of a plurality of strap connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/41of a plurality of strap connectors

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Patents Grantslast 30 patents

Information Patent Grant
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Patents Applicationslast 30 patents

Information Patent Application
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- H01 - BASIC ELECTRIC ELEMENTS

of a plurality of strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with sense terminal

Semiconductor device

Semiconductor package with solder standoff

Semiconductor package, method of manufacturing the same and metal b...

Semiconductor device

Universal surface-mount semiconductor package

Electronic module

Multi-clip structure for die bonding

Semiconductor package with solder standoff

Semiconductor device

Semiconductor device

Die stack assembly using an edge separation structure for connectiv...

Semiconductor module

Die stack assembly using an edge separation structure for connectiv...

Power module including multiple signal wiring patterns disposed on...

Universal surface-mount semiconductor package

Stackable power module

Semiconductor module with temperature detecting element

Method for fabricating stack die package

Integrated circuit package with conductive clips

Semiconductor devices and methods of making the same

Semiconductor module and conductive member for semiconductor module...

Leadframe for a semiconductor component

Semiconductor devices and methods of making the same

Dual lead frame semiconductor package and method of manufacture

Semiconductor device

Semiconductor device

Arrangement of multiple power semiconductor chips and method of man...

Hybrid packaged lead frame based multi-chip semiconductor device wi...

Package and a method of manufacturing the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

CHIP PACKAGE MODULE, METHOD FOR MANUFACTURING SAME, POWER MODULE, A...

SANDWICH PACKAGE FOR MICROELECTRONICS

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPM

METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR...

FINGERPRINT SENSOR PACKAGE AND SMART CARD HAVING THE SAME

ISOLATED METAL CLIPS WITH STRUCTURAL BRIDGE

SEMICONDUCTOR DEVICE

Universal Surface-Mount Semiconductor Package

CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES

SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Forming Clip Bond Having Multipl...

Semiconductor Device and Method of Forming Leadframe with Clip Bond...

CLIP INTERCONNECT WITH MICRO CONTACT HEADS

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

ELECTRONIC MODULE

SEMICONDUCTOR PACKAGE WITH SOLDER STANDOFF

SEMICONDUCTOR DEVICE

GANG CLIP

Universal Surface-Mount Semiconductor Package

Die Stack Assembly Using An Edge Separation Structure For Connectiv...

Multi-Clip Structure for Die Bonding

POWER MODULE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

INTEGRATED CIRCUIT PACKAGE WITH CONDUCTIVE CLIPS

STACKABLE POWER MODULE

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

SEMICONDUCTOR DEVICE