The present disclosure relates to manufacturing systems and processes for producing sensors for measuring bioanalytes and, in particular, to producing sensors using continuous manufacturing systems and processes.
Electrochemical bio-sensors have been developed for detecting analyte concentrations in a given fluid sample. For example, U.S. Pat. Nos. 5,264,105; 5,356,786; 5,262,035; 5,320,725; and 6,464,849, which are hereby incorporated herein by reference in their entireties, disclose wired enzyme sensors for detecting analytes, such as lactate or glucose. Wired enzyme sensors have been widely used in blood glucose monitoring systems adapted for home use by diabetics to allow blood glucose levels to be closely monitored. Other example types of blood glucose monitoring systems are disclosed by U.S. Pat. Nos. 5,575,403; 6,379,317; and 6,893,545.
Conventional manufacturing systems and processes for producing bio-sensors involve web based conductive print technology.
One aspect of the present disclosure relates to a sensor system that can be manufactured in reduced scale and that can be conveniently handled by consumers.
Another aspect of the present disclosure relates to an electrochemical sensor module for use in a sensor system that can be efficiently manufactured using a continuous manufacturing process such as a continuous insert molding process.
A further aspect of the present disclosure relates to a sensor module including a molded body that defines an analyte analysis cell and also integrates a skin piercing element, such as a lancet or canula, into the molded body.
A variety of additional aspects will be set forth in the description that follows. The aspects can relate to individual features and to combinations of features. It is to be understood that both the forgoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the broad concepts upon which the embodiments disclosed herein are based.
Reference will now be made in detail to exemplary aspects of the present disclosure which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
The following definitions are provided for terms used herein:
A “working electrode” is an electrode at which the analyte (or a second compound whose level depends on the level of the analyte) is electrooxidized or electroreduced with or without the agency of an electron transfer agent.
A “reference electrode” is an electrode used in measuring the potential of the working electrode. The reference electrode should have a generally constant electrochemical potential as long as no current flows through it. As used herein, the term “reference electrode” includes pseudo-reference electrodes. In the context of the disclosure, the term “reference electrode” can include reference electrodes which also function as counter electrodes (i.e., a counter/reference electrode).
A “counter electrode” refers to an electrode paired with a working electrode to form an electrochemical cell. In use, electrical current passes through the working and counter electrodes. The electrical current passing through the counter electrode is equal in magnitude and opposite in sign to the current passing through the working electrode. In the context of the disclosure, the term “counter electrode” can include counter electrodes which also function as reference electrodes (i.e., a counter/reference electrode).
A “counter/reference electrode” is an electrode that functions as both a counter electrode and a reference electrode.
An “electrochemical sensing system” is a system configured to detect the presence and/or measure the level of an analyte in a sample via electrochemical oxidation and reduction reactions on the sensor. These reactions are converted (e.g., transduced) to an electrical signal that can be correlated to an amount, concentration, or level of an analyte in the sample. Further details about electrochemical sensing systems, working electrodes, counter electrodes and reference electrodes can be found at U.S. Pat. No. 6,560,471, the disclosure of which is hereby incorporated herein by reference in its entirety.
“Electrolysis” is the electrooxidation or electroreduction of a compound either directly at an electrode or via one or more electron transfer agents.
An “electron transfer agent” is a compound that carries electrons between the analyte and the working electrode either directly or in cooperation with other electron transfer agents. One example of an electron transfer agent is a redox mediator.
A “sensing layer” is a component of the sensor which includes constituents that facilitate the electrolysis of the analyte. The sensing layer may include constituents such as an electron transfer agent, a catalyst which catalyzes a reaction of the analyte to produce a response at the electrode, or both.
The present disclosure is directed to a manufacturing system configured to produce one or more sensor modules configured for analyte monitoring (e.g., glucose single-point monitoring, lactate single-point monitoring, etc.). Each sensor module includes a housing containing an analysis cell configured to hold a fluid sample, at least two elongated electrodes arranged to enter the analysis cell, and contacts for electrically connecting the electrodes to external connectors. Certain types of the elongated electrodes includes a composite conductive monofilament (CCM) electrode. In other embodiments, the housing can contain additional electrodes having differing enzyme coatings. The analysis cell can be configured for coulormetric or amperometric assays.
