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H01L2224/05563

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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H01L2224/05563Only on parts of the surface of the internal layer

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with interconnectors of different density
- Patent number 12,148,689
- Issue date Nov 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Liang-Pin Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 12,113,003
- Issue date Oct 8, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate, display panel and display device
- Patent number 11,942,443
- Issue date Mar 26, 2024
- HEFEI BOE DISPLAY TECHNOLOGY CO., LTD.
- Chunxu Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having polygonal bonding pad
- Patent number 11,935,851
- Issue date Mar 19, 2024
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with composite middle interconnectors
- Patent number 11,881,446
- Issue date Jan 23, 2024
- NANYA TECHNOLOGY CORPORATION
- Pei Cheng Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 11,791,241
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure having polygonal bo...
- Patent number 11,776,921
- Issue date Oct 3, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 11,594,514
- Issue date Feb 28, 2023
- Kioxia Corporation
- Kazuhiro Nakanishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 11,367,699
- Issue date Jun 21, 2022
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and manufacturing method thereof
- Patent number 11,282,810
- Issue date Mar 22, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spoked solder pad to improve solderability and self-alignment of in...
- Patent number 10,957,663
- Issue date Mar 23, 2021
- Myron Walker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,879,198
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with porous networks for solder connections, and...
- Patent number 10,849,240
- Issue date Nov 24, 2020
- Invensas Corporation
- Liang Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 10,847,443
- Issue date Nov 24, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,784,179
- Issue date Sep 22, 2020
- Electronics and Telecommunications Research Institute
- Hyung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 10,763,230
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,756,052
- Issue date Aug 25, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for fabricating the same
- Patent number 10,651,107
- Issue date May 12, 2020
- Electronics and Telecommunications Research Institute
- Hyung Seok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing integrated fan-out package
- Patent number 10,366,966
- Issue date Jul 30, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,262,958
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a bump contact on a TSV comprising a cavi...
- Patent number 10,217,715
- Issue date Feb 26, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with metal film and method for manufacturing s...
- Patent number 10,157,865
- Issue date Dec 18, 2018
- Mitsubishi Electric Corporation
- Yosuke Nakata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spoked solder pad to improve solderability and self-alignment of in...
- Patent number 10,134,696
- Issue date Nov 20, 2018
- Myron Walker
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Thin NiB or CoB capping layer for non-noble metallic bonding landin...
- Patent number 10,066,303
- Issue date Sep 4, 2018
- Imec VZW
- Eric Beyne
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 9,831,156
- Issue date Nov 28, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder fatigue arrest for wafer level package
- Patent number 9,583,425
- Issue date Feb 28, 2017
- Maxim Integrated Products, Inc.
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 9,559,044
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
III-Nitride device with solderable front metal
- Patent number 9,312,375
- Issue date Apr 12, 2016
- Infineon Technologies Americas Corp.
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Front-to-back bonding with through-substrate via (TSV)
- Patent number 9,299,640
- Issue date Mar 29, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device with solderable front metal
- Patent number 8,853,744
- Issue date Oct 7, 2014
- International Rectifier Corporation
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20240266267
- Publication date Aug 8, 2024
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE
- Publication number 20240021627
- Publication date Jan 18, 2024
- SAMSUNG DISPLAY CO., LTD.
- Ki Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS
- Publication number 20230361013
- Publication date Nov 9, 2023
- NANYA TECHNOLOGY CORPORATION
- PEI CHENG FAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD
- Publication number 20230178503
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...
- Publication number 20230178501
- Publication date Jun 8, 2023
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS
- Publication number 20230170317
- Publication date Jun 1, 2023
- VueReal Inc.
- Gholamreza Chaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE
- Publication number 20220293539
- Publication date Sep 15, 2022
- Hefei BOE Display Technology Co., Ltd.
- Chunxu ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...
- Publication number 20210257322
- Publication date Aug 19, 2021
- ACTRON TECHNOLOGY CORPORATION
- I-Dar Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210057376
- Publication date Feb 25, 2021
- Kioxia Corporation
- Kazuhiro NAKANISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20210043547
- Publication date Feb 11, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200335477
- Publication date Oct 22, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE
- Publication number 20190355694
- Publication date Nov 21, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Albert Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20190214356
- Publication date Jul 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POSITIONING STRUCTURE HAVING POSITIONING UNIT
- Publication number 20190109092
- Publication date Apr 11, 2019
- Siliconware Precision Industries Co., Ltd.
- Rui-Feng Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...
- Publication number 20190088605
- Publication date Mar 21, 2019
- Myron WALKER
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)
- Publication number 20180145011
- Publication date May 24, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jing-Cheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...
- Publication number 20160233180
- Publication date Aug 11, 2016
- Myron WALKER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20140374899
- Publication date Dec 25, 2014
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT
- Publication number 20140345928
- Publication date Nov 27, 2014
- SEIKO EPSON CORPORATION
- Yugo KOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE
- Publication number 20140131859
- Publication date May 15, 2014
- Yong Li Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD
- Publication number 20130299966
- Publication date Nov 14, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Anil KV Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Device with Solderable Front Metal
- Publication number 20130207120
- Publication date Aug 15, 2013
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
SELECTIVE ELECTROMIGRATION IMPROVEMENT FOR HIGH CURRENT C4S
- Publication number 20120248604
- Publication date Oct 4, 2012
- International Business Machines Corporation
- Timothy Harrison Daubenspeck
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Incident Radiation Detector Packaging
- Publication number 20120096813
- Publication date Apr 26, 2012
- Raytheon Company
- Roland W. Gooch
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Programmable anti-fuse wire bond pads
- Publication number 20120061796
- Publication date Mar 15, 2012
- Power Gold LLC
- James Jen-Ho Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
III-Nitride Power Device with Solderable Front Metal
- Publication number 20110198611
- Publication date Aug 18, 2011
- INTERNATIONAL RECTIFIER CORPORATION
- Chuan Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for creating highly compliant thermal bonds that withstand r...
- Publication number 20110114707
- Publication date May 19, 2011
- Santa Barbara Infrared
- Gregory P. Matis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Structures and methods to improve lead-free C4 interconnect reliabi...
- Publication number 20110006422
- Publication date Jan 13, 2011
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20090212426
- Publication date Aug 27, 2009
- SANYO ELECTRIC CO., LTD.
- Hiroshi Ishizeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE HAVING ELECTRICAL CONNECTION STRUCTURE AND METH...
- Publication number 20090041981
- Publication date Feb 12, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Only on parts of the surface of the internal layer

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device with interconnectors of different density

Semiconductor device with composite middle interconnectors

Array substrate, display panel and display device

Semiconductor structure having polygonal bonding pad

Semiconductor device with composite middle interconnectors

Front-to-back bonding with through-substrate via (TSV)

Method of manufacturing semiconductor structure having polygonal bo...

Semiconductor device and method of manufacturing the same

Integrated circuit backside metallization

Integrated fan-out package and manufacturing method thereof

Spoked solder pad to improve solderability and self-alignment of in...

Package with solder regions aligned to recesses

Contact structures with porous networks for solder connections, and...

Front-to-back bonding with through-substrate via (TSV)

Semiconductor device and method for fabricating the same

Integrated circuit backside metallization

Method of manufacturing integrated fan-out package

Semiconductor device and method for fabricating the same

Method of manufacturing integrated fan-out package

Package with solder regions aligned to recesses

Semiconductor device with a bump contact on a TSV comprising a cavi...

Semiconductor device with metal film and method for manufacturing s...

Spoked solder pad to improve solderability and self-alignment of in...

Thin NiB or CoB capping layer for non-noble metallic bonding landin...

Front-to-back bonding with through-substrate via (TSV)

Solder fatigue arrest for wafer level package

Package with solder regions aligned to recesses

III-Nitride device with solderable front metal

Front-to-back bonding with through-substrate via (TSV)

Power device with solderable front metal

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

DISPLAY DEVICE

SEMICONDUCTOR DEVICE WITH COMPOSITE MIDDLE INTERCONNECTORS

SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BONDING PAD

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE HAVING POLYGONAL BO...

PASSING SIGNALS THROUGH MICRO DEVICE SIDEWALLS

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE

SEMI-FINISHED PRODUCT OF POWER DEVICE, MANUFACTURING METHOD THEREOF...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING INTEGRATED FAN-OUT PACKAGE

Package with Solder Regions Aligned to Recesses

POSITIONING STRUCTURE HAVING POSITIONING UNIT

SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...

FRONT-TO-BACK BONDING WITH THROUGH-SUBSTRATE VIA (TSV)

SPOKED SOLDER PAD TO IMPROVE SOLDERABILITY AND SELF-ALIGNMENT OF IN...

Package with Solder Regions Aligned to Recesses

ELECTRONIC PART, ELECTRONIC APPARATUS, AND MOVING OBJECT

SOLDER FATIGUE ARREST FOR WAFER LEVEL PACKAGE

WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD

Power Device with Solderable Front Metal

SELECTIVE ELECTROMIGRATION IMPROVEMENT FOR HIGH CURRENT C4S

Incident Radiation Detector Packaging

Programmable anti-fuse wire bond pads

III-Nitride Power Device with Solderable Front Metal

Method for creating highly compliant thermal bonds that withstand r...

Structures and methods to improve lead-free C4 interconnect reliabi...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGING SUBSTRATE HAVING ELECTRICAL CONNECTION STRUCTURE AND METH...