of a plurality of strap connectors

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto

Current Industry

H01L24/38of a plurality of strap connectors

Industries

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of a plurality of strap connectors

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor apparatus mounted electrically connected to a plurali...

Semiconductor device including resin with a filler for encapsulatin...

Semiconductor device

Recess portion in the surface of an interconnection layer mounted t...

Molded semiconductor module for PCB embedding

Electronic module

Power semiconductor package and method for fabricating a power semi...

Multi-clip structure for die bonding

Method and apparatus for making integrated circuit packages

Semiconductor package with space efficient lead and die pad design

Semiconductor module

Integrated circuit (IC) die attached between an offset lead frame d...

Dual lead frame semiconductor package and method of manufacture

Arrangement of multiple power semiconductor chips and method of man...

Semiconductor device having multiple contact clips

Dual lead frame semiconductor package and method of manufacture

Dual lead frame semiconductor package and method of manufacture

Multi-layer lead frame package and method of fabrication

Device including a semiconductor chip and metal foils

Multi-layer lead frame package and method of fabrication

Power semiconductor module with a hermetically tight circuit arrang...

Wirebond-less semiconductor package

Semiconductor devices with conductive clips

Electronic module

Semiconductor die package with clip interconnection

Methods of packaging a semiconductor die and package formed by the...

Device including a semiconductor chip and metal foils

Contact device and a process to facilitate contact of power electro...

Semiconductor device manufacturing method and semiconductor device...

Patents Applicationslast 30 patents

HEMT PACKAGE WITH BOND WIRE-FREE CONNECTIONS

SEMICONDUCTOR DEVICE

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ELECTRONIC MODULE

SEMICONDUCTOR MODULE

Multi-Clip Structure for Die Bonding

Dual Lead Frame Semiconductor Package and Method of Manufacture

Dual Lead Frame Semiconductor Package and Method of Manufacture

Dual Lead Frame Semiconductor Package and Method of Manufacture

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead Frame Packages and Methods of Formation Thereof

MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS

ELECTRONIC MODULE

Dual Lead Frame Semiconductor Package and Method of Manufacture

MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION

Wirebond-less Semiconductor Package

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE PACKAGE WITH CLIP INTERCONNECTION

DEVICE INCLUDING A SEMICONDUCTOR CHIP AND METAL FOILS

Power semiconductor module with a hermetically tight circuit arrang...

INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANE...

ELECTRONIC MODULE

Methods of Packaging a Semiconductor Die and Package Formed by the...

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Contact device and a process to facilitate contact of power electro...