Palladium [Pd] as principal constituent

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CPC
H01L2224/29164

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/29164Palladium [Pd] as principal constituent

Industries

Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 12,119,263
- Issue date Oct 15, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 12,051,669
- Issue date Jul 30, 2024
- Wolfspeed, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layer structure with an intermetallic phase layer and a chip packag...
- Patent number 12,023,762
- Issue date Jul 2, 2024
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material with two different size nickel particles
- Patent number 11,552,042
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Connection structure and method for producing same
- Patent number 11,355,469
- Issue date Jun 7, 2022
- SHOWA DENKO MATERIALS CO., LTD.
- Tetsuyuki Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact and die attach metallization for silicon carbide based devi...
- Patent number 11,152,325
- Issue date Oct 19, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for an improved integrated circuit package
- Patent number 11,004,742
- Issue date May 11, 2021
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for creating a bond between objects based on f...
- Patent number 10,923,454
- Issue date Feb 16, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and dicing method
- Patent number 10,784,165
- Issue date Sep 22, 2020
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,333
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,770,332
- Issue date Sep 8, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper paste for joining, method for manufacturing joined body, and...
- Patent number 10,748,865
- Issue date Aug 18, 2020
- Hitachi Chemical Company, Ltd.
- Yuki Kawana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,707,111
- Issue date Jul 7, 2020
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state wafer bonding of functional materials on substrates and...
- Patent number 10,679,964
- Issue date Jun 9, 2020
- The Regents of the University of California
- Shadi A. Dayeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding semiconductor elements and junction structure
- Patent number 10,608,136
- Issue date Mar 31, 2020
- National Institute of Advanced Industrial Science and Technology
- Hidenori Mizuno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,580,723
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 10,522,447
- Issue date Dec 31, 2019
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder joining
- Patent number 10,504,868
- Issue date Dec 10, 2019
- Fuji Electric Co., Ltd.
- Hirohiko Watanabe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for producing a device
- Patent number 10,431,715
- Issue date Oct 1, 2019
- Osram Opto Semiconductors GmbH
- Barbara Behr
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,366,947
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method for producing bonding structure
- Patent number 10,332,853
- Issue date Jun 25, 2019
- Osaka University
- Katsuaki Suganuma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level flat no-lead semiconductor packages and methods of manu...
- Patent number 10,269,609
- Issue date Apr 23, 2019
- Semiconductor Components Industries, LLC
- Darrell D. Truhitte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and method for producing a device
- Patent number 10,204,880
- Issue date Feb 12, 2019
- Osram Opto Semiconductors GmbH
- Barbara Behr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 10,153,266
- Issue date Dec 11, 2018
- Infineon Technologies AG
- Thomas Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising fluid cooling channel and method of ma...
- Patent number 10,037,972
- Issue date Jul 31, 2018
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin-encapsulated semiconductor device
- Patent number 9,935,030
- Issue date Apr 3, 2018
- SII Semiconductor Corporation
- Noriyuki Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and a wafer level package
- Patent number 9,917,036
- Issue date Mar 13, 2018
- Infineon Technologies AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT
- Publication number 20240335912
- Publication date Oct 10, 2024
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240266310
- Publication date Aug 8, 2024
- Mitsubishi Electric Corporation
- Tsuyoshi TANIGAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE
- Publication number 20240213382
- Publication date Jun 27, 2024
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Patrick LE MAITRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...
- Publication number 20240170434
- Publication date May 23, 2024
- AG MATERIALS TECHNOLOGY CO., LTD.
- Chien-Hsun CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REFLECTORS FOR SUPPORT STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES
- Publication number 20240120452
- Publication date Apr 11, 2024
- CreeLED, Inc.
- Derek Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
- Publication number 20230387095
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Jaeseok Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY PANEL
- Publication number 20230112531
- Publication date Apr 13, 2023
- AU OPTRONICS CORPORATION
- Yang-En Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...
- Publication number 20230090030
- Publication date Mar 23, 2023
- AG MATERIALS TECHNOLOGY CO., LTD.
- Tung-Han CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20220028821
- Publication date Jan 27, 2022
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE
- Publication number 20210265214
- Publication date Aug 26, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...
- Publication number 20210167035
- Publication date Jun 3, 2021
- Seyed Amir Paknejad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...
- Publication number 20210057370
- Publication date Feb 25, 2021
- Cree, Inc.
- Alexander Komposch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME
- Publication number 20200321305
- Publication date Oct 8, 2020
- Hitachi Chemical Company, Ltd.
- Tetsuyuki SHIRAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...
- Publication number 20200176411
- Publication date Jun 4, 2020
- Hitachi Chemical Company, Ltd.
- Yuki KAWANA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SEMICONDUCTOR DEVICE AND DICING METHOD
- Publication number 20190267288
- Publication date Aug 29, 2019
- Kabushiki Kaisha Toshiba
- Shingo Masuko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180374812
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE
- Publication number 20180269135
- Publication date Sep 20, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device and Method for Producing a Device
- Publication number 20180261564
- Publication date Sep 13, 2018
- Osram Opto Semiconductors GmbH
- Barbara Behr
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...
- Publication number 20180174881
- Publication date Jun 21, 2018
- Semiconductor Components Industries, LLC
- Darrell D. TRUHITTE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND A WAFER LEVEL PACKAGE
- Publication number 20180158759
- Publication date Jun 7, 2018
- INFINEON TECHNOLOGIES AG
- Georg Meyer-Berg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180076164
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC With Solderable Sidewalls
- Publication number 20170365575
- Publication date Dec 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING
- Publication number 20170317046
- Publication date Nov 2, 2017
- Indium Corporation
- Sihai Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...
- Publication number 20170317050
- Publication date Nov 2, 2017
- The Regents of the University of California
- Shadi A. Dayeh
- G02 - OPTICS
Information Patent Application
DIE AND SUBSTRATE ASSEMBLY WITH GRADED DENSITY BONDING LAYER
- Publication number 20170294397
- Publication date Oct 12, 2017
- HAMILTON SUNDSTRAND CORPORATION
- Paul F. Croteau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CONNECTING COMPONENTS BY PRESSURE SINTERING
- Publication number 20170239728
- Publication date Aug 24, 2017
- Heraeus Deutschland GmbH & Co. KG
- Michael SCHÄFER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Packaged IC with Solderable Sidewalls
- Publication number 20170162530
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES
- Publication number 20170062315
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN-ENCAPSULATD SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...
- Publication number 20170025320
- Publication date Jan 26, 2017
- SII Semiconductor Corporation
- Noriyuki KIMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES WITH ATTACHED DIE STRUCTURES AND METHODS OF FORM...
- Publication number 20160365323
- Publication date Dec 15, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS

Palladium [Pd] as principal constituent

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Methods and apparatus for an improved integrated circuit package

Contact and die attach metallization for silicon carbide based devi...

Layer structure with an intermetallic phase layer and a chip packag...

Solder material with two different size nickel particles

Connection structure and method for producing same

Contact and die attach metallization for silicon carbide based devi...

Methods and apparatus for an improved integrated circuit package

Method and apparatus for creating a bond between objects based on f...

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Semiconductor device and dicing method

Wafer level flat no-lead semiconductor packages and methods of manu...

Wafer level flat no-lead semiconductor packages and methods of manu...

Copper paste for joining, method for manufacturing joined body, and...

Wafer level flat no-lead semiconductor packages and methods of manu...

Solid-state wafer bonding of functional materials on substrates and...

Method of bonding semiconductor elements and junction structure

Flat no-lead packages with electroplated edges

Chip package and a wafer level package

Solder joining

Device and method for producing a device

Flat no-lead packages with electroplated edges

Bonding structure and method for producing bonding structure

Wafer level flat no-lead semiconductor packages and methods of manu...

Device and method for producing a device

Semiconductor device

Electronic module comprising fluid cooling channel and method of ma...

Resin-encapsulated semiconductor device

Chip package and a wafer level package

Patents Applicationslast 30 patents

METHOD OF FORMING A LAYER STRUCTURE, CHIP PACKAGE AND CHIP ARRANGEMENT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

OPTOELECTRONIC SYSTEM COMPRISING A TRANSDUCER AND A WAVEGUIDE

BACK SIDE METALLIZATION THIN FILM STRUCTURE AND METHOD FOR FORMING...

REFLECTORS FOR SUPPORT STRUCTURES IN LIGHT-EMITTING DIODE PACKAGES

DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME

DISPLAY PANEL

NANO-TWINNED STRUCTURE ON METALLIC THIN FILM SURFACE AND METHOD FOR...

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE

METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON F...

CONTACT AND DIE ATTACH METALLIZATION FOR SILICON CARBIDE BASED DEVI...

CONNECTION STRUCTURE AND METHOD FOR PRODUCING SAME

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND...

SEMICONDUCTOR DEVICE AND DICING METHOD

METHOD OF FORMING SOLDER BUMPS

METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE

Device and Method for Producing a Device

WAFER LEVEL FLAT NO-LEAD SEMICONDUCTOR PACKAGES AND METHODS OF MANU...

CHIP PACKAGE AND A WAFER LEVEL PACKAGE

METHOD OF FORMING SOLDER BUMPS

Packaged IC With Solderable Sidewalls

NANOMICROCRYSTALLITE PASTE FOR PRESSURELESS SINTERING

SOLID-STATE WAFER BONDING OF FUNCTIONAL MATERIALS ON SUBSTRATES AND...

DIE AND SUBSTRATE ASSEMBLY WITH GRADED DENSITY BONDING LAYER

METHOD FOR CONNECTING COMPONENTS BY PRESSURE SINTERING

Packaged IC with Solderable Sidewalls

FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES

RESIN-ENCAPSULATD SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING...

ELECTRONIC DEVICES WITH ATTACHED DIE STRUCTURES AND METHODS OF FORM...