Packaging together an electronic processing unit die and a micromechanical structure die

Industry

CPC
B81C1/0023

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/0023Packaging together an electronic processing unit die and a micromechanical structure die

Industries

Patents Grantslast 30 patents

Information Patent Grant
MEMS device having a metallization structure embedded in a dielectr...
- Patent number 11,932,534
- Issue date Mar 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Signal processing circuit for triple-membrane MEMS device
- Patent number 11,932,533
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,919,769
- Issue date Mar 5, 2024
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Digital microphone with over-voltage protection
- Patent number 11,897,762
- Issue date Feb 13, 2024
- Knowles Electronics, LLC
- Deepak Bharadwaj
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing microelectromechanical devices, in partic...
- Patent number 11,891,298
- Issue date Feb 6, 2024
- STMicroelectronics S.r.l.
- Fabio Quaglia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Root mean square sensor device
- Patent number 11,884,538
- Issue date Jan 30, 2024
- Texas Instruments Incorporated
- Marco Corsi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for wafer bonding
- Patent number 11,851,325
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Wei Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogenous integration of complementary metal-oxide-semiconductor...
- Patent number 11,845,653
- Issue date Dec 19, 2023
- MERIDIAN INNOVATION PTE LTD
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated piezoelectric microelectromechanical ultrasound transduc...
- Patent number 11,847,851
- Issue date Dec 19, 2023
- Invensense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducers and related apparatus and me...
- Patent number 11,828,729
- Issue date Nov 28, 2023
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite structures
- Patent number 11,814,284
- Issue date Nov 14, 2023
- Cirrus Logic Inc.
- Roberto Brioschi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Support structure for MEMS device with particle filter
- Patent number 11,807,521
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Wen Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bonding process for forming semiconductor device structure
- Patent number 11,772,963
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensing device and method for packaging the same
- Patent number 11,765,528
- Issue date Sep 19, 2023
- LITE-ON SINGAPORE PTE. LTD.
- Guang-Li Song
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging method and associated packaging structure
- Patent number 11,713,241
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,708,264
- Issue date Jul 25, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Low stress integrated device package
- Patent number 11,702,335
- Issue date Jul 18, 2023
- Analog Devices, Inc.
- Yeonsung Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packages and methods of manufacture thereof
- Patent number 11,685,648
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method for a micromechanical component, a correspondi...
- Patent number 11,667,520
- Issue date Jun 6, 2023
- Robert Bosch GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS packaging structure and manufacturing method therefor
- Patent number 11,667,518
- Issue date Jun 6, 2023
- NINGBO SEMICONDUCTOR INTERNATIONAL CORPORATION (SHANGHAI BRANCH)
- Xiaoshan Qin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Particle filter for MEMS device
- Patent number 11,649,162
- Issue date May 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductive structure and manufacturing method thereof
- Patent number 11,591,211
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yen-Cheng Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microfabricated ultrasonic transducer having individual cells with...
- Patent number 11,559,827
- Issue date Jan 24, 2023
- BFLY OPERATIONS, INC.
- Susan A. Alie
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Sensor with dimple features and improved out-of-plane stiction
- Patent number 11,542,154
- Issue date Jan 3, 2023
- Invensense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked semiconductor structure and method of forming the same
- Patent number 11,498,832
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged pressure sensor device
- Patent number 11,427,464
- Issue date Aug 30, 2022
- NXP USA, INC.
- Weng Foong Yap
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Inter-poly connection for parasitic capacitor and die size improvement
- Patent number 11,407,636
- Issue date Aug 9, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Process for manufacturing microelectromechanical devices, in partic...
- Patent number 11,383,971
- Issue date Jul 12, 2022
- STMicroelectronics S.r.l.
- Fabio Quaglia
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Stacked-die MEMS resonator
- Patent number 11,370,656
- Issue date Jun 28, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 11,370,655
- Issue date Jun 28, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MICROMECHANICAL SENSOR WITH INTEGRATED STRESS SENSOR AND METHOD FOR...
- Publication number 20240142490
- Publication date May 2, 2024
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...
- Publication number 20240140783
- Publication date May 2, 2024
- STMicroelectronics S.r.l.
- Mark Andrew SHAW
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...
- Publication number 20240044846
- Publication date Feb 8, 2024
- BFLY OPERATIONS, INC.
- Jonathan M. Rothberg
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...
- Publication number 20230406697
- Publication date Dec 21, 2023
- ROBERT BOSCH GmbH
- Mohammad Abbasi Gavarti
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20230391611
- Publication date Dec 7, 2023
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20230365402
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20230357002
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...
- Publication number 20230302495
- Publication date Sep 28, 2023
- Feng Yin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Packages and Methods of Manufacture Thereof
- Publication number 20230278857
- Publication date Sep 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR
- Publication number 20230166967
- Publication date Jun 1, 2023
- Rohm Co., Ltd.
- Daisuke KAMINISHI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20230100960
- Publication date Mar 30, 2023
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Transferring a Layer to a Substrate
- Publication number 20220396067
- Publication date Dec 15, 2022
- IMEC vzw
- Boshen Liang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Stacked Semiconductor Structure and Method of Forming the Same
- Publication number 20220380208
- Publication date Dec 1, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.,
- Chia-Hua Chu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STACKED-DIE MEMS RESONATOR
- Publication number 20220356059
- Publication date Nov 10, 2022
- SiTime Corporation
- Pavan Gupta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIGITAL MICROPHONE WITH OVER-VOLTAGE PROTECTION
- Publication number 20220348458
- Publication date Nov 3, 2022
- Knowles Electronics, LLC
- Deepak Bharadwaj
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT
- Publication number 20220348454
- Publication date Nov 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shyh-Wei Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES, IN PARTIC...
- Publication number 20220306456
- Publication date Sep 29, 2022
- STMicroelectronics S.r.l.
- Fabio QUAGLIA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION
- Publication number 20220298009
- Publication date Sep 22, 2022
- InvenSense, Inc.
- Ashfaque Uddin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Microelectromechanical S...
- Publication number 20220289560
- Publication date Sep 15, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Sensor Arrangement and Method for Fabricating A Sensor Arrangement
- Publication number 20220260446
- Publication date Aug 18, 2022
- Sciosense B.V.
- Willem Frederik Adrianus Besling
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...
- Publication number 20220223554
- Publication date Jul 14, 2022
- ams AG
- Jens Hofrichter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...
- Publication number 20220204340
- Publication date Jun 30, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hung-Hua Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Signal Processing Circuit for Triple-Membrane MEMS Device
- Publication number 20220194784
- Publication date Jun 23, 2022
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
LOW STRESS INTEGRATED DEVICE PACKAGE
- Publication number 20220177298
- Publication date Jun 9, 2022
- Analog Devices, Inc.
- Yeonsung Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER
- Publication number 20220177296
- Publication date Jun 9, 2022
- Hewlett-Packard Development Company, L.P.
- Stanley J. Wang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...
- Publication number 20220172506
- Publication date Jun 2, 2022
- InvenSense, Inc.
- Julius Ming-Lin Tsai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...
- Publication number 20220162062
- Publication date May 26, 2022
- Meridian Innovation Pte Ltd
- Wan Chia Ang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE
- Publication number 20220063993
- Publication date Mar 3, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Chang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT, A CORRESPONDI...
- Publication number 20220041432
- Publication date Feb 10, 2022
- ROBERT BOSCH GmbH
- Johannes Classen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE
- Publication number 20220017363
- Publication date Jan 20, 2022
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Chen
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Packaging together an electronic processing unit die and a micromechanical structure die

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

MEMS device having a metallization structure embedded in a dielectr...

Signal processing circuit for triple-membrane MEMS device

Sensor with dimple features and improved out-of-plane stiction

Digital microphone with over-voltage protection

Process for manufacturing microelectromechanical devices, in partic...

Root mean square sensor device

Methods for wafer bonding

Heterogenous integration of complementary metal-oxide-semiconductor...

Integrated piezoelectric microelectromechanical ultrasound transduc...

Microfabricated ultrasonic transducers and related apparatus and me...

Composite structures

Support structure for MEMS device with particle filter

Bonding process for forming semiconductor device structure

Sensing device and method for packaging the same

Packaging method and associated packaging structure

Stacked-die MEMS resonator

Low stress integrated device package

MEMS packages and methods of manufacture thereof

Manufacturing method for a micromechanical component, a correspondi...

MEMS packaging structure and manufacturing method therefor

Particle filter for MEMS device

Semiconductive structure and manufacturing method thereof

Microfabricated ultrasonic transducer having individual cells with...

Sensor with dimple features and improved out-of-plane stiction

Stacked semiconductor structure and method of forming the same

Packaged pressure sensor device

Inter-poly connection for parasitic capacitor and die size improvement

Process for manufacturing microelectromechanical devices, in partic...

Stacked-die MEMS resonator

Semiconductor device and method of forming microelectromechanical s...

Patents Applicationslast 30 patents

MICROMECHANICAL SENSOR WITH INTEGRATED STRESS SENSOR AND METHOD FOR...

METHOD FOR MANUFACTURING A DEVICE COMPRISING TWO SEMICONDUCTOR DICE...

MICROFABRICATED ULTRASONIC TRANSDUCERS AND RELATED APPARATUS AND ME...

PRODUCTION METHOD FOR A MICROMECHANICAL SENSOR APPARATUS, AND CORRE...

STACKED-DIE MEMS RESONATOR

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE

CMUT-on-CMOS Ultrasonic Transducer by Bonding Active Wafers and Man...

MEMS Packages and Methods of Manufacture Thereof

MEMS SENSOR AND METHOD OF MANUFACTURING MEMS SENSOR

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

Method for Transferring a Layer to a Substrate

Stacked Semiconductor Structure and Method of Forming the Same

STACKED-DIE MEMS RESONATOR

DIGITAL MICROPHONE WITH OVER-VOLTAGE PROTECTION

INTER-POLY CONNECTION FOR PARASITIC CAPACITOR AND DIE SIZE IMPROVEMENT

PROCESS FOR MANUFACTURING MICROELECTROMECHANICAL DEVICES, IN PARTIC...

SENSOR WITH DIMPLE FEATURES AND IMPROVED OUT-OF-PLANE STICTION

Semiconductor Device and Method of Forming Microelectromechanical S...

Sensor Arrangement and Method for Fabricating A Sensor Arrangement

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR D...

METHOD FOR MANUFACTURING A MEMS DEVICE BY FIRST HYBRID BONDING A CM...

Signal Processing Circuit for Triple-Membrane MEMS Device

LOW STRESS INTEGRATED DEVICE PACKAGE

EPITAXIAL-SILICON WAFER WITH A BURIED OXIDE LAYER

INTEGRATED PIEZOELECTRIC MICROELECTROMECHANICAL ULTRASOUND TRANSDUC...

HETEROGENOUS INTEGRATION OF COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR...

BONDING PROCESS FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE

MANUFACTURING METHOD FOR A MICROMECHANICAL COMPONENT, A CORRESPONDI...

PACKAGING METHOD AND ASSOCIATED PACKAGING STRUCTURE