The manufacturing process 100 begins at a start module 101, performs any appropriate initialization procedures, and proceeds to a fabricate operation 103. The fabricate operation 103 forms features of one or more precursor sensor bodies in a wafer of substrate 120. In accordance with some aspects, the fabricate operation 103 removes material from the wafer, for example, to form wells and/or channels in the substrate. In some implementations, the fabricate operation 103 removes the material through etching. In other implementations, the fabricate operation 103 removes the material using a laser. In accordance with other aspects, the fabricate operation 103 deposits material into the wafer, for example, to form conductive signal paths or other features.
A dispense operation 105 disposes one or more electrodes along the features of the precursor sensor bodies. In some implementations, the dispense operation 105 disposes a single sensor fiber along the features of multiple precursor sensor bodies. In certain implementations, the dispense operation 105 disposes two sensor fibers (e.g., a working electrode and a counter electrode) along the features of multiple precursor sensor bodies. In certain implementations, the dispense operation 105 disposes three sensor fibers (e.g., a working electrode, a counter electrode, and a reference electrode) along the features of multiple precursor sensor bodies.
An attach operation 107 secures a rigid layer to the wafer 120. In certain implementations, the attach operation 107 secures the rigid layer to the wafer 120 using an organic binder. The rigid layer cooperates with the fabricated substrate 120 to define features (e.g. a test chamber) of the precursor sensor bodies. The rigid layer also secures the electrodes in the precursor sensor bodies. In certain implementations, the binder also provides a seal around the electrodes.
A separate operation 109 divides the wafer into segments so that each segment contains the features of a single precursor sensor body. In certain implementations, dicing tape is applied to the wafer to protect the sensor features during the separate operation 109. In some implementations, the separate operation 107 divides the wafer by cutting the wafer using a shear or other blade. In other implementations, the separate operation 109 divides the wafer using a laser. In still other implementations, the separate operation 109 divides the wafer by scoring and bending the wafer.
A join operation 111 couples the wafer segment to one or more additional components. When joined, the features of the wafer segment and features of the additional components form a complete sensor body. For example, in certain implementations, joining the wafer and the additional components seals an analysis cell of the sensor body. In certain implementations, joining the wafer and the additional components provides capillary channels from the analysis cell to an exterior of the sensor body. In some implementations, the join operation 111 couples the wafer segment to a molded carrier. In other implementations, the join operation 111 couples the wafer segment to a laminated section.
The manufacturing process 100 performs any appropriate completion procedures and ends at a stop module 113.
As shown in
In some implementations, the fabricate operation 103 removes material to define one or more wells 121. Each well 121 corresponds to one precursor sensor body 140. The well 121 of each precursor sensor body 140 is configured to form part of the test chamber of a respective assembled sensor body 150. In some implementations, the fabricate operation 103 also removes material to form at least a first channel 122 for each precursor sensor body. In certain implementations, the fabricate operation 103 forms a continuous channel extending across the wafer 120 to form the first channel 122 for each precursor sensor body 140 in the row. In certain implementations, the fabricate operation 103 also forms a second channel 123 extending through one or more of the precursor sensor bodies 140 in each row.
In the example shown in
In some implementations, the fabricate operation 103 deposits material on the wafer 120 to form features of the precursor sensor bodies 140. For example, the fabricate operation 103 may deposit a metal or other conductive material over the wafer 120 to form one or more conductive paths across the wafer 120. As shown in
In some implementations, the first conductive path 124 includes at least one contact pad 125 for each precursor sensor body 140 and the second conductive path 126 includes at least one contact pad 127 for each precursor sensor body 140. In certain implementations, each of the conductive paths 124, 126 includes two contact pads 125, 127 for each precursor sensor body 140. For example, each conductive path 124, 126 may include a corresponding contact pad 125, 127, respectively, on either side of the well 121.
