outside the semiconductor or solid-state body

Industry

CPC
H01L2224/4849

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/4849outside the semiconductor or solid-state body

Industries

Patents Grantslast 30 patents

Information Patent Grant
Board unit and semiconductor device
- Patent number 12,080,677
- Issue date Sep 3, 2024
- Kioxia Corporation
- Katsuya Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, method of manufacturing the same and metal b...
- Patent number 11,908,824
- Issue date Feb 20, 2024
- JMJ KOREA CO., LTD.
- Yun Hwa Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,887,970
- Issue date Jan 30, 2024
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 11,804,447
- Issue date Oct 31, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling capacitor mounted on an integrated circuit die, and meth...
- Patent number 11,562,978
- Issue date Jan 24, 2023
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Straight wirebonding of silicon dies
- Patent number 11,456,272
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 11,373,979
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,943,871
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module
- Patent number 10,888,941
- Issue date Jan 12, 2021
- Hitachi Power Semiconductor Device, Ltd.
- Daichi Kawamura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip package with resilient conductive paste post and...
- Patent number 10,685,943
- Issue date Jun 16, 2020
- Mediatek Inc.
- Shiann-Tsong Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module based on multi-layer circuit board
- Patent number 10,636,732
- Issue date Apr 28, 2020
- ABB Schweiz AG
- Fabian Mohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor chips
- Patent number 10,607,962
- Issue date Mar 31, 2020
- Danfoss Silicon Power GmbH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded electronic devices to round wire
- Patent number 10,497,664
- Issue date Dec 3, 2019
- Automated Assembly Corporation
- Robert Neuman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with a wire bonding and a sintered region, and...
- Patent number 10,490,523
- Issue date Nov 26, 2019
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and alternator and power conversion device wh...
- Patent number 10,319,849
- Issue date Jun 11, 2019
- Hitachi Power Semiconductor Device, Ltd.
- Tetsuya Ishimaru
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Discrete flexible interconnects for modules of integrated circuits
- Patent number 10,297,572
- Issue date May 21, 2019
- MC10, Inc.
- Mitul Dalal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded wide I/O semiconductor device
- Patent number 10,249,592
- Issue date Apr 2, 2019
- SanDisk Technologies LLC
- Michael Mostovoy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,170,402
- Issue date Jan 1, 2019
- Renesas Electronics Corporation
- Yosuke Imazeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having conductive wire with increased attachme...
- Patent number 10,141,269
- Issue date Nov 27, 2018
- Amkor Technology, Inc.
- Jun Ho Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor chip package assembly and electronic device having sensor ch...
- Patent number 10,121,750
- Issue date Nov 6, 2018
- Shenzhen Goodix Technology Co., Ltd.
- Yuping Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked microfeature devices and associated methods
- Patent number 10,062,667
- Issue date Aug 28, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding a hermetic module to an electrode array
- Patent number 9,984,994
- Issue date May 29, 2018
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Semiconductor device and a method for manufacturing a semiconductor...
- Patent number 9,786,620
- Issue date Oct 10, 2017
- Infineon Technolgies AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a wire bonding and a sintered region, and...
- Patent number 9,786,626
- Issue date Oct 10, 2017
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for creating a connection between metallic moulded bodies an...
- Patent number 9,786,627
- Issue date Oct 10, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin plastic leadless package with exposed metal die paddle
- Patent number 9,691,688
- Issue date Jun 27, 2017
- CARSEM (M) SDN. BHD.
- Mow Lum Yee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor chip with a metallic moulded body for contactin...
- Patent number 9,613,929
- Issue date Apr 4, 2017
- Danfoss Silicon Power GmbH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating same
- Patent number 9,536,855
- Issue date Jan 3, 2017
- Mitsubishi Electric Corporation
- Koji Yamazaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor construct and manufacturing method thereof as well as...
- Patent number 9,406,637
- Issue date Aug 2, 2016
- Aoi Electronics Co., Ltd.
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240321813
- Publication date Sep 26, 2024
- Kabushiki Kaisha Toshiba
- Syotaro Ono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION
- Publication number 20230369284
- Publication date Nov 16, 2023
- Pac Tech - Packaging Technologies GmbH
- RICARDO GEELHAAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD UNIT AND SEMICONDUCTOR DEVICE
- Publication number 20230086136
- Publication date Mar 23, 2023
- KIOXIA Corporation
- Katsuya MURAKAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230047789
- Publication date Feb 16, 2023
- Mitsubishi Electric Corporation
- Motoru YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...
- Publication number 20220359452
- Publication date Nov 10, 2022
- JMJ KOREA CO., LTD.
- Yun Hwa CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRAIGHT WIREBONDING OF SILICON DIES
- Publication number 20220084979
- Publication date Mar 17, 2022
- Western Digital Technologies, Inc.
- Kirubakaran Periyannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20210143105
- Publication date May 13, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20200399118
- Publication date Dec 24, 2020
- DENSO CORPORATION
- Yutaka HAYAKAWA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DECOUPLING CAPACITOR MOUNTED ON AN INTEGRATED CIRCUIT DIE, AND METH...
- Publication number 20190312005
- Publication date Oct 10, 2019
- Intel Corporation
- Florence R. Pon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20190126374
- Publication date May 2, 2019
- HITACHI POWER SEMICONDUCTOR DEVICE, LTD.
- Daichi KAWAMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...
- Publication number 20190051616
- Publication date Feb 14, 2019
- Amkor Technology Inc.
- Jun Ho JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20180358331
- Publication date Dec 13, 2018
- Micron Technology, Inc.
- Mung Suan Heng
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS
- Publication number 20180240776
- Publication date Aug 23, 2018
- DANFOSS SILICON POWER GMBH
- Frank Osterwald
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A WIRE BONDING AND A SINTERED REGION, AND...
- Publication number 20170365577
- Publication date Dec 21, 2017
- STMicroelectronics S.r.l.
- Agatino Minotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY
- Publication number 20170154867
- Publication date Jun 1, 2017
- The Charles Stark Draper Laboratory, Inc.
- Tirunelveli Sriram
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS
- Publication number 20170084585
- Publication date Mar 23, 2017
- Micron Technology, Inc.
- Mung Suan Heng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...
- Publication number 20170033067
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Stefan Kramp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME
- Publication number 20160035691
- Publication date Feb 4, 2016
- MITSUBISHI ELECTRIC CORPORATION
- Koji YAMAZAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20150097302
- Publication date Apr 9, 2015
- TERA PROBE, INC.
- Shinji WAKISAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH BIMETALLIC INTERFACE ELEMENT FOR WIRE BONDING
- Publication number 20150076712
- Publication date Mar 19, 2015
- STMicroelectronics S.r. I.
- Giuseppe Cristaldi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Component, Semiconductor Module and Methods for Produ...
- Publication number 20140284624
- Publication date Sep 25, 2014
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20140273353
- Publication date Sep 18, 2014
- RENESAS ELECTRONICS CORPORATION
- Masatoshi Yasunaga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20140239511
- Publication date Aug 28, 2014
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...
- Publication number 20140230989
- Publication date Aug 21, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...
- Publication number 20140225247
- Publication date Aug 14, 2014
- DANFOSS SILICON POWER GMBH
- Martin Becker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...
- Publication number 20140175628
- Publication date Jun 26, 2014
- Hua Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package-In-Packages and Methods of Formation Thereof
- Publication number 20140001615
- Publication date Jan 2, 2014
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...
- Publication number 20130320526
- Publication date Dec 5, 2013
- Shinji Wakisaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130241084
- Publication date Sep 19, 2013
- Toyota Jidosha Kabushiki Kaisha
- Hiroaki Tanaka
- H01 - BASIC ELECTRIC ELEMENTS

outside the semiconductor or solid-state body

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Board unit and semiconductor device

Packages with electrical fuses

Semiconductor package, method of manufacturing the same and metal b...

Stacked microfeature devices and associated methods

Semiconductor device having conductive wire with increased attachme...

Decoupling capacitor mounted on an integrated circuit die, and meth...

Straight wirebonding of silicon dies

Stacked microfeature devices and associated methods

Semiconductor device having conductive wire with increased attachme...

Power semiconductor module

Semiconductor chip package with resilient conductive paste post and...

Power module based on multi-layer circuit board

Method for manufacturing semiconductor chips

Wire bonded electronic devices to round wire

Semiconductor device with a wire bonding and a sintered region, and...

Semiconductor device, and alternator and power conversion device wh...

Discrete flexible interconnects for modules of integrated circuits

Wire bonded wide I/O semiconductor device

Semiconductor device

Semiconductor device having conductive wire with increased attachme...

Sensor chip package assembly and electronic device having sensor ch...

Stacked microfeature devices and associated methods

Method for bonding a hermetic module to an electrode array

Semiconductor device and a method for manufacturing a semiconductor...

Semiconductor device with a wire bonding and a sintered region, and...

Method for creating a connection between metallic moulded bodies an...

Thin plastic leadless package with exposed metal die paddle

Power semiconductor chip with a metallic moulded body for contactin...

Semiconductor device and method of fabricating same

Semiconductor construct and manufacturing method thereof as well as...

Patents Applicationslast 30 patents

PACKAGES WITH ELECTRICAL FUSES

SEMICONDUCTOR DEVICE

CHIP ARRANGEMENT AND METHOD FOR FORMING A SINTERED CONTACT CONNECTION

BOARD UNIT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE, METHOD OF MANUFACTURING THE SAME AND METAL B...

STRAIGHT WIREBONDING OF SILICON DIES

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

ELECTRONIC DEVICE

DECOUPLING CAPACITOR MOUNTED ON AN INTEGRATED CIRCUIT DIE, AND METH...

POWER SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE HAVING CONDUCTIVE WIRE WITH INCREASED ATTACHME...

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS

SEMICONDUCTOR DEVICE WITH A WIRE BONDING AND A SINTERED REGION, AND...

METHOD FOR BONDING A HERMETIC MODULE TO AN ELECTRODE ARRAY

STACKED MICROFEATURE DEVICES AND ASSOCIATED METHODS

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

ELECTRONIC DEVICE WITH BIMETALLIC INTERFACE ELEMENT FOR WIRE BONDING

Semiconductor Component, Semiconductor Module and Methods for Produ...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

METHOD FOR CREATING A CONNECTION BETWEEN METALLIC MOULDED BODIES AN...

POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTIN...

COPPER WIRE BONDING STRUCTURE IN SEMICONDUCTOR DEVICE AND FABRICATI...

Package-In-Packages and Methods of Formation Thereof

SEMICONDUCTOR CONSTRUCT AND MANUFACTURING METHOD THEREOF AS WELL AS...

SEMICONDUCTOR DEVICE