Nickel [Ni] as principal constituent

Industry

CPC
H01L2224/29155

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29155Nickel [Ni] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding member for semiconductor device
- Patent number 12,119,322
- Issue date Oct 15, 2024
- SUPERUFO291 TEC
- Akira Fukui
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Layered bonding material, semiconductor package, and power module
- Patent number 12,080,671
- Issue date Sep 3, 2024
- Senju Metal Industry Co., Ltd.
- Naoto Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonded structure
- Patent number 12,070,801
- Issue date Aug 27, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Kei Anai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Integrated fan-out packaging
- Patent number 12,062,622
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 12,051,633
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device having high yield strength intermediate plate
- Patent number 12,009,332
- Issue date Jun 11, 2024
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device including a copper pill...
- Patent number 11,961,816
- Issue date Apr 16, 2024
- Rohm Co., Ltd.
- Shoji Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip and semiconductor device including a copper pill...
- Patent number 11,916,034
- Issue date Feb 27, 2024
- Rohm Co., Ltd.
- Shoji Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor arrangement and method for prod...
- Patent number 11,887,961
- Issue date Jan 30, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive film with carbon-based conductive regions an...
- Patent number 11,881,468
- Issue date Jan 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,854,923
- Issue date Dec 26, 2023
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with multi-layer contact and system
- Patent number 11,842,975
- Issue date Dec 12, 2023
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light emitting diode display with redundancy scheme
- Patent number 11,778,842
- Issue date Oct 3, 2023
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,756,916
- Issue date Sep 12, 2023
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Display module and method of manufacturing the same
- Patent number 11,715,729
- Issue date Aug 1, 2023
- Samsung Electronics Co., Ltd.
- Yoonsuk Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layered bonding material, semiconductor package, and power module
- Patent number 11,712,760
- Issue date Aug 1, 2023
- Senju Metal Industry Co., Ltd.
- Naoto Kameda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating a semiconductor pa...
- Patent number 11,688,670
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method
- Patent number 11,631,586
- Issue date Apr 18, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, electronic module and methods for fabricating th...
- Patent number 11,615,963
- Issue date Mar 28, 2023
- Infineon Technologies AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder material with two different size nickel particles
- Patent number 11,552,042
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Chemical mechanical polishing for hybrid bonding
- Patent number 11,552,041
- Issue date Jan 10, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip assembly
- Patent number 11,508,694
- Issue date Nov 22, 2022
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,502,014
- Issue date Nov 15, 2022
- Rohm Co., Ltd.
- Koshun Saito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Back side metallization
- Patent number 11,488,922
- Issue date Nov 1, 2022
- Advanced Micro Devices, Inc.
- Thomas P. Dolbear
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver nano-twinned thin film structure and method for forming the...
- Patent number 11,488,920
- Issue date Nov 1, 2022
- AG MATERIALS TECHNOLOGY CO., LTD.
- Hsing-Hua Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacture of integrated devices including a die fi...
- Patent number 11,482,503
- Issue date Oct 25, 2022
- STMicroelectronics S.r.l.
- Michele Calabretta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated fan-out packaging
- Patent number 11,437,327
- Issue date Sep 6, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC PACKAGE DEVICE, AND DEVICE MODULE
- Publication number 20240387436
- Publication date Nov 21, 2024
- Mitsubishi Electric Corporation
- Yusuke YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING
- Publication number 20240379607
- Publication date Nov 14, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240347405
- Publication date Oct 17, 2024
- ROHM CO., LTD.
- Koshun SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240339383
- Publication date Oct 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Ko-Pu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240321809
- Publication date Sep 26, 2024
- STMicroelectronics International N.V.
- Romain COFFY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD
- Publication number 20240282685
- Publication date Aug 22, 2024
- LG Innotek Co., Ltd.
- Jae Hun JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240282744
- Publication date Aug 22, 2024
- Fuji Electric Co., Ltd.
- Takafumi YAMADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240266310
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi TANIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU
- Publication number 20240243091
- Publication date Jul 18, 2024
- The Indium Corporation of America
- Richard McDonough
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method for Semiconductor Device
- Publication number 20240234359
- Publication date Jul 11, 2024
- Hitachi Astemo, Ltd.
- Osamu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE
- Publication number 20240213206
- Publication date Jun 27, 2024
- SENJU METAL INDUSTRY CO., LTD.
- Naoto KAMEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
- Publication date May 23, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...
- Publication number 20240170435
- Publication date May 23, 2024
- Micron Technology, Inc.
- Eiichi Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE INCLUDING A COPPER PILL...
- Publication number 20240170436
- Publication date May 23, 2024
- Rohm Co., Ltd.
- Shoji TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Improved Heat Dissipation Efficiency and Method for Fo...
- Publication number 20240162109
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Yi Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method for Semiconductor Device
- Publication number 20240136318
- Publication date Apr 25, 2024
- Hitachi Astemo, Ltd.
- Osamu IKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having a Layer Stack, Semiconductor Arrangemen...
- Publication number 20240128226
- Publication date Apr 18, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLECTORS FOR SUPPORT STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES
- Publication number 20240120452
- Publication date Apr 11, 2024
- CreeLED, Inc.
- Derek Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...
- Publication number 20240105670
- Publication date Mar 28, 2024
- CYNTEC CO., LTD.
- Chi-Hung Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240105561
- Publication date Mar 28, 2024
- Kabushiki Kaisha Toshiba
- Fumiyoshi KAWASHIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED PACKAGING STRUCTURE
- Publication number 20240096838
- Publication date Mar 21, 2024
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- Chu-Chin HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM
- Publication number 20240088087
- Publication date Mar 14, 2024
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...
- Publication number 20240079365
- Publication date Mar 7, 2024
- Samsung Electronics Co., Ltd.
- Seungryong HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240071847
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Huan Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240063074
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20240038711
- Publication date Feb 1, 2024
- DENSO CORPORATION
- TERUAKI KUMAZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME
- Publication number 20240008298
- Publication date Jan 4, 2024
- Apple Inc.
- Andreas Bibl
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230402420
- Publication date Dec 14, 2023
- Hitachi Power Semiconductor Device, Ltd.
- Osamu Ikeda
- H01 - BASIC ELECTRIC ELEMENTS

