Plated through-holes or plated via connections

Industry

CPC
H05K3/42

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Parent Industries

HELECTRICITY H05Electric techniques H05KPRINTED CIRCUITS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS H05K3/00Apparatus or processes for manufacturing printed circuits

Current Industry

H05K3/42Plated through-holes or plated via connections

Industries

Patents Grantslast 30 patents

Information Patent Grant
Circuit board with heat dissipation structure and method for manufa...
- Patent number 11,979,977
- Issue date May 7, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Hsiao-Ting Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method to manufacture conductive anodic filament-resistant microvias
- Patent number 11,968,780
- Issue date Apr 23, 2024
- International Business Machines Corporation
- Kyle Indukummar Giesen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board structure including a closed cavity
- Patent number 11,967,758
- Issue date Apr 23, 2024
- Skyworks Solutions, Inc.
- Ki Wook Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional (3D) copper in printed circuit boards
- Patent number 11,956,898
- Issue date Apr 9, 2024
- Apple Inc.
- Anne M. Mason
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mating backplane for high speed, high density electrical connector
- Patent number 11,950,356
- Issue date Apr 2, 2024
- Amphenol Corporation
- Mark W. Gailus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board for transmitting high-frequency signal and method for...
- Patent number 11,950,357
- Issue date Apr 2, 2024
- QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD
- Fu-Yun Shen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board preparation method
- Patent number 11,937,377
- Issue date Mar 19, 2024
- SHENNAN CIRCUITS CO., LTD.
- Changsheng Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package component and forming method thereof
- Patent number 11,924,965
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chun-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Single-layer circuit board, multi-layer circuit board, and manufact...
- Patent number 11,917,768
- Issue date Feb 27, 2024
- RICHVIEW ELECTRONICS CO., LTD.
- Siping Bai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed circuit board stack structure and manufacturing method thereof
- Patent number 11,910,535
- Issue date Feb 20, 2024
- Unimicron Technology Corp.
- Ming-Hao Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and device for plating a recess in a substrate
- Patent number 11,908,698
- Issue date Feb 20, 2024
- SEMSYSCO GMBH
- Franz Markut
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Structure for embedding and packaging multiple devices by layer and...
- Patent number 11,903,133
- Issue date Feb 13, 2024
- Zhuhai ACCESS Semiconductor Co., Ltd
- Xianming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interlayer connective structure of wiring board and method of manuf...
- Patent number 11,895,772
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Chi-Min Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for high-speed signal layer transition
- Patent number 11,889,617
- Issue date Jan 30, 2024
- BAIDU USA LLC
- Zhenwei Yu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method for manufacturing wiring substrate
- Patent number 11,882,656
- Issue date Jan 23, 2024
- Ibiden Co., Ltd.
- Takema Adachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Continuous interconnects between heterogeneous materials
- Patent number 11,882,653
- Issue date Jan 23, 2024
- Liquid Wire Inc.
- Mark William Ronay
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Glass core multilayer wiring board and method of producing the same
- Patent number 11,877,394
- Issue date Jan 16, 2024
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Feature casting for manufacture observation
- Patent number 11,872,729
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Sarah K. Czaplewski
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Packaging structure with embedded electronic components and method...
- Patent number 11,864,329
- Issue date Jan 2, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
- Chih-Chieh Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated metallization structures
- Patent number 11,862,518
- Issue date Jan 2, 2024
- Analog Devices International Unlimited Company
- Jan Kubik
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming through-hole, and substrate for flexible printed...
- Patent number 11,856,695
- Issue date Dec 26, 2023
- Nippon Mektron, Ltd.
- Toshihiro Higashira
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with gradiated dielectric for reducing impedance mismatch
- Patent number 11,837,458
- Issue date Dec 5, 2023
- Intel Corporation
- Jackson Chung Peng Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 11,832,397
- Issue date Nov 28, 2023
- Ibiden Co., Ltd.
- Masashi Awazu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated film structure and method for manufacturing laminated fil...
- Patent number 11,825,608
- Issue date Nov 21, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuya Shimada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Increasing adhesion of metal-organic interfaces by silane vapor tre...
- Patent number 11,818,849
- Issue date Nov 14, 2023
- YIELD ENGINEERING SYSTEMS, INC.
- Kenneth Sautter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resist layer forming method, method for manufacturing wiring board,...
