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ELECTRICITY
H01
Electric elements
H01L
SEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
H01L23/00
Details of semiconductor or other solid state devices
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H01L23/552
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Patents Grants
last 30 patents
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Patent Grant
Interposer
Patent number
11,973,013
Issue date
Apr 30, 2024
AMOSENSE CO., LTD.
Changwoo Oh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multiple conductive posts
Patent number
11,973,043
Issue date
Apr 30, 2024
Siliconware Precision Industries Co., Ltd.
Chih-Hsien Chiu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method, systems, and apparatuses for electromagnetic shielding
Patent number
11,974,419
Issue date
Apr 30, 2024
Florian Perminjat
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer stacking structure and manufacturing method thereof
Patent number
11,967,558
Issue date
Apr 23, 2024
Powerchip Semiconductor Manufacturing Corporation
Shou-Zen Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Isolated transformer with integrated shield topology for reduced EMI
Patent number
11,967,566
Issue date
Apr 23, 2024
Texas Instruments Incorporated
Vijaylaxmi Gumaste Khanolkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices including conductive structure and shielding...
Patent number
11,967,565
Issue date
Apr 23, 2024
Amkor Technology Japan, Inc.
Takahiro Yada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packaged semiconductor device and method for fabricating a packaged...
Patent number
11,967,562
Issue date
Apr 23, 2024
Infineon Technologies AG
Horst Theuss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with EMI shield and fabricating method thereof
Patent number
11,967,567
Issue date
Apr 23, 2024
Amkor Technology Singapore Holding Pte Ltd.
Doo Soub Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Antenna module and electronic device including the same
Patent number
11,967,752
Issue date
Apr 23, 2024
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Ho Kyung Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Module
Patent number
11,961,830
Issue date
Apr 16, 2024
Murata Manufacturing Co., Ltd.
Yoshihito Otsubo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Devices and methods related to dual-sided radio-frequency package w...
Patent number
11,961,805
Issue date
Apr 16, 2024
Skyworks Solutions, Inc.
Howard E. Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic device assemblies and packages including multiple d...
Patent number
11,961,825
Issue date
Apr 16, 2024
Micron Technology, Inc.
Aparna U. Limaye
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package having multi-layer molding compound an...
Patent number
11,961,778
Issue date
Apr 16, 2024
Western Digital Technologies, Inc.
Shenghua Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer structures and methods for 2.5D and 3D packaging
Patent number
11,955,431
Issue date
Apr 9, 2024
Intel Corporation
Jenny Shio Yin Ong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra small molded module integrated with die by module-on-wafer as...
Patent number
11,955,434
Issue date
Apr 9, 2024
Intel Corporation
Yoshihiro Tomita
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device package including multiple substrates with dif...
Patent number
11,955,419
Issue date
Apr 9, 2024
Advanced Semiconductor Engineering, Inc.
Yi Chun Chou
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermally-conductive electromagnetic interference (EMI) absorbers
Patent number
11,955,438
Issue date
Apr 9, 2024
Laird Technologies, Inc.
Karen Bruzda
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Differential on-chip loop antenna
Patent number
11,955,728
Issue date
Apr 9, 2024
Intel Corporation
Nir Weisman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Regulator circuit package techniques
Patent number
11,955,437
Issue date
Apr 9, 2024
Analog Devices International Unlimited Company
Leonard Shtargot
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with redistribution structure and manufacturi...
Patent number
11,955,439
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Cheng Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-equalized and self-crosstalk-compensated 3D transmission line...
Patent number
11,955,436
Issue date
Apr 9, 2024
Intel Corporation
Khang Choong Yong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic tunnel junction (MTJ) device and forming method thereof
Patent number
11,950,431
Issue date
Apr 2, 2024
United Microelectronics Corp.
Wei Chen
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,948,891
Issue date
Apr 2, 2024
NEPES CO., LTD.
Sang Yong Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming stacked semiconductors die assemblies
Patent number
11,948,921
Issue date
Apr 2, 2024
Randon K. Richards
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic component with lid to manage radiation feedback
Patent number
11,948,893
Issue date
Apr 2, 2024
Qorvo US, Inc.
Zhunming Du
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Transient stabilized SOI FETs
Patent number
11,948,897
Issue date
Apr 2, 2024
pSemi Corporation
Robert Mark Englekirk
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package including an electromagnetic shield and metho...
Patent number
11,942,437
Issue date
Mar 26, 2024
Samsung Electronics Co., Ltd.
Youngwoo Park
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Display assembly and display device
Patent number
11,937,414
Issue date
Mar 19, 2024
Chengdu Boe Optoelectronics Technology Co., Ltd.
Qizhong Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Cooling device and process for cooling double-sided SiP devices dur...
Patent number
11,932,933
Issue date
Mar 19, 2024
STATS ChipPAC Pte. Ltd.
OhHan Kim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Semiconductor device with oxide-nitride stack
Patent number
11,935,839
Issue date
Mar 19, 2024
Icemos Technology Corporation
Kiraneswar Muthuseenu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
ELECTRONIC DEVICES AND METHODS OF MANUFACTURING ELECTRONIC DEVICES
Publication number
20240145369
Publication date
May 2, 2024
Amkor Technology Singapore Holding Pte. Ltd.
Soo Hyun Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE SHIELDING STRUCTURE
Publication number
20240145402
Publication date
May 2, 2024
CYPRESS SEMICONDUCTOR CORPORATION
Mark PAVIER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH ELECTROMAGNETIC INTERFERENCE SHIELDING LAYER AND...
Publication number
20240145404
Publication date
May 2, 2024
Walton Advanced Engineering, Inc
HONG-CHI YU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE
Publication number
20240145406
Publication date
May 2, 2024
Rohm Co., Ltd.
Takatsugu WACHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECT...
Publication number
20240145432
Publication date
May 2, 2024
Tesla, Inc.
Mengzhi Pang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES AND ASSOCIATED METHODS WITH SOLDER MASK OPEN...
Publication number
20240145405
Publication date
May 2, 2024
Micron Technology, Inc.
Avishesh Dhakal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240145403
Publication date
May 2, 2024
Siliconware Precision Industries Co., Ltd.
Chih-Hsien CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic Device and Chip Packaging Method
Publication number
20240136304
Publication date
Apr 25, 2024
Honor Device Co., Ltd.
Xueping Guo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Conductive Traces in Semiconductor Devices and Methods of Forming Same
Publication number
20240136280
Publication date
Apr 25, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chao-Wen Shih
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ACTIVE VIA
Publication number
20240136330
Publication date
Apr 25, 2024
ZINITE CORPORATION
Douglas W. BARLAGE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ON-CHIP SHIELDED DEVICE
Publication number
20240138129
Publication date
Apr 25, 2024
NXP B.V.
Philipp Franz Freidl
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC MODULE AND ELECTRONIC APPARATUS
Publication number
20240128193
Publication date
Apr 18, 2024
Advanced Semiconductor Engineering, Inc.
Pao-Nan LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED C...
Publication number
20240128202
Publication date
Apr 18, 2024
Intel Corporation
Gianni SIGNORINI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Graphene Core Shell Embe...
Publication number
20240128200
Publication date
Apr 18, 2024
STATS ChipPAC Pte Ltd.
YongMoo Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Shielding Element for Electronic Components
Publication number
20240130096
Publication date
Apr 18, 2024
Aptiv Technologies AG
Armin Talai
G01 - MEASURING TESTING
Information
Patent Application
Semiconductor Device and Method of Forming Semiconductor Package wi...
Publication number
20240128201
Publication date
Apr 18, 2024
STATS ChipPAC Pte Ltd.
HunTeak Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE
Publication number
20240128249
Publication date
Apr 18, 2024
Siliconware Precision Industries Co., Ltd.
Chih-Hsien CHIU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SIP-TYPE ELECTRONIC DEVICE AND METHOD FOR MAKING SUCH A DEVICE
Publication number
20240128227
Publication date
Apr 18, 2024
Commissariat A L'Energie Atomique et Aux Energies Alternatives
Perceval COUDRAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20240120288
Publication date
Apr 11, 2024
Advanced Semiconductor Engineering, Inc.
Chih-Hsin LAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240120325
Publication date
Apr 11, 2024
Powertech Technology Inc.
Pei-chun TSAI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE AND A METHOD FOR MAKING THE SAME
Publication number
20240120289
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
RADIATION SHIELDING OF ELECTRONICS USING ARTIFICIALLY CREATED MAGNE...
Publication number
20240120290
Publication date
Apr 11, 2024
Mentium Technologies Inc.
Farnood Merrikh BAYAT
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH SELF SHIELDING
Publication number
20240121884
Publication date
Apr 11, 2024
Avago Technologies International Sales Pte. Limited
Hongya Xu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MAKING THE SAME
Publication number
20240120291
Publication date
Apr 11, 2024
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
Publication number
20240120268
Publication date
Apr 11, 2024
JCET STATS ChipPAC Korea Limited
SeungHyun LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package having component carrier with cavity and electronic compone...
Publication number
20240113037
Publication date
Apr 4, 2024
AT&S Austria Technologie & Systemtechnik AG
Gerald Weis
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Laser-Based Redistribution and Multi-Stacked Packages
Publication number
20240113038
Publication date
Apr 4, 2024
STATS ChipPAC Pte Ltd.
ChangOh Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURE, MANUFACTU...
Publication number
20240113036
Publication date
Apr 4, 2024
AZUREWAVE TECHNOLOGIES, INC.
CHIH-HAO LIAO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICES AND METHODS RELATED TO STACK ASSEMBLY
Publication number
20240114794
Publication date
Apr 4, 2024
Skyworks Solutions, Inc.
Hardik Bhupendra MODI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH ANTI-INTERFERENCE MICROSYSTEM BASED ON SYSTEM IN PACKAGE (SIP)...
Publication number
20240106235
Publication date
Mar 28, 2024
Electric Power Research Institute of State Grid Zhejiang Electric Power Co., LTD
Xianjun SHAO
H01 - BASIC ELECTRIC ELEMENTS