Nickel [Ni] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for an improved integrated circuit package

Bonding member for semiconductor device

Layered bonding material, semiconductor package, and power module

Bonding material and bonded structure

Integrated fan-out packaging

Semiconductor device

Contact and die attach metallization for silicon carbide based devi...

Layer structure with an intermetallic phase layer and a chip packag...

Semiconductor device having high yield strength intermediate plate

Semiconductor chip and semiconductor device including a copper pill...

Semiconductor chip and semiconductor device including a copper pill...

Semiconductor device, semiconductor arrangement and method for prod...

Anisotropic conductive film with carbon-based conductive regions an...

Semiconductor device

Electronic device with multi-layer contact and system

Light emitting diode display with redundancy scheme

Method for the manufacture of integrated devices including a die fi...

Display module and method of manufacturing the same

Layered bonding material, semiconductor package, and power module

Semiconductor package and method for fabricating a semiconductor pa...

Heterogeneous annealing method

Electronic device, electronic module and methods for fabricating th...

Solder material with two different size nickel particles

Chemical mechanical polishing for hybrid bonding

Chip assembly

Semiconductor device

Back side metallization

Silver nano-twinned thin film structure and method for forming the...

Method for the manufacture of integrated devices including a die fi...

Integrated fan-out packaging

Patents Applicationslast 30 patents

HERMETIC PACKAGE DEVICE, AND DEVICE MODULE

CHEMICAL MECHANICAL POLISHING FOR HYBRID BONDING

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

ELECTRONIC DEVICE

CIRCUIT BOARD

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PHASE CHANGING THERMAL INTERFACE MATERIAL ALLOY CREATED IN-SITU

Semiconductor Device and Manufacturing Method for Semiconductor Device

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

LAYERED BONDING MATERIAL, SEMICONDUCTOR PACKAGE, AND POWER MODULE

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

ANISOTROPIC CONDUCTIVE FILM WITH CARBON-BASED CONDUCTIVE REGIONS AN...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE INCLUDING A COPPER PILL...

Package with Improved Heat Dissipation Efficiency and Method for Fo...

Semiconductor Device and Manufacturing Method for Semiconductor Device

Semiconductor Device Having a Layer Stack, Semiconductor Arrangemen...

REFLECTORS FOR SUPPORT STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES

ELECTRONIC COMPONENT WITH HIGH COPLANARITY AND METHOD OF MANUFACTUR...

SEMICONDUCTOR DEVICE

COMPONENT-EMBEDDED PACKAGING STRUCTURE

ELECTRONIC DEVICE WITH MULTI-LAYER CONTACT AND SYSTEM

DISPLAY MODULE INCLUDING BONDING MEMBER CONNECTING BETWEEN LIGHT EM...

SEMICONDUCTOR PACKAGE AND METHOD

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

LIGHT EMITTING DIODE DISPLAY WITH REDUNDANCY SCHEME

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME