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SEMICONDUCTOR PACKAGE
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Publication number 20240145397
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Publication date May 2, 2024
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Samsung Electronics Co., Ltd.
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Jeongho LEE
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240096822
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Publication date Mar 21, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Chia-Kuei HSU
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240088075
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Publication date Mar 14, 2024
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Samsung Electronics Co., Ltd.
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Sunkyoung SEO
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H01 - BASIC ELECTRIC ELEMENTS
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CHIP PACKAGE STRUCTURE
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Publication number 20240088090
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Publication date Mar 14, 2024
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Ling-Wei LI
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H01 - BASIC ELECTRIC ELEMENTS
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INTEGRATED CIRCUIT PACKAGE
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Publication number 20240079363
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Publication date Mar 7, 2024
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STMicroelectronics (Grenoble 2) SAS
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Romain COFFY
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR PACKAGE
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Publication number 20240030089
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Publication date Jan 25, 2024
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Samsung Electronics Co., Ltd.
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Eunseok CHO
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H01 - BASIC ELECTRIC ELEMENTS
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PACKAGE STRUCTURE
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Publication number 20240014192
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Publication date Jan 11, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Jing-Cheng LIN
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H01 - BASIC ELECTRIC ELEMENTS
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SEMICONDUCTOR DEVICE
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Publication number 20240006364
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Publication date Jan 4, 2024
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Rohm Co., Ltd.
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Kengo OHMORI
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H01 - BASIC ELECTRIC ELEMENTS
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-
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PACKAGE STRUCTURE
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Publication number 20230343724
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Publication date Oct 26, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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Po-Chen LAI
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H01 - BASIC ELECTRIC ELEMENTS
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