TREA

Packaging together an electronic processing unit die and a micromechanical structure die

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Industry

  • CPC
  • B81C1/0023
This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/0023Packaging together an electronic processing unit die and a micromechanical structure die
Industries