Molybdenum (Mo) as principal constituent

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H01L2224/4878

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4878Molybdenum (Mo) as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and inspection device
- Patent number 12,040,303
- Issue date Jul 16, 2024
- Kabushiki Kaisha Toshiba
- Mitsuaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 10,818,620
- Issue date Oct 27, 2020
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film and method for manufacturing s...
- Patent number 10,157,865
- Issue date Dec 18, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 9,466,559
- Issue date Oct 11, 2016
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double solid metal pad with reduced area
- Patent number 8,722,529
- Issue date May 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double solid metal pad with reduced area
- Patent number 8,581,423
- Issue date Nov 12, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with Al pad
- Patent number 8,222,736
- Issue date Jul 17, 2012
- Eudyna Devices Inc.
- Takeshi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,132,709
- Issue date Mar 13, 2012
- Nichia Corporation
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit device
- Patent number 8,063,489
- Issue date Nov 22, 2011
- Renesas Electronics Corporation
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and fabrication thereof
- Patent number 8,034,711
- Issue date Oct 11, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure having dummy plugs and/or patterns formed therea...
- Patent number 8,030,781
- Issue date Oct 4, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,964,911
- Issue date Jun 21, 2011
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor element and electrical apparatus
- Patent number 7,791,308
- Issue date Sep 7, 2010
- Panasonic Corporation
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for wire bonding
- Patent number 7,592,710
- Issue date Sep 22, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnection with conductive polymer layer and method of...
- Patent number 7,538,434
- Issue date May 26, 2009
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy structures extending from seal ring into active circuit area...
- Patent number 7,224,069
- Issue date May 29, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad structure for integrated circuit chip
- Patent number 7,196,428
- Issue date Mar 27, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elongated bonding pad for wire bonding and sort probing
- Patent number 7,091,613
- Issue date Aug 15, 2006
- Altera Corporation
- Jon M. Long
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded antenna and semiconductor die on a substrate in a laminate...
- Patent number 6,818,985
- Issue date Nov 16, 2004
- Skyworks Solutions, Inc.
- Roberto Coccioli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding process for copper-metallized integrated circuits
- Patent number 6,800,555
- Issue date Oct 5, 2004
- Texas Instruments Incorporated
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for making the same that provide...
- Patent number 6,756,675
- Issue date Jun 29, 2004
- Seiko Epson Corporation
- Kazuo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,248,657
- Issue date Jun 19, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Shigenobu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,133,625
- Issue date Oct 17, 2000
- Mitsubishi Denki Kabushiki Kaisha
- Shigenobu Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for making the same that provide...
- Patent number 6,100,589
- Issue date Aug 8, 2000
- Seiko Epson Corporation
- Kazuo Tanaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete semiconductor device having polymer resin as insulator and...
- Patent number 4,017,886
- Issue date Apr 12, 1977
- Hitachi, Ltd.
- Masami Tomono
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND INSPECTION DEVICE
- Publication number 20210296279
- Publication date Sep 23, 2021
- Kabushiki Kaisha Toshiba
- Mitsuaki KATO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...
- Publication number 20140252640
- Publication date Sep 11, 2014
- Samsung Electronics Co., Ltd.
- Min-Keun Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20140045327
- Publication date Feb 13, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20130313708
- Publication date Nov 28, 2013
- RENESAS ELECTRONICS CORPORATION
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20120032329
- Publication date Feb 9, 2012
- Renesas Electronics Corporation
- HIROMI SHIGIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148244
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS
- Publication number 20100148718
- Publication date Jun 17, 2010
- Matsushita Electric Industrial Co., Ltd.
- Makoto Kitabatake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20100133688
- Publication date Jun 3, 2010
- RENESAS TECHNOLOGY CORP.
- Hiromi Shigihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double Solid Metal Pad with Reduced Area
- Publication number 20100123246
- Publication date May 20, 2010
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...
- Publication number 20100072632
- Publication date Mar 25, 2010
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080230908
- Publication date Sep 25, 2008
- EUDYNA DEVICES INC.
- Takeshi Igarashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20080116591
- Publication date May 22, 2008
- Nichia Corporation.
- Tadao Hayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND FABRICATION THEREOF
- Publication number 20080102198
- Publication date May 1, 2008
- Taiwan Semiconductor Manufacturing Co., LTD
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure for wire bonding
- Publication number 20070205508
- Publication date Sep 6, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Chiu Hsia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy structures extending from seal ring into active circuit area...
- Publication number 20070018331
- Publication date Jan 25, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper interconnection with conductive polymer layer and method of...
- Publication number 20060202346
- Publication date Sep 14, 2006
- Chien-Hsueh Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure for integrated circuit chip
- Publication number 20060180946
- Publication date Aug 17, 2006
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bond pad structure for integrated circuit chip
- Publication number 20060091566
- Publication date May 4, 2006
- Chin-Tien Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonding structure and fabrication thereof
- Publication number 20050194683
- Publication date Sep 8, 2005
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20050106851
- Publication date May 19, 2005
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire bonding process for copper-metallized integrated circuits
- Publication number 20010035452
- Publication date Nov 1, 2001
- Howard R. Test
- H01 - BASIC ELECTRIC ELEMENTS

Molybdenum (Mo) as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and inspection device

Semiconductor integrated circuit device

Semiconductor device with metal film and method for manufacturing s...

Semiconductor integrated circuit device

Double solid metal pad with reduced area

Double solid metal pad with reduced area

Semiconductor device with Al pad

Semiconductor device and method for manufacturing same

Semiconductor integrated circuit device

Bonding structure and fabrication thereof

Bond pad structure having dummy plugs and/or patterns formed therea...

Semiconductor element and electrical apparatus

Semiconductor element and electrical apparatus

Bond pad structure for wire bonding

Copper interconnection with conductive polymer layer and method of...

Dummy structures extending from seal ring into active circuit area...

Bond pad structure for integrated circuit chip

Elongated bonding pad for wire bonding and sort probing

Embedded antenna and semiconductor die on a substrate in a laminate...

Wire bonding process for copper-metallized integrated circuits

Semiconductor device and a method for making the same that provide...

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and a method for making the same that provide...

Discrete semiconductor device having polymer resin as insulator and...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND INSPECTION DEVICE

SEMICONDUCTOR PACKAGE HAVING A MULTI-CHANNEL AND A RELATED ELECTRON...

Double Solid Metal Pad with Reduced Area

Package-In-Packages and Methods of Formation Thereof

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

SEMICONDUCTOR ELEMENT AND ELECTRICAL APPARATUS

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Double Solid Metal Pad with Reduced Area

BOND PAD STRUCTURE HAVING DUMMY PLUGS AND/OR PATTERNS FORMED THEREA...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

BONDING STRUCTURE AND FABRICATION THEREOF

Bond pad structure for wire bonding

Dummy structures extending from seal ring into active circuit area...

Copper interconnection with conductive polymer layer and method of...

Bond pad structure for integrated circuit chip

Bond pad structure for integrated circuit chip

Bonding structure and fabrication thereof

Wire bonding process for copper-metallized integrated circuits

Wire bonding process for copper-metallized integrated circuits