- Patent number 11,818,847
- Issue date Nov 14, 2023
- Shinko Electric Industries Co., Ltd.
- Yoshihisa Kanbe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Backplane footprint for high speed, high density electrical connectors
- Patent number 11,805,595
- Issue date Oct 31, 2023
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic substrate having differential coaxial vias
- Patent number 11,800,636
- Issue date Oct 24, 2023
- Texas Instruments Incorporated
- Snehamay Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, semiconductor device and method of manufacturing cir...
- Patent number 11,792,920
- Issue date Oct 17, 2023
- Shinko Electric Industries Co., Ltd.
- Shinichiro Sekijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with buried component and manufacture method thereof
- Patent number 11,792,939
- Issue date Oct 17, 2023
- Unimicron Technology Corp.
- Yu-Shen Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME
- Publication number 20240155760
- Publication date May 9, 2024
- Shinko Electric Industries Co., Ltd.
- Yuji YUKIIRI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...
- Publication number 20240155770
- Publication date May 9, 2024
- Rogers Germany GmbH
- Andreas MEYER
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240155776
- Publication date May 9, 2024
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20240155777
- Publication date May 9, 2024
- InnoLux Corporation
- Yuan-Lin WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240133039
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
- Publication number 20240132441
- Publication date Apr 25, 2024
- YMT CO., LTD.
- Sung Wook CHUN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...
- Publication number 20240121888
- Publication date Apr 11, 2024
- Vayyar Imaging Ltd.
- Rohi HALIMI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20240121898
- Publication date Apr 11, 2024
- Sumitomo Electric Industries, Ltd.
- Yosuke FUKAYA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD
- Publication number 20240114625
- Publication date Apr 4, 2024
- SHENNAN CIRCUITS CO.,LTD.
- Dantian LIN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20240114632
- Publication date Apr 4, 2024
- Unimicron Technology Corp.
- Ming-Hao WU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...
- Publication number 20240107680
- Publication date Mar 28, 2024
- HSU-TUNG CHEN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20240098884
- Publication date Mar 21, 2024
- LG Innotek Co., Ltd.
- Do Hyuk YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FORMING THROUGH-VIA METAL WIRING
- Publication number 20240080993
- Publication date Mar 7, 2024
- EXTOLCO.,LTD.
- Sung Woong KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE
- Publication number 20240074056
- Publication date Feb 29, 2024
- KYOCERA CORPORATION
- Shinri SAEKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
- Publication number 20240030580
- Publication date Jan 25, 2024
- Innolux Corporation
- Chen-Lin Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240032204
- Publication date Jan 25, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yueh-Kai TANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
- Publication number 20240023232
- Publication date Jan 18, 2024
- Amphenol Corporation
- Marc Robert Charbonneau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD
- Publication number 20240015884
- Publication date Jan 11, 2024
- Nitto Denko Corporation
- Shusaku SHIBATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240006748
- Publication date Jan 4, 2024
- HongQiSheng Precision Electronics (QinHuangDao) Co.,Ltd.
- CHIH-CHIEH FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY
- Publication number 20240008186
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Yanyan Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD VIA STRUCTURES WITH REDUCED INSERTION LOSS DI...
- Publication number 20240008180
- Publication date Jan 4, 2024
- Marvell Israel (M.I.S.L) Ltd.
- Liav Ben Artsi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422408
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Jun SAKAI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422406
- Publication date Dec 28, 2023
- IBIDEN CO., LTD.
- Takuya INISHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20230422407
- Publication date Dec 28, 2023
- Sumitomo Electric Industries, Ltd.
- Kenji TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD
- Publication number 20230422412
- Publication date Dec 28, 2023
- TOPPAN INC.
- Akihiro HAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...
- Publication number 20230413451
- Publication date Dec 21, 2023
- Sumitomo Electric Industries, Ltd.
- Shingo NAGATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
- Publication number 20230403793
- Publication date Dec 14, 2023
- KYOCERA CORPORATION
- Yuki TAKESHIMA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for Filing at least One Hole formed in a Printed Circuit Boa...
- Publication number 20230403797
- Publication date Dec 14, 2023
- ITC Intercircuit Electronic GmbH
- Hubertus Hein
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD
- Publication number 20230403790
- Publication date Dec 14, 2023
- LG Innotek Co., Ltd.
- Jung Eun HAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...
- Publication number 20230395395
- Publication date Dec 7, 2023
- TOPPAN INC.
- Takashi KIZU
- H01 - BASIC ELECTRIC ELEMENTS

