Molybdenum (Mo) as principal constituent

Industry

CPC
H01L2224/4868

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4868Molybdenum (Mo) as principal constituent

Industries

Please log in for detailed analytics

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component support and semiconductor device
- Patent number 10,068,821
- Issue date Sep 4, 2018
- Nichia Corporation
- Takeaki Shirase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,437,478
- Issue date Sep 6, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package
- Patent number 9,425,134
- Issue date Aug 23, 2016
- Xintec Inc.
- Yen-Shih Ho
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,355,975
- Issue date May 31, 2016
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging methods and packaged semiconductor devices
- Patent number 9,263,412
- Issue date Feb 16, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Double solid metal pad with reduced area
- Patent number 8,722,529
- Issue date May 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double solid metal pad with reduced area
- Patent number 8,581,423
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal pad or metal bump over pad exposed by passivation layer
- Patent number 8,399,989
- Issue date Mar 19, 2013
- Megica Corporation
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with Al pad
- Patent number 8,222,736
- Issue date Jul 17, 2012
- Eudyna Devices Inc.
- Takeshi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,132,709
- Issue date Mar 13, 2012
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 8,063,489
- Issue date Nov 22, 2011
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and fabrication thereof
- Patent number 8,034,711
- Issue date Oct 11, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure having dummy plugs and/or patterns formed therea...
- Patent number 8,030,781
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,964,911
- Issue date Jun 21, 2011
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,791,308
- Issue date Sep 7, 2010
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for wire bonding
- Patent number 7,592,710
- Issue date Sep 22, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structures extending from seal ring into active circuit area...
- Patent number 7,224,069
- Issue date May 29, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for integrated circuit chip
- Patent number 7,196,428
- Issue date Mar 27, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bonding pad for wire bonding and sort probing
- Patent number 7,091,613
- Issue date Aug 15, 2006
- Altera Corporation
- Jon M. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded antenna and semiconductor die on a substrate in a laminate...
- Patent number 6,818,985
- Issue date Nov 16, 2004
- Skyworks Solutions, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding process for copper-metallized integrated circuits
- Patent number 6,800,555
- Issue date Oct 5, 2004
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,248,657
- Issue date Jun 19, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shigenobu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,133,625
- Issue date Oct 17, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Shigenobu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding an aluminum wire
- Patent number 4,580,713
- Issue date Apr 8, 1986
- Hitachi, Ltd.
- Masao Sekibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device having polymer resin as insulator and...
- Patent number 4,017,886
- Issue date Apr 12, 1977
- Hitachi, Ltd.
- Masami Tomono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Packaging Methods and Packaged Semiconductor Devices
- Publication number 20140367867
- Publication date Dec 18, 2014
- Wei-Hung Lin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332983
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332969
- Publication date Nov 13, 2014
- Yen-Shih HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20140332968
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140332908
- Publication date Nov 13, 2014
- Yen-Shih HO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20140045327
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE
- Publication number 20140021595
- Publication date Jan 23, 2014
- Takeaki SHIRASE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE
- Publication number 20130330852
- Publication date Dec 12, 2013
- Mineo OKUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION
- Publication number 20130043598
- Publication date Feb 21, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ying-Ju CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
- Publication number 20130001761
- Publication date Jan 3, 2013
- Philip E. Rogren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...
- Publication number 20120205812
- Publication date Aug 16, 2012
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120032329
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148244
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148718
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100133688
- Publication date Jun 3, 2010
- RENESAS TECHNOLOGY CORP.
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20100123246
- Publication date May 20, 2010
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...
- Publication number 20100072632
- Publication date Mar 25, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080230908
- Publication date Sep 25, 2008
- EUDYNA DEVICES INC.
- Takeshi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080116591
- Publication date May 22, 2008
- Nichia Corporation.
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND FABRICATION THEREOF
- Publication number 20080102198
- Publication date May 1, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure for wire bonding
- Publication number 20070205508
- Publication date Sep 6, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER
- Publication number 20070026631
- Publication date Feb 1, 2007
- Mou-Shiung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy structures extending from seal ring into active circuit area...
- Publication number 20070018331
- Publication date Jan 25, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure for integrated circuit chip
- Publication number 20060180946
- Publication date Aug 17, 2006
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure for integrated circuit chip
- Publication number 20060091566
- Publication date May 4, 2006
- Chin-Tien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure and fabrication thereof
- Publication number 20050194683
- Publication date Sep 8, 2005
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20050106851
- Publication date May 19, 2005
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum (Mo) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor integrated circuit device

Semiconductor component support and semiconductor device

Semiconductor integrated circuit device

Chip package and method for forming the same

Chip package

Chip package and method for forming the same

Packaging methods and packaged semiconductor devices

Double solid metal pad with reduced area

Double solid metal pad with reduced area

Metal pad or metal bump over pad exposed by passivation layer

Semiconductor device with Al pad

Semiconductor device and method for manufacturing same

Semiconductor integrated circuit device

Bonding structure and fabrication thereof

Bond pad structure having dummy plugs and/or patterns formed therea...

Semiconductor element and electrical apparatus

Semiconductor element and electrical apparatus

Bond pad structure for wire bonding

Dummy structures extending from seal ring into active circuit area...

Bond pad structure for integrated circuit chip

Elongated bonding pad for wire bonding and sort probing

Embedded antenna and semiconductor die on a substrate in a laminate...

Wire bonding process for copper-metallized integrated circuits

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Method for bonding an aluminum wire

Discrete semiconductor device having polymer resin as insulator and...

Patents Applicationslast 30 patents

Packaging Methods and Packaged Semiconductor Devices

STACKED CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

Double Solid Metal Pad with Reduced Area

SEMICONDUCTOR COMPONENT SUPPORT AND SEMICONDUCTOR DEVICE

Package-In-Packages and Methods of Formation Thereof

MANUFACTURING METHOD OF LIGHT-EMITTING DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

BOND PAD STRUCTURE TO REDUCE BOND PAD CORROSION

LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS

PATTERNS OF PASSIVATION MATERIAL ON BOND PADS AND METHODS OF MANUFA...

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Double Solid Metal Pad with Reduced Area

BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

BONDING STRUCTURE AND FABRICATION THEREOF

Bond pad structure for wire bonding

METAL PAD OR METAL BUMP OVER PAD EXPOSED BY PASSIVATION LAYER

Dummy structures extending from seal ring into active circuit area...

Bond pad structure for integrated circuit chip

Bond pad structure for integrated circuit chip

Bonding structure and fabrication thereof

Wire bonding process for copper-metallized integrated circuits