3408732

Information

• Patent Grant
• 3408732

• References
• Source

• Patent Number

  3,408,732

• Date Filed

  Not available

• Date Issued

  Tuesday, November 5, 1968
  56 years ago

• CPC

  • H01L23/488 - consisting of soldered or bonded constructions
  • H01L23/045 - the other leads having an insulating passage through the base
  • H01L23/055 - the leads having a passage through the base
  • H01L24/13 - of an individual bump connector
  • H01L24/32 - of an individual layer connector
  • H01L24/73 - Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
  • H01L29/00 - Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier
  • H01L24/29 - of an individual layer connector
  • H01L2224/33183 - On contiguous sides of the body
  • H01L2224/73153 - Bump and layer connectors
  • H01L2924/10155 - being other than a cuboid

• US Classifications

  • 438 - Semiconductor device manufacturing: process
  • 257 - Active solid-state devices