Polysiloxane

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CPC
H01L2924/0715

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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/0715Polysiloxane

Industries

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 12,165,998
- Issue date Dec 10, 2024
- Fuji Electric Co., Ltd.
- Tohru Shirakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and manufacturing method therefor
- Patent number 12,100,923
- Issue date Sep 24, 2024
- Resonac Corporation
- Kunihiko Akai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced info POP and method of forming thereof
- Patent number 11,955,460
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer light detecting device and electronic apparatus
- Patent number 11,948,833
- Issue date Apr 2, 2024
- Sony Group Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill flow management in electronic assemblies
- Patent number 11,935,861
- Issue date Mar 19, 2024
- Intel Coropration
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stretchable display module and manufacturing method thereof
- Patent number 11,916,052
- Issue date Feb 27, 2024
- WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECHNOLOGY CO., LTD.
- Li Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,791,284
- Issue date Oct 17, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,776,922
- Issue date Oct 3, 2023
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,710,731
- Issue date Jul 25, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a chip carrier and a metal plate sized...
- Patent number 11,676,879
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for transferring and bonding of devices
- Patent number 11,677,060
- Issue date Jun 13, 2023
- ELECTRONICS AND TELEOCMMUNICATIONS RESEARCH INSTITUTE
- Jiho Joo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,676,956
- Issue date Jun 13, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 11,646,304
- Issue date May 9, 2023
- Daicel Corporation
- Naoko Tsuji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting silicone resin composition and die attach material fo...
- Patent number 11,566,132
- Issue date Jan 31, 2023
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure containing pre-polymerized protective layer...
- Patent number 11,538,777
- Issue date Dec 27, 2022
- SanDisk Technologies LLC
- Hajime Arai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die bulk acoustic wave oscillator package
- Patent number 11,387,782
- Issue date Jul 12, 2022
- Texas Instruments Incorporated
- Ricky A Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding material, light-emitting device, and method for produci...
- Patent number 11,315,899
- Issue date Apr 26, 2022
- Lintec Corporation
- Akiko Umeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
- Patent number 11,177,161
- Issue date Nov 16, 2021
- Sony Corporation
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,031,355
- Issue date Jun 8, 2021
- Mitsubishi Electric Corporation
- Yusuke Kaji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer thin film composite thermal interface materials
- Patent number 10,937,716
- Issue date Mar 2, 2021
- Arizona Board of Regents on behalf of Arizona State University
- Konrad Rykaczewski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively cross-linked thermal interface materials
- Patent number 10,903,188
- Issue date Jan 26, 2021
- International Business Machines Corporation
- Eric J. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked-die bulk acoustic wave oscillator package
- Patent number 10,892,712
- Issue date Jan 12, 2021
- Texas Instruments Incorporated
- Ricky A Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced INFO POP and method of forming thereof
- Patent number 10,797,025
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and semiconductor devices including a redistr...
- Patent number 10,777,523
- Issue date Sep 15, 2020
- Micron Technology, Inc.
- Anilkumar Chandolu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,770,371
- Issue date Sep 8, 2020
- Mitsubishi Electric Corporation
- Yoichi Hironaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Piezoelectric vibration component and application method
- Patent number 10,749,102
- Issue date Aug 18, 2020
- MURATA MANUFACTURING CO., LTD.
- Koji Nagahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond materials with enhanced plasma resistant characteristics and a...
- Patent number 10,727,195
- Issue date Jul 28, 2020
- Technetics Group LLC
- Jason Wright
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, manufacturing method thereof, solid-state ima...
- Patent number 10,658,229
- Issue date May 19, 2020
- Sony Corporation
- Masaki Okamoto
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Conformal dummy die
- Patent number 10,643,957
- Issue date May 5, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including built-in crack-arresting film structure
- Patent number 10,615,139
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES
- Publication number 20240363473
- Publication date Oct 31, 2024
- Avago Technologies International Sales Pte. Limited
- Hyunsuk Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240332272
- Publication date Oct 3, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Sang Yun MA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL
- Publication number 20240218228
- Publication date Jul 4, 2024
- Honeywell International Inc.
- Yaqun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...
- Publication number 20240203754
- Publication date Jun 20, 2024
- Arieca Inc.
- Navid Kazem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...
- Publication number 20240186279
- Publication date Jun 6, 2024
- Intel Corporation
- Minglu LIU
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20240178057
- Publication date May 30, 2024
- SONY GROUP CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS
- Publication number 20240145420
- Publication date May 2, 2024
- Intel Corporation
- Bok Eng CHEAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE COMPONENT
- Publication number 20240136268
- Publication date Apr 25, 2024
- Murata Manufacturing Co., Ltd.
- Yoshiaki SATAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...
- Publication number 20240087941
- Publication date Mar 14, 2024
- Dow Toray Co., Ltd.
- Nohno TODA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE
- Publication number 20240071859
- Publication date Feb 29, 2024
- Huawei Technologies Co., Ltd
- Zelong Jiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...
- Publication number 20230230950
- Publication date Jul 20, 2023
- NANO AND ADVANCED MATERIALS INSTITUTE LIMITED
- Yuechen WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joining and Insulating Power Electronic Semiconductor Components
- Publication number 20230215838
- Publication date Jul 6, 2023
- SIEMENS AKTIENGESELLSCHAFT
- Bernd Müller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS
- Publication number 20230197565
- Publication date Jun 22, 2023
- Jerrod P. Peterson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20230060577
- Publication date Mar 2, 2023
- Showa Denko Materials Co., Ltd.
- Kunihiko AKAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRETCHABLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20220359477
- Publication date Nov 10, 2022
- Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
- Li Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...
- Publication number 20220102235
- Publication date Mar 31, 2022
- INFINEON TECHNOLOGIES AG
- Stefan Woetzel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20220044962
- Publication date Feb 10, 2022
- SONY GROUP CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...
- Publication number 20220005773
- Publication date Jan 6, 2022
- SANDISK TECHNOLOGIES LLC
- Hajime ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...
- Publication number 20220005772
- Publication date Jan 6, 2022
- SANDISK TECHNOLOGIES LLC
- Hajime ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY
- Publication number 20210391292
- Publication date Dec 16, 2021
- Mitsui Chemicals, Inc.
- Yasuhisa KAYABA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210384183
- Publication date Dec 9, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210358884
- Publication date Nov 18, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20210358867
- Publication date Nov 18, 2021
- DAICEL CORPORATION
- Naoko TSUJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES
- Publication number 20210343677
- Publication date Nov 4, 2021
- Intel Corporation
- Frederick W. Atadana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked-Die Bulk Acoustic Wave Oscillator Package
- Publication number 20210126585
- Publication date Apr 29, 2021
- TEXAS INSTRUMENTS INCORPORATED
- RICKY A. JACKSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING SILICONE RESIN COMPOSITION AND DIE ATTACH MATERIAL FO...
- Publication number 20210062002
- Publication date Mar 4, 2021
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya YAMAZAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Advanced INFO POP and Method of Forming Thereof
- Publication number 20210020611
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yi-Da Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCI...
- Publication number 20200335471
- Publication date Oct 22, 2020
- LINTEC CORPORATION
- Akiko UMEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20200286840
- Publication date Sep 10, 2020
- MITSUBISHI ELECTRIC CORPORATION
- Yusuke KAJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...
- Publication number 20200273745
- Publication date Aug 27, 2020
- SONY CORPORATION
- Masaki Okamoto
- H01 - BASIC ELECTRIC ELEMENTS

Polysiloxane

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device

Connection structure and manufacturing method therefor

Advanced info POP and method of forming thereof

Multilayer light detecting device and electronic apparatus

Underfill flow management in electronic assemblies

Stretchable display module and manufacturing method thereof

Semiconductor device manufacturing method

Semiconductor structure containing pre-polymerized protective layer...

Semiconductor device manufacturing method

Semiconductor package having a chip carrier and a metal plate sized...

Method for transferring and bonding of devices

Semiconductor device manufacturing method

Semiconductor device manufacturing method

Thermosetting silicone resin composition and die attach material fo...

Semiconductor structure containing pre-polymerized protective layer...

Stacked-die bulk acoustic wave oscillator package

Die bonding material, light-emitting device, and method for produci...

Semiconductor device, manufacturing method thereof, solid-state ima...

Semiconductor device

Multi-layer thin film composite thermal interface materials

Selectively cross-linked thermal interface materials

Stacked-die bulk acoustic wave oscillator package

Advanced INFO POP and method of forming thereof

Semiconductor devices and semiconductor devices including a redistr...

Semiconductor device

Piezoelectric vibration component and application method

Bond materials with enhanced plasma resistant characteristics and a...

Semiconductor device, manufacturing method thereof, solid-state ima...

Conformal dummy die

Semiconductor device including built-in crack-arresting film structure

Patents Applicationslast 30 patents

THERMAL MANAGEMENT SYSTEMS AND METHODS FOR SEMICONDUCTOR DEVICES

ELECTRONIC DEVICES ANDMETHODS OF MANUFACTURING ELECTRONIC DEVICES

LOW MELT POINT METAL BASED THERMAL INTERFACE MATERIAL

METHOD OF DEPOSITION OF A THERMAL INTERFACE MATERIAL ONTO A CIRCUIT...

IN-SITU UV CURE PLACEMENT TOOL FOR ROOM TEMPERATURE CHIP/GLASS DEVI...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

LIQUID METAL SHIELD FOR FINE PITCH INTERCONNECTS

COMPOSITE COMPONENT

INTEGRATED DICING DIE BONDING SHEET AND METHOD FOR PRODUCING SEMICO...

CHIP PACKAGE STRUCTURE AND ELECTRONIC DEVICE

SELF-DENSIFYING NANO-SILVER PASTE AND A METHOD OF FORMING INTERCONN...

Joining and Insulating Power Electronic Semiconductor Components

REMOTE MECHANICAL ATTACHMENT FOR BONDED THERMAL MANAGEMENT SOLUTIONS

CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREFOR

STRETCHABLE DISPLAY MODULE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED...

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...

SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...

SEMICONDUCTOR STRUCTURE CONTAINING PRE-POLYMERIZED PROTECTIVE LAYER...

METHOD OF MANUFACTURING SUBSTRATE LAYERED BODY AND LAYERED BODY

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

UNDERFILL FLOW MANAGEMENT IN ELECTRONIC ASSEMBLIES

Stacked-Die Bulk Acoustic Wave Oscillator Package

THERMOSETTING SILICONE RESIN COMPOSITION AND DIE ATTACH MATERIAL FO...

Advanced INFO POP and Method of Forming Thereof

DIE BONDING MATERIAL, LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMA...