Processes for packaging MEMS devices

Industry

CPC
B81C1/00261

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Parent Industries

BPERFORMING OPERATIONS TRANSPORTING B81Micro-structural technology B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS B81C1/00Manufacture or treatment of devices or systems in or on a substrate

Current Industry

B81C1/00261Processes for packaging MEMS devices

Industries

Patents Grantslast 30 patents

Information Patent Grant
Wafer stencil for controlling die attach material thickness on die
- Patent number 12,142,549
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Mario Alfonso Eduardo Magana
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaging structure and method of MEMS pressure sensor
- Patent number 11,953,392
- Issue date Apr 9, 2024
- Wuxi Sencoch Semiconductor Co., Ltd.
- Tongqing Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 11,724,933
- Issue date Aug 15, 2023
- Rohm Co., Ltd.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Pressure sensing implant
- Patent number 11,707,230
- Issue date Jul 25, 2023
- ENDOTRONIX, INC.
- Harry Rowland
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 11,667,523
- Issue date Jun 6, 2023
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS gas sensor
- Patent number 11,480,538
- Issue date Oct 25, 2022
- TDK Corporation
- Matthias König
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,417,576
- Issue date Aug 16, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatuses for packaging an ultrasound-on-a-chip
- Patent number 11,389,137
- Issue date Jul 19, 2022
- BFLY OPERATIONS, INC.
- Keith G. Fife
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device and electronic apparatus
- Patent number 11,262,376
- Issue date Mar 1, 2022
- Weifang Goertek Microelectronics Co., Ltd.
- Quanbo Zou
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Mold material architecture for package device structures
- Patent number 11,254,563
- Issue date Feb 22, 2022
- Intel Corporation
- Omkar G. Karhade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 11,257,727
- Issue date Feb 22, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Preparation method of bionic adhesive material with tip-expanded mi...
- Patent number 11,254,566
- Issue date Feb 22, 2022
- Nanjing University of Aeronautics and Astronautics
- Zhendong Dai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS chip and electrical packaging method for MEMS chip
- Patent number 11,242,243
- Issue date Feb 8, 2022
- Huawei Technologies Co., Ltd.
- Yuming Wei
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Systems and methods for manufacturing microelectronic devices
- Patent number 11,244,873
- Issue date Feb 8, 2022
- Tokyo Electron Limited
- Carlos A. Fonseca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated MEMS cavity seal
- Patent number 11,174,151
- Issue date Nov 16, 2021
- Invensense, Inc.
- Ian Flader
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Packaged circuit system structure
- Patent number 10,934,157
- Issue date Mar 2, 2021
- Murata Manufacturing Co., Ltd.
- Heikki Kuisma
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical electronics device
- Patent number 10,894,712
- Issue date Jan 19, 2021
- Texas Instruments Incorporated
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Electrical connection to a micro electro-mechanical system
- Patent number 10,843,921
- Issue date Nov 24, 2020
- Kionix, Inc.
- Andrew Hocking
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with AlGe
- Patent number 10,793,427
- Issue date Oct 6, 2020
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Eutectic bonding with ALGe
- Patent number 10,766,767
- Issue date Sep 8, 2020
- Kionix, Inc.
- Martin Heller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods for fabricating an apparatus having a hermetic seal
- Patent number 10,712,182
- Issue date Jul 14, 2020
- DUNAN SENSING LLC
- Tom T. Nguyen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
MEMS device including a capacitive pressure sensor and manufacturin...
- Patent number 10,689,251
- Issue date Jun 23, 2020
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing thin MEMS chips on SOI substrate and micromech...
- Patent number 10,584,029
- Issue date Mar 10, 2020
- Robert Bosch GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Seal for microelectronic assembly
- Patent number 10,508,030
- Issue date Dec 17, 2019
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Proof mass and polysilicon electrode integrated thereon
- Patent number 10,505,006
- Issue date Dec 10, 2019
- Invensense, Inc.
- Bongsang Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly and packaging of MEMS device
- Patent number 10,472,231
- Issue date Nov 12, 2019
- Invensense, Inc.
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device including a capacitive pressure sensor and manufacturin...
- Patent number 10,407,301
- Issue date Sep 10, 2019
- STMicroelectronics S.r.l.
- Enri Duqi
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus with a high heat capacity and method for producing the same
- Patent number 10,377,626
- Issue date Aug 13, 2019
- Infineon Technologies AG
- Bernd Goller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Membrane for a capacitive MEMS pressure sensor and method of formin...
- Patent number 10,351,420
- Issue date Jul 16, 2019
- Robert Bosch GmbH
- Ando Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for forming filter net on MEMS sensor and MEMS sensor
- Patent number 10,233,075
- Issue date Mar 19, 2019
- GOERTEK INC.
- Junkai Zhan
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Packaging Structure and Method of MEMS Pressure Sensor
- Publication number 20240094079
- Publication date Mar 21, 2024
- Wuxi Sencoch Semiconductor Co., Ltd.
- Tongqing Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20230420313
- Publication date Dec 28, 2023
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PRESSURE SENSING IMPLANT
- Publication number 20230380764
- Publication date Nov 30, 2023
- ENDOTRONIX, INC.
- Harry ROWLAND
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386948
- Publication date Nov 30, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- You-Ru Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20220415734
- Publication date Dec 29, 2022
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP
- Publication number 20220395254
- Publication date Dec 15, 2022
- BFLY Operations, Inc
- Keith G. Fife
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ELECTRONICS DEVICE
- Publication number 20210139320
- Publication date May 13, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Gas Sensor
- Publication number 20200240943
- Publication date Jul 30, 2020
- TDK Corporation
- Matthias König
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM
- Publication number 20200216310
- Publication date Jul 9, 2020
- Kionix, Inc.
- Andrew Hocking
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20200140268
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEAL FOR MICROELECTRONIC ASSEMBLY
- Publication number 20200140267
- Publication date May 7, 2020
- INVENSAS BONDING TECHNOLOGIES, INC.
- Rajesh Katkar
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Systems and Methods For Manufacturing Microelectronic Devices
- Publication number 20200135592
- Publication date Apr 30, 2020
- TOKYO ELECTRON LIMITED
- Carlos A. Fonseca
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS CHIP AND ELECTRICAL PACKAGING METHOD FOR MEMS CHIP
- Publication number 20200048076
- Publication date Feb 13, 2020
- Huawei Technologies Co., Ltd
- Yuming WEI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER STENCIL FOR CONTROLLING DIE ATTACH MATERIAL THICKNESS ON DIE
- Publication number 20200013701
- Publication date Jan 9, 2020
- TEXAS INSTRUMENTS INCORPORATED
- MARIO ALFONSO EDUARDO MAGANA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE INCLUDING A CAPACITIVE PRESSURE SENSOR AND MANUFACTURIN...
- Publication number 20190345028
- Publication date Nov 14, 2019
- STMicroelectronics S.r.l.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MOLD MATERIAL ARCHITECTURE FOR PACKAGE DEVICE STRUCTURES
- Publication number 20190330051
- Publication date Oct 31, 2019
- Intle Corporation
- Omkar G. Karhade
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE AND ELECTRONIC APPARATUS
- Publication number 20190079110
- Publication date Mar 14, 2019
- GOERTEK INC
- Quanbo ZOU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING THIN MEMS CHIPS ON SOI SUBSTRATE AND MICROMECH...
- Publication number 20190039885
- Publication date Feb 7, 2019
- ROBERT BOSCH GmbH
- Jochen Reinmuth
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR FORMING FILTER NET ON MEMS SENSOR AND MEMS SENSOR
- Publication number 20180362331
- Publication date Dec 20, 2018
- Junkai ZHAN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Membrane for a Capacitive MEMS Pressure Sensor and Method of Formin...
- Publication number 20180327257
- Publication date Nov 15, 2018
- ROBERT BOSCH GmbH
- Ando Feyh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS WITH A HIGH HEAT CAPACITY AND METHOD FOR PRODUCING THE SAME
- Publication number 20180305200
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE INCLUDING A CAPACITIVE PRESSURE SENSOR AND MANUFACTURIN...
- Publication number 20180282152
- Publication date Oct 4, 2018
- STMicroelectronics S.r.l.
- Enri DUQI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
OPTICAL ELECTRONICS DEVICE
- Publication number 20180257930
- Publication date Sep 13, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Simon Joshua Jacobs
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS SENSOR INCLUDING AN OVER-TRAVEL STOP AND METHOD OF MANUFACTURE
- Publication number 20160094156
- Publication date Mar 31, 2016
- InvenSense, Inc.
- Matthew Julian THOMPSON
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS Switch
- Publication number 20150325393
- Publication date Nov 12, 2015
- Analog Devices Global
- Bernard P. Stenson
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150266728
- Publication date Sep 24, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...
- Publication number 20150091167
- Publication date Apr 2, 2015
- Christian Geissler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ASSEMBLY AND PACKAGING OF MEMS DEVICE
- Publication number 20150028432
- Publication date Jan 29, 2015
- Brian H. Kim
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
PACKAGING METHOD FOR MEMS DEVICES
- Publication number 20140374847
- Publication date Dec 25, 2014
- Albert Hrovat
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME
- Publication number 20140332912
- Publication date Nov 13, 2014
- Horst Theuss
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Processes for packaging MEMS devices

