Protection against radiation

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CPC
H01L23/552

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/552Protection against radiation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Method for producing electronic component device and laminated film...
- Patent number 12,183,686
- Issue date Dec 31, 2024
- Resonac Corporation
- Tomoaki Shibata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method using an EMI-absorbing metal bar
- Patent number 12,183,687
- Issue date Dec 31, 2024
- STATS ChipPAC Pte. Ltd.
- KyouYong Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective underfill assembly and method therefor
- Patent number 12,183,595
- Issue date Dec 31, 2024
- NXP B.V.
- Leo van Gemert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package
- Patent number 12,176,297
- Issue date Dec 24, 2024
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,176,262
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electrical connection between an electronic c...
- Patent number 12,170,262
- Issue date Dec 17, 2024
- STMicroelectronics (Grenoble 2) SAS
- David Auchere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array substrate and display device
- Patent number 12,169,603
- Issue date Dec 17, 2024
- Beijing Boe Display Technology Co., Ltd.
- Xiao Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device package
- Patent number 12,165,984
- Issue date Dec 10, 2024
- Advanced Semiconductor Engineering, Inc.
- Hao-Chih Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with electromagnetic interference shielding
- Patent number 12,165,989
- Issue date Dec 10, 2024
- Texas Instruments Incorporated
- Jie Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 12,165,988
- Issue date Dec 10, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Min Won Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip package unit comprising thermal protection film and assoc...
- Patent number 12,159,792
- Issue date Dec 3, 2024
- Chengdu Monolithic Power Systems Co., Ltd.
- Yingjiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus including a heat-dissipation member and electroni...
- Patent number 12,161,019
- Issue date Dec 3, 2024
- Samsung Display Co., Ltd.
- Byoungkyoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices designed with mold patterning to create pac...
- Patent number 12,155,133
- Issue date Nov 26, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene-coated heat spreader for integrated circuit device assemblies
- Patent number 12,154,839
- Issue date Nov 26, 2024
- Advanced Micro Devices, Inc.
- Xiaoyang Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method for manufacturing the same
- Patent number 12,154,863
- Issue date Nov 26, 2024
- Powertech Technology Inc.
- Shang-Yu Chang Chien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising transistors arranged along with shield...
- Patent number 12,148,759
- Issue date Nov 19, 2024
- INNOLUX CORPORATION
- Ming-Jou Tai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active via
- Patent number 12,148,838
- Issue date Nov 19, 2024
- ZINITE CORPORATION
- Douglas W. Barlage
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and antenna module comprising the same
- Patent number 12,148,708
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Yong Koon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and associated methods with antennas and EMI...
- Patent number 12,148,711
- Issue date Nov 19, 2024
- Owen R. Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising metal layer configured for electromagnetic inter...
- Patent number 12,142,577
- Issue date Nov 12, 2024
- QUALCOMM Technologies, Inc.
- Marc Huesgen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power amplifier modules including semiconductor resistor and tantal...
- Patent number 12,143,077
- Issue date Nov 12, 2024
- Skyworks Solutions, Inc.
- Peter J. Zampardi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
X-ray shielding structure for a chip
- Patent number 12,142,556
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna-in-package devices and methods of making
- Patent number 12,136,759
- Issue date Nov 5, 2024
- STATS ChipPAC Pte. Ltd.
- HunTeak Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnetic interference shielding and thermal management syste...
- Patent number 12,137,515
- Issue date Nov 5, 2024
- Aptiv Technologies AG
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid, electronic component-housing package, and electronic device
- Patent number 12,136,598
- Issue date Nov 5, 2024
- Kyocera Corporation
- Takayuki Shirasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with self shielding
- Patent number 12,137,516
- Issue date Nov 5, 2024
- Avago Technologies International Sales Pte. Limited
- Hongya Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,131,997
- Issue date Oct 29, 2024
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 12,132,006
- Issue date Oct 29, 2024
- Advanced Semiconductor Engineering, Inc.
- Pao-Nan Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrating passive devices in package structures
- Patent number 12,132,029
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE STRUCTURE WITH CAVITY AND RELATED PACKAGING METHOD
- Publication number 20250006578
- Publication date Jan 2, 2025
- JCET GROUP CO., LTD.
- Jianghua Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...
- Publication number 20240429177
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Simon KORNPROBST
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429116
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Seoung Joon HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
- Publication number 20240429183
- Publication date Dec 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Tae Yong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...
- Publication number 20240429117
- Publication date Dec 26, 2024
- Intel Corporation
- Harshit DHAKAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240421015
- Publication date Dec 19, 2024
- JCET STATS ChipPAC Korea Limited
- SeungHyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Converter, Package Structure, and Heat Dissipation Structure
- Publication number 20240421100
- Publication date Dec 19, 2024
- Huawei Digital Power Technologies Co., Ltd.
- Xingzhong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20240413032
- Publication date Dec 12, 2024
- Western Digital Technologies, Inc.
- Shaopeng Dong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE
- Publication number 20240413066
- Publication date Dec 12, 2024
- Intel Corporation
- Ranjul BALAKRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
- Publication number 20240413094
- Publication date Dec 12, 2024
- CYPRESS SEMICONDUCTOR CORPORATION
- Thorsten MEYER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making an EMI Shield Using Inten...
- Publication number 20240413095
- Publication date Dec 12, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES
- Publication number 20240405009
- Publication date Dec 5, 2024
- Skyworks Solutions, Inc.
- Sundeep Nand NANGALIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY SYSTEM
- Publication number 20240405010
- Publication date Dec 5, 2024
- KIOXIA Corporation
- Hayato MASUBUCHI
- G11 - INFORMATION STORAGE
Information Patent Application
Multiband QAM Interface for Slab Waveguide
- Publication number 20240395738
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Huan-Neng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS OF ELECTRICALLY CONDUCTIVE OPTICAL SEMICONDUC...
- Publication number 20240393697
- Publication date Nov 28, 2024
- Danbury Mission Technologies, LLC
- Bradley Dean Schwartz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395771
- Publication date Nov 28, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Seong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING INTEGRATED CIRCUIT
- Publication number 20240395716
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Yu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER
- Publication number 20240395746
- Publication date Nov 28, 2024
- SK HYNIX INC.
- Jae Jun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...
- Publication number 20240387464
- Publication date Nov 21, 2024
- Qorvo US, Inc.
- John Robert Siomkos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...
- Publication number 20240387345
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Venkatesh Sadineni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
- Publication number 20240387400
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- JiSeon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240387309
- Publication date Nov 21, 2024
- STATS ChipPAC Pte Ltd.
- JinHee JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20240387333
- Publication date Nov 21, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gi Jeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387337
- Publication date Nov 21, 2024
- Innolux Corporation
- Ying-Jen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...
- Publication number 20240387399
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Fu-Hai Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...
- Publication number 20240387401
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Hsi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379579
- Publication date Nov 14, 2024
- Dynax Semiconductor, Inc.
- Yi PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20240379382
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHOU ZEN CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Dual-Side Molded System...
- Publication number 20240379480
- Publication date Nov 14, 2024
- STATS ChipPAC Pte Ltd.
- YongMoo Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND...
- Publication number 20240379581
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Yuan CHANG
- H01 - BASIC ELECTRIC ELEMENTS

Protection against radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Method for producing electronic component device and laminated film...

Semiconductor device and method using an EMI-absorbing metal bar

Selective underfill assembly and method therefor

Semiconductor device package

Semiconductor package

Method for forming an electrical connection between an electronic c...

Array substrate and display device

Semiconductor device package

Semiconductor package with electromagnetic interference shielding

Semiconductor devices and methods of manufacturing semiconductor de...

Flip chip package unit comprising thermal protection film and assoc...

Display apparatus including a heat-dissipation member and electroni...

Electronic package and manufacturing method thereof

Microelectronic devices designed with mold patterning to create pac...

Graphene-coated heat spreader for integrated circuit device assemblies

Fan-out semiconductor package and method for manufacturing the same

Electronic device comprising transistors arranged along with shield...

Active via

Semiconductor package and antenna module comprising the same

Semiconductor packages and associated methods with antennas and EMI...

Package comprising metal layer configured for electromagnetic inter...

Power amplifier modules including semiconductor resistor and tantal...

X-ray shielding structure for a chip

Antenna-in-package devices and methods of making

Electromagnetic interference shielding and thermal management syste...

Lid, electronic component-housing package, and electronic device

Package with self shielding

Semiconductor packages

Semiconductor package structure

Integrating passive devices in package structures

Patents Applicationslast 30 patents

PACKAGE STRUCTURE WITH CAVITY AND RELATED PACKAGING METHOD

RADIO FREQUENCY SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A R...

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES

DIELECTRIC MATERIAL AND A MOLD COMPOUND WITH DIFFERENT DIELECTRIC C...

SEMICONDUCTOR PACKAGE AND METHOD FOR FORMING THE SAME

Power Converter, Package Structure, and Heat Dissipation Structure

INSULATION LAYER FOR A SEMICONDUCTOR PACKAGE

EMBEDDED SEMICONDUCTOR DEVICE

SEMICONDUCTOR DIE SHIELDING STRUCTURE

Semiconductor Device and Method of Making an EMI Shield Using Inten...

DEVICES, SYSTEMS AND METHODS RELATED TO DUAL-SIDED MODULES

SEMICONDUCTOR MEMORY SYSTEM

Multiband QAM Interface for Slab Waveguide

APPARATUS AND METHODS OF ELECTRICALLY CONDUCTIVE OPTICAL SEMICONDUC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD OF MANUFACTURING INTEGRATED CIRCUIT

SEMICONDUCTOR DIE HAVING A METAL PLATE LAYER

DOUBLE-SIDED INTEGRATED CIRCUIT MODULE HAVING AN EXPOSED SEMICONDUC...

CIRCUIT BOARD DEVICE WITH INDUCTOR(S) FOR ROUTING POWER FROM A POWE...

SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME

ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

RFSOI SEMICONDUCTOR STRUCTURES INCLUDING AN ELECTROMAGNETIC SHIELD...

SEMICONDUCTOR DEVICE WITH ELECTROMAGNETIC INTERFERENCE FILM AND MET...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

Semiconductor Device and Method of Making a Dual-Side Molded System...

ELECTROMAGNETIC SHIELDING STRUCTURE FOR A SEMICONDUCTOR DEVICE AND...