Plated through-holes or plated via connections

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Circuit board with heat dissipation structure and method for manufa...

Method to manufacture conductive anodic filament-resistant microvias

Printed circuit board structure including a closed cavity

Three-dimensional (3D) copper in printed circuit boards

Mating backplane for high speed, high density electrical connector

Circuit board for transmitting high-frequency signal and method for...

Circuit board preparation method

Package component and forming method thereof

Single-layer circuit board, multi-layer circuit board, and manufact...

Printed circuit board stack structure and manufacturing method thereof

Method and device for plating a recess in a substrate

Structure for embedding and packaging multiple devices by layer and...

Interlayer connective structure of wiring board and method of manuf...

Techniques for high-speed signal layer transition

Wiring substrate and method for manufacturing wiring substrate

Continuous interconnects between heterogeneous materials

Glass core multilayer wiring board and method of producing the same

Feature casting for manufacture observation

Packaging structure with embedded electronic components and method...

Plated metallization structures

Method for forming through-hole, and substrate for flexible printed...

Substrate with gradiated dielectric for reducing impedance mismatch

Printed wiring board and method for manufacturing printed wiring board

Laminated film structure and method for manufacturing laminated fil...

Increasing adhesion of metal-organic interfaces by silane vapor tre...

Resist layer forming method, method for manufacturing wiring board,...

Backplane footprint for high speed, high density electrical connectors

Electronic substrate having differential coaxial vias

Circuit board, semiconductor device and method of manufacturing cir...

Substrate with buried component and manufacture method thereof

Patents Applicationslast 30 patents

INTERCONNECT SUBSTRATE AND METHOD OF MAKING THE SAME

PRINTED CIRCUIT BOARD, METAL-CERAMIC SUBSTRATE AS AN INSERT, AND PR...

PRINTED WIRING BOARD

ELECTRONIC DEVICE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE

SYSTEMS AND METHODS FOR IMPROVING HIGH FREQUENCY TRANSMISSION IN PR...

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

CIRCUIT BOARD AND BACK DRILLING PROCESSING METHOD

CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME

SUBTRACTIVE METHOD FOR MANUFACTURING CIRCUIT BOARD WITH FINE INTERC...

CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME

METHOD FOR FORMING THROUGH-VIA METAL WIRING

PRINTED WIRING BOARD AND PRINTED WIRING BOARD MANUFACTURING SUBSTRATE

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS

WIRING CIRCUIT BOARD AND METHOD FOR PRODUCING WIRING CIRCUIT BOARD

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

REAL-TIME CONTROL OF VIA STUB DRILLING DEPTH ASYMMETRY

PRINTED CIRCUIT BOARD VIA STRUCTURES WITH REDUCED INSERTION LOSS DI...

PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD

MULTILAYER WIRING BOARD

FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING FLEXIBLE...

WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

Method for Filing at least One Hole formed in a Printed Circuit Boa...

CIRCUIT BOARD

BOARD UNIT WITH SUPPORT, BOARD UNIT, AND METHOD OF PRODUCING BOARD...