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Wafer stencil for controlling die attach material thickness on die

Packaging structure and method of MEMS pressure sensor

Eutectic bonding with AlGe

Pressure sensing implant

Optical electronics device

MEMS gas sensor

Seal for microelectronic assembly

Methods and apparatuses for packaging an ultrasound-on-a-chip

MEMS device and electronic apparatus

Mold material architecture for package device structures

Seal for microelectronic assembly

Preparation method of bionic adhesive material with tip-expanded mi...

MEMS chip and electrical packaging method for MEMS chip

Systems and methods for manufacturing microelectronic devices

Integrated MEMS cavity seal

Packaged circuit system structure

Optical electronics device

Electrical connection to a micro electro-mechanical system

Eutectic bonding with AlGe

Eutectic bonding with ALGe

Methods for fabricating an apparatus having a hermetic seal

MEMS device including a capacitive pressure sensor and manufacturin...

Method for producing thin MEMS chips on SOI substrate and micromech...

Seal for microelectronic assembly

Proof mass and polysilicon electrode integrated thereon

Assembly and packaging of MEMS device

MEMS device including a capacitive pressure sensor and manufacturin...

Apparatus with a high heat capacity and method for producing the same

Membrane for a capacitive MEMS pressure sensor and method of formin...

Method for forming filter net on MEMS sensor and MEMS sensor

Patents Applicationslast 30 patents

Packaging Structure and Method of MEMS Pressure Sensor

SEAL FOR MICROELECTRONIC ASSEMBLY

PRESSURE SENSING IMPLANT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

SEAL FOR MICROELECTRONIC ASSEMBLY

METHODS AND APPARATUSES FOR PACKAGING AN ULTRASOUND-ON-A-CHIP

OPTICAL ELECTRONICS DEVICE

MEMS Gas Sensor

ELECTRICAL CONNECTION TO A MICRO ELECTRO-MECHANICAL SYSTEM

SEAL FOR MICROELECTRONIC ASSEMBLY

SEAL FOR MICROELECTRONIC ASSEMBLY

Systems and Methods For Manufacturing Microelectronic Devices

MEMS CHIP AND ELECTRICAL PACKAGING METHOD FOR MEMS CHIP

WAFER STENCIL FOR CONTROLLING DIE ATTACH MATERIAL THICKNESS ON DIE

MEMS DEVICE INCLUDING A CAPACITIVE PRESSURE SENSOR AND MANUFACTURIN...

MOLD MATERIAL ARCHITECTURE FOR PACKAGE DEVICE STRUCTURES

MEMS DEVICE AND ELECTRONIC APPARATUS

METHOD FOR PRODUCING THIN MEMS CHIPS ON SOI SUBSTRATE AND MICROMECH...

METHOD FOR FORMING FILTER NET ON MEMS SENSOR AND MEMS SENSOR

Membrane for a Capacitive MEMS Pressure Sensor and Method of Formin...

APPARATUS WITH A HIGH HEAT CAPACITY AND METHOD FOR PRODUCING THE SAME

MEMS DEVICE INCLUDING A CAPACITIVE PRESSURE SENSOR AND MANUFACTURIN...

OPTICAL ELECTRONICS DEVICE

MEMS SENSOR INCLUDING AN OVER-TRAVEL STOP AND METHOD OF MANUFACTURE

MEMS Switch

STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...

STRESS BUFFER LAYER FOR INTEGRATED MICROELECTROMECHANICAL SYSTEMS (...

ASSEMBLY AND PACKAGING OF MEMS DEVICE

PACKAGING METHOD FOR MEMS DEVICES

CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME