Packages or encapsulation

Industry

CPC
B81B7/0032

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81BMICRO-STRUCTURAL DEVICES OR SYSTEMS B81B7/00Micro-structural systems; Auxiliary parts of micro-structural devices or systems

Current Industry

B81B7/0032Packages or encapsulation

Industries

Patents Grantslast 30 patents

Information Patent Grant
MEMS chip assembly having multiple trenches
- Patent number 12,059,898
- Issue date Aug 13, 2024
- Memjet Technology Limited
- Elmer Dimaculangan Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric MEMS microphone
- Patent number 12,058,939
- Issue date Aug 6, 2024
- The Regents of the University of Michigan
- Karl Grosh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low-height optoelectronic modules and packages
- Patent number 12,037,238
- Issue date Jul 16, 2024
- ams Sensors Singapore Pte. Ltd.
- Javier Miguel Sànchez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Lid, MEMS sensor component and methods of manufacturing
- Patent number 11,956,579
- Issue date Apr 9, 2024
- TDK Corporation
- Wolfgang Pahl
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Packaging structure and method of MEMS pressure sensor
- Patent number 11,953,392
- Issue date Apr 9, 2024
- Wuxi Sencoch Semiconductor Co., Ltd.
- Tongqing Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadless pressure sensors
- Patent number 11,867,583
- Issue date Jan 9, 2024
- Honeywell International Inc.
- Manjesh Kumar B
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Non-planar ingress protection element for a sensor device
- Patent number 11,838,708
- Issue date Dec 5, 2023
- Knowles Electronics, LLC
- John J. Albers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 11,784,110
- Issue date Oct 10, 2023
- Advanced Semiconductor Engineering, Inc.
- Chung Hao Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for packaging the same
- Patent number 11,765,528
- Issue date Sep 19, 2023
- LITE-ON SINGAPORE PTE. LTD.
- Guang-Li Song
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electronic apparatus including semiconductor package
- Patent number 11,691,869
- Issue date Jul 4, 2023
- Denso Corporation
- Suguru Hochi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging structure and manufacturing method therefor
- Patent number 11,667,518
- Issue date Jun 6, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan Qin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric MEMS microphone
- Patent number 11,665,968
- Issue date May 30, 2023
- The Regents of the University of Michigan
- Karl Grosh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Leadless pressure sensors
- Patent number 11,519,800
- Issue date Dec 6, 2022
- Honeywell International Inc.
- Manjesh Kumar B
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wire bonding between isolation capacitors for multichip modules
- Patent number 11,495,553
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Thomas Dyer Bonifield
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Fence structure to prevent stiction in a MEMS motion sensor
- Patent number 11,261,083
- Issue date Mar 1, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Lee-Chuan Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mold material architecture for package device structures
- Patent number 11,254,563
- Issue date Feb 22, 2022
- Intel Corporation
- Omkar G. Karhade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package structure and method for manufacturing the same
- Patent number 11,217,499
- Issue date Jan 4, 2022
- Advanced Semiconductor Engineering, Inc.
- Chi Sheng Tseng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Micromechanical device including a covering bond frame
- Patent number 11,214,482
- Issue date Jan 4, 2022
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated MEMS cavity seal
- Patent number 11,174,151
- Issue date Nov 16, 2021
- Invensense, Inc.
- Ian Flader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging for a MEMS transducer
- Patent number 11,172,314
- Issue date Nov 9, 2021
- Cirrus Logic, Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Piezoelectric MEMS microphone
- Patent number 10,964,880
- Issue date Mar 30, 2021
- The Regents of the University of Michigan
- Karl Grosh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for operating an integrated MEMS microphone device and integ...
- Patent number 10,959,002
- Issue date Mar 23, 2021
- ams AG
- Naoaki Nishimura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Thin-film type package
- Patent number 10,903,816
- Issue date Jan 26, 2021
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wook Park
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stressed decoupled micro-electro-mechanical system sensor
- Patent number 10,870,575
- Issue date Dec 22, 2020
- Infineon Technologies Dresden GmbH & Co. KG
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inkjet printhead with encapsulant-retaining features
- Patent number 10,864,733
- Issue date Dec 15, 2020
- Memjet Technology Limited
- Elmer Dimaculangan Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 10,854,533
- Issue date Dec 1, 2020
- Advanced Semiconductor Engineering, Inc.
- Chung Hao Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inkjet printhead with grout retaining features
- Patent number 10,850,517
- Issue date Dec 1, 2020
- Memjet Technology Limited
- Elmer Dimaculangan Perez
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Packaging of microelectromechanical system devices
- Publication number 20240391762
- Publication date Nov 28, 2024
- Teknologian Tutkimuskeskus VTT Oy
- Jae-Wung Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE
- Publication number 20240166499
- Publication date May 23, 2024
- Murata Manufacturing Co., Ltd.
- Mikko PARTANEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED DEVICE PACKAGE
- Publication number 20240118131
- Publication date Apr 11, 2024
- Analog Devices International Unlimited Company
- Johnny Solana Gealon
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Packaging Structure and Method of MEMS Pressure Sensor
- Publication number 20240094079
- Publication date Mar 21, 2024
- Wuxi Sencoch Semiconductor Co., Ltd.
- Tongqing Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS RELAY WITH SAFETY FUNCTION
- Publication number 20240038472
- Publication date Feb 1, 2024
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MEMS MICROPHONE
- Publication number 20230337544
- Publication date Oct 19, 2023
- The Regents of the University of Michigan
- Karl Grosh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SUBSTRATES, FABRICATION METHODS THEREOF and MICRO-ELE...
- Publication number 20230172068
- Publication date Jun 1, 2023
- Vanguard International Semiconductor Corporation
- RAKESH CHAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSING MODULE
- Publication number 20230117559
- Publication date Apr 20, 2023
- Coretronic MEMS Corporation
- Mei-Ling Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADLESS PRESSURE SENSORS
- Publication number 20230086677
- Publication date Mar 23, 2023
- HONEYWELL INTERNATIONAL INC.
- Manjesh Kumar B
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE MOUNTED ON A SYSTEM BOARD
- Publication number 20220373783
- Publication date Nov 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Paul Lawrence Rancuret
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Lid, MEMS Sensor Component and Methods of Manufacturing
- Publication number 20220329924
- Publication date Oct 13, 2022
- TDK Corporation
- Wolfgang Pahl
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MULTI FREQUENCY ACOUSTIC EMISSION MICROMACHINED TRANSDUCERS FOR NON...
- Publication number 20220326188
- Publication date Oct 13, 2022
- THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
- Didem Ozevin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
NON-PLANNAR INGRESS PROTECTION ELEMENT FOR A SENSOR DEVICE
- Publication number 20220150609
- Publication date May 12, 2022
- KNOWLES ELECTRONICS, LLC
- John J Albers
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC APPARATUS INCLUDING SEMICONDUCTOR PACKAGE
- Publication number 20220081283
- Publication date Mar 17, 2022
- DENSO CORPORATION
- Suguru HOCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT
- Publication number 20220033249
- Publication date Feb 3, 2022
- INFINEON TECHNOLOGIES AG
- Andre BROCKMEIER
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MEMS MICROPHONE
- Publication number 20210273152
- Publication date Sep 2, 2021
- The Regents of the University of Michigan
- Karl Grosh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LEADLESS PRESSURE SENSORS
- Publication number 20210199526
- Publication date Jul 1, 2021
- HONEYWELL INTERNATIONAL INC.
- Manjesh Kumar B
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20210082788
- Publication date Mar 18, 2021
- Advanced Semiconductor Engineering, Inc.
- Chung Hao CHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200351596
- Publication date Nov 5, 2020
- SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
- JIAN-WEN HU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING FOR A MEMS TRANSDUCER
- Publication number 20200304923
- Publication date Sep 24, 2020
- Cirrus Logic International Semiconductor Ltd.
- Roberto BRIOSCHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR OPERATING AN INTEGRATED MEMS MICROPHONE DEVICE AND INTEG...
- Publication number 20200275178
- Publication date Aug 27, 2020
- ams AG
- Naoaki NISHIMURA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROMECHANICAL DEVICE INCLUDING A COVERING BOND FRAME
- Publication number 20200223685
- Publication date Jul 16, 2020
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM
- Publication number 20200216310
- Publication date Jul 9, 2020
- Kionix, Inc.
- Andrew Hocking
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING PACKAGED MEMS ASSEMBLIES AT THE WAFER LEVEL, A...
- Publication number 20200156933
- Publication date May 21, 2020
- INFINEON TECHNOLOGIES AG
- Matthias Steiert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PIEZOELECTRIC MEMS MICROPHONE
- Publication number 20200148532
- Publication date May 14, 2020
- The Regents of the University of Michigan
- Karl Grosh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20200140268
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
THIN-FILM TYPE PACKAGE
- Publication number 20200144986
- Publication date May 7, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wook PARK
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20200140267
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Packages or encapsulation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS chip assembly having multiple trenches

Piezoelectric MEMS microphone

Low-height optoelectronic modules and packages

Lid, MEMS sensor component and methods of manufacturing

Packaging structure and method of MEMS pressure sensor

Leadless pressure sensors

Non-planar ingress protection element for a sensor device

Semiconductor package and method for manufacturing the same

Sensing device and method for packaging the same

Eutectic bonding with AlGe

Electronic apparatus including semiconductor package

MEMS packaging structure and manufacturing method therefor

Piezoelectric MEMS microphone

Leadless pressure sensors

Wire bonding between isolation capacitors for multichip modules

Seal for microelectronic assembly

Fence structure to prevent stiction in a MEMS motion sensor

Mold material architecture for package device structures

Seal for microelectronic assembly

Semiconductor package structure and method for manufacturing the same

Micromechanical device including a covering bond frame

Integrated MEMS cavity seal

Packaging for a MEMS transducer

Piezoelectric MEMS microphone

Method for operating an integrated MEMS microphone device and integ...

Thin-film type package

Stressed decoupled micro-electro-mechanical system sensor

Inkjet printhead with encapsulant-retaining features

Semiconductor package and method for manufacturing the same

Inkjet printhead with grout retaining features

Patents Applicationslast 30 patents

Packaging of microelectromechanical system devices

METHOD FOR BONDING A MICROELECTROMECHANICAL DEVICE

INTEGRATED DEVICE PACKAGE

Packaging Structure and Method of MEMS Pressure Sensor

MEMS RELAY WITH SAFETY FUNCTION

SEAL FOR MICROELECTRONIC ASSEMBLY

PIEZOELECTRIC MEMS MICROPHONE

SEMICONDUCTOR SUBSTRATES, FABRICATION METHODS THEREOF and MICRO-ELE...

SENSING MODULE

LEADLESS PRESSURE SENSORS

SEAL FOR MICROELECTRONIC ASSEMBLY

SEMICONDUCTOR DEVICE MOUNTED ON A SYSTEM BOARD

Lid, MEMS Sensor Component and Methods of Manufacturing

MULTI FREQUENCY ACOUSTIC EMISSION MICROMACHINED TRANSDUCERS FOR NON...

NON-PLANNAR INGRESS PROTECTION ELEMENT FOR A SENSOR DEVICE

ELECTRONIC APPARATUS INCLUDING SEMICONDUCTOR PACKAGE

MEMS SENSOR WITH PARTICLE FILTER AND METHOD FOR PRODUCING IT

PIEZOELECTRIC MEMS MICROPHONE

LEADLESS PRESSURE SENSORS

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

MICROPHONE DEVICE AND METHOD FOR MANUFACTURING SAME

PACKAGING FOR A MEMS TRANSDUCER

METHOD FOR OPERATING AN INTEGRATED MEMS MICROPHONE DEVICE AND INTEG...

MICROMECHANICAL DEVICE INCLUDING A COVERING BOND FRAME

ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM

METHOD FOR PRODUCING PACKAGED MEMS ASSEMBLIES AT THE WAFER LEVEL, A...

PIEZOELECTRIC MEMS MICROPHONE

SEAL FOR MICROELECTRONIC ASSEMBLY

THIN-FILM TYPE PACKAGE

SEAL FOR MICROELECTRONIC ASSEMBLY