING METHOD AND SENSOR PACKAGE
- Publication number 20240222308
- Publication date Jul 4, 2024
- PIXART IMAGING Inc.
- SAI-MUN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...
- Publication number 20240213430
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Dongwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING BONDING PAD
- Publication number 20240178169
- Publication date May 30, 2024
- SK HYNIX INC.
- Byung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240164118
- Publication date May 16, 2024
- RENESAS ELECTRONICS CORPORATION
- Kazuaki TSUCHIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY D...
- Publication number 20240164022
- Publication date May 16, 2024
- BOE MLED TECHNOLOGY CO., LTD.
- Jing WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240155892
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Junhyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...
- Publication number 20240153966
- Publication date May 9, 2024
- SAMSUNG DISPLAY CO., LTD.
- Se Hun CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240153898
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Minseung JI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240120354
- Publication date Apr 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Kyong Soon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GALVANIC ISOLATION DEVICE
- Publication number 20240113094
- Publication date Apr 4, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey Alan West
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRIVE CHIP AND DISPLAY PANEL
- Publication number 20240038700
- Publication date Feb 1, 2024
- WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Shuya Dong
- H01 - BASIC ELECTRIC ELEMENTS

Mirror array

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Bonded structures

Semiconductor device and semiconductor module

Semiconductor device

Array substrate, light-emitting substrate and display device

Light emitting device and method of manufacturing the same

Chip package structure

SSD wafer device and method of manufacturing same

Multilayer body and method of manufacturing the same

Semiconductor device

Signal isolator having enhanced creepage characteristics

Array substrate and method of mounting integrated circuit using the...

Semiconductor package

Array substrate, display panel and display device

Image sensor including a back via stack

Display apparatus including a display panel with multiple pads

Multi-chip semiconductor package

Conductive bump of a semiconductor device and fabricating method th...

Interconnects for light emitting diode chips

Method of direct bonding semiconductor components

Semiconductor device and method of manufacturing the same

Integrated circuit chip, package substrate and electronic assembly

Semiconductor device

Semiconductor device

Display device having improved bonding between display panel and en...

Bonded structures

Semiconductor device

Semiconductor package

Chemical mechanical polishing for hybrid bonding

Driving backplane and display apparatus

Semiconductor memory device

Patents Applicationslast 30 patents

BOND PAD DESIGN FOR SEMICONDUCTOR DEVICE PACKAGES

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

Semiconductor Device

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD DISPOSED BETWEEN C...

STACKED SEMICONDUCTOR DEVICE WITH CONNECTION PAD SHIELD

DISTRIBUTED ELECTROSTATIC DISCHARGE PROTECTION FOR SEMICONDUCTOR DE...

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

SSD WAFER DEVICE AND METHOD OF MANUFACTURING SAME

DISPLAY SUBSTRATE, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE

ELECTRONIC DEVICE

ELECTRONIC DEVICE

FLIP-CHIP FIELD EFFECT TRANSISTOR LAYOUTS AND STRUCTURES

POLYIMIDE LAYER DEPRESSIONS BETWEEN METAL PILLARS

DISPLAY PANEL AND DISPLAY DEVICE

DISPLAY PANEL AND DISPLAY DEVICE

DRIVER IC AND DISPLAY DEVICE

HIGH-FREQUENCY SEMICONDUCTOR PACKAGE

SIGNAL ISOLATOR HAVING ENHANCED CREEPAGE CHARACTERISTICS

ARRAY SUBSTRATE AND METHOD OF MOUNTING INTEGRATED CIRCUIT USING THE...

SENSOR PACKAGING METHOD AND SENSOR PACKAGE

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE...

SEMICONDUCTOR DEVICE INCLUDING BONDING PAD

SEMICONDUCTOR DEVICE

DISPLAY MODULE AND METHOD FOR MANUFACTURING THE SAME, AND DISPLAY D...

DISPLAY DEVICE

DISPLAY DEVICE, METHOD OF MANUFACTURING THE SAME AND TILED DISPLAY...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

GALVANIC ISOLATION DEVICE

DRIVE CHIP AND DISPLAY PANEL