In some implementations, the composite sensor fibers are dispensed from one or more reels 132 into the grooves 122, 123 defined in the precursor sensor bodies 140. In certain implementations, the first station 134 includes a set of reels 132 for each row of precursor sensor bodies 140. In other implementations, the first station 134 includes multiple sets of reels 132 for each row of precursor sensor bodies 140, each set dispensing one sensor fiber onto a groove. For example, as shown in
In certain implementations, the first station 901 also includes one or more cutting structures 136 that disconnect the dispensed sensor fibers 906 from the reels 910. In some implementations, the cutting structures 914 cut the sensor fibers 130, 131 at extreme ends of the wafer 120. In such implementations, a continuous length of each sensor fiber 130, 131 extends through all of the precursor sensor bodies 140 in one of the rows of precursor sensor bodies 140. In the example shown in
In some implementations, the dispose operation 105 also includes disposing a binder over the fiber sensors 130, 131. In certain implementations, the binder is an organic binder that is configured to permanently attach a rigid layer to the silicone substrate 120. In certain implementations, the binder also provides a thin film that forms a seal around the sensor fibers 130, 131.
The cutting station 138 includes at least one cutting tool 136. In some implementations, the cutting station 138 includes a single cutting tool 136 that moves along the wafer 120. In other implementations, the cutting station 138 includes multiple cutting tools 136. For example, the cutting tools 136 may be positioned in a fixed pattern and pressed through the wafer 120. In certain implementations, the cutting station 138 applies dicing tape to a top of the wafer 120 along dividing lines that define the boundaries of the precursor sensor bodies 140. The dicing tape may protect the sensor fibers 130, 131 or other features while the wafer is segmented.
In some implementations, the wafer 120 and sensor fibers 130, 131 are cut using the same cutting tool 136. In certain implementations, the wafer 120 and the sensor fibers 130, 131 are cut with a laser. In certain implementations, the wafer 120 and sensor fibers 130, 131 are cut with a knife or other bladed instrument. In certain implementations, the wafer 120 and sensor fibers 130, 131 are cut with a nipper. In certain implementations, the wafer 120 and sensor fibers 130, 131 are cut with pneumatic shears. In other implementations, the wafer 120 and sensor fibers 130, 131 are cut using different tools. For example, the wafer 120 may be cut with a laser and the sensor fibers 130, 131 may be cut using a nipper.
The component body 151 defines a passage 152 extend at least from one end of the component body 151 to the test chamber aperture 129 in the rigid layer 128 of the precursor sensor body 140. The passage 152 provides an inlet at one end of the sensor module 150 that leads to the test chamber 155. In some implementations, the component body 150 includes a skin-piercing member that is configured to extend and retract through the passage 152 to take the blood sample.
Additional details regarding example sensor fibers suitable for use in sensor modules manufactured as described above can be found in U.S. Pat. Nos. 5,264,105; 5,356,786; 5,262,035; and 5,320,725, the disclosures of which are incorporated by reference herein. Further examples of sensor fibers are described in U.S. application Ser. No. 13/129,325, filed May 13, 2011, and titled “Electrochemical Sensor Module,” the disclosure of which is incorporated by reference herein. Other examples of sensor fibers are described in PCT Publication Nos. WO 2009/032760 and WO 2009/051901, the disclosures of which are incorporated by reference herein. Additional details regarding example sensor modules can be found in U.S. Provisional Application No. 61/430,384, filed Jan. 6, 2011, and titled “Sensor Module with Enhanced Capillary Flow,” the disclosure of which is hereby incorporated herein by reference.
The above specification provides examples of how certain aspects may be put into practice. It will be appreciated that the aspects can be practiced in other ways than those specifically shown and described herein without departing from the spirit and scope of the present disclosure.
This application is a National Stage Application of PCT/US2012/038601, filed 18 May 2012, which claims benefit of U.S. Provisional Application Ser. No. 61/488,512 filed May 20, 2011, the subject matter of which is incorporated by reference in its entirety. To the extent appropriate, a claim of priority is made to each of the above disclosed applications.
Filing Document | Filing Date | Country | Kind | 371c Date |
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PCT/US2012/038601 | 5/18/2012 | WO | 00 | 11/19/2013 |
Publishing Document | Publishing Date | Country | Kind |
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WO2012/162151 | 11/29/2012 | WO | A |
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