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H01L2224/33183

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/33183On contiguous sides of the body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,990,441
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,991,676
- Issue date Apr 27, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and dicing method
- Patent number 10,784,165
- Issue date Sep 22, 2020
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,593,651
- Issue date Mar 17, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for flash stacking
- Patent number 10,290,612
- Issue date May 14, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring substrate
- Patent number 9,818,681
- Issue date Nov 14, 2017
- Shinko Electric Industries Co., Ltd.
- Yoshihiro Machida
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a light emitting device
- Patent number 9,768,152
- Issue date Sep 19, 2017
- Nichia Corporation
- Hideaki Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anisotropic conductive adhesive with reduced migration
- Patent number 9,365,749
- Issue date Jun 14, 2016
- Sunray Scientific, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chip package and method for assembling chip package
- Patent number 8,736,078
- Issue date May 27, 2014
- Hon Hai Precision Industry Co., Ltd.
- Kai-Wen Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device, manufacturing program...
- Patent number 8,691,628
- Issue date Apr 8, 2014
- Kabushiki Kaisha Toshiba
- Yasuo Tane
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3408732
- Patent number 3,408,732
- Issue date Nov 5, 1968
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240297139
- Publication date Sep 5, 2024
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER
- Publication number 20240282658
- Publication date Aug 22, 2024
- International Business Machines Corporation
- John Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20240243114
- Publication date Jul 18, 2024
- ACER INCORPORATED
- Yu-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER
- Publication number 20240071977
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Chen Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...
- Publication number 20230411269
- Publication date Dec 21, 2023
- KIOXIA Corporation
- Keiichi NIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20230326835
- Publication date Oct 12, 2023
- NEXPERIA B.V.
- Hing Suan Cheam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME
- Publication number 20230085734
- Publication date Mar 23, 2023
- Samsung Electronics Co., Ltd.
- Sunjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP
- Publication number 20220278010
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220165696
- Publication date May 26, 2022
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Carrier Having an Installation Place for Electronic Compone...
- Publication number 20210351151
- Publication date Nov 11, 2021
- SIEMENS AKTIENGESELLSCHAFT
- Robby Urbahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20200212013
- Publication date Jul 2, 2020
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20190371765
- Publication date Dec 5, 2019
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND DICING METHOD
- Publication number 20190267288
- Publication date Aug 29, 2019
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A LIGHT EMITTING DEVICE
- Publication number 20170040302
- Publication date Feb 9, 2017
- Nichia Corporation.
- Hideaki TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Anisotropic Conductive Adhesive with Reduced Migration
- Publication number 20140353540
- Publication date Dec 4, 2014
- SUNRAY SCIENTIFIC, LLC
- S. Kumar Khanna
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHIP PACKAGE AND METHOD FOR ASSEMBLING CHIP PACKAGE
- Publication number 20130277847
- Publication date Oct 24, 2013
- HON HAI Precision Industry CO., LTD.
- KAI-WEN WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...
- Publication number 20120217660
- Publication date Aug 30, 2012
- FUJITSU LIMITED
- Motoaki TANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...
- Publication number 20120149151
- Publication date Jun 14, 2012
- Kabushiki Kaisha Toshiba
- Yasuo TANE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20120119391
- Publication date May 17, 2012
- Shinko Electric Industries Co., Ltd.
- Naoyuki KOIZUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package And Method For Making The Same
- Publication number 20120091575
- Publication date Apr 19, 2012
- Yi-Shao Lai
- H01 - BASIC ELECTRIC ELEMENTS

On contiguous sides of the body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package

Systems and methods for flash stacking

Semiconductor device and dicing method

Systems and methods for flash stacking

Systems and methods for flash stacking

Wiring substrate

Method for producing a light emitting device

Anisotropic conductive adhesive with reduced migration

Chip package and method for assembling chip package

Method of manufacturing semiconductor device, manufacturing program...

3408732

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DIES WITH THERMALLY CONDUCTING SOLDER PERIMETER

ELECTRONIC PACKAGE STRUCTURE

DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER

WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SE...

MOLDED ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Joining and Insulating Power Electronic Semiconductor Components

IMAGE SENSOR PACKAGE AND SYSTEM HAVING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING A DUMMY CHIP

SEMICONDUCTOR PACKAGE

Circuit Carrier Having an Installation Place for Electronic Compone...

SYSTEMS AND METHODS FOR FLASH STACKING

SYSTEMS AND METHODS FOR FLASH STACKING

SYSTEMS AND METHODS FOR FLASH STACKING

SEMICONDUCTOR DEVICE AND DICING METHOD

METHOD FOR PRODUCING A LIGHT EMITTING DEVICE

Anisotropic Conductive Adhesive with Reduced Migration

CHIP PACKAGE AND METHOD FOR ASSEMBLING CHIP PACKAGE

SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELEC...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING PROGRAM...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Package And Method For Making The Same