Protection against radiation

Industry

CPC
H01L23/552

This industry / category may be too specific. Please go to a parent level for more data

Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/552Protection against radiation

Industries

Patents Grantslast 30 patents

Information Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
- Patent number 12,341,108
- Issue date Jun 24, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compartmentalized shielding of a module utilizing self-shielded sub...
- Patent number 12,342,518
- Issue date Jun 24, 2025
- Qorvo US, Inc.
- Thomas Scott Morris
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 12,341,109
- Issue date Jun 24, 2025
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing thereof
- Patent number 12,341,107
- Issue date Jun 24, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Yi Seul Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming multi-layer shielding st...
- Patent number 12,327,799
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for selective EMI shielding using a...
- Patent number 12,327,800
- Issue date Jun 10, 2025
- STATS ChipPAC Pte. Ltd.
- GunHyuck Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,327,826
- Issue date Jun 10, 2025
- Samsung Electronics Co., Ltd.
- Yongkoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 12,327,804
- Issue date Jun 10, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Ying Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transient stabilized SOI FETs
- Patent number 12,322,713
- Issue date Jun 3, 2025
- pSemi Corporation
- Robert Mark Englekirk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming microelectromechanical s...
- Patent number 12,319,564
- Issue date Jun 3, 2025
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Slotted absorber
- Patent number 12,317,465
- Issue date May 27, 2025
- Cisco Technology, Inc.
- Jianquan Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna and device configurations
- Patent number 12,315,986
- Issue date May 27, 2025
- QUALCOMM Incorporated
- Seong Heon Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System packaging for cellular modem and transceiver system of heter...
- Patent number 12,315,853
- Issue date May 27, 2025
- Apple Inc.
- Sidharth S. Dalmia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interference filter and electrostatic discharge / electrical surge...
- Patent number 12,316,105
- Issue date May 27, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Yupeng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with compartment shield formed from metal bars...
- Patent number 12,308,327
- Issue date May 20, 2025
- STATS ChipPAC Pte. Ltd.
- YongKook Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component module, sub-module, and method for manufacturi...
- Patent number 12,309,932
- Issue date May 20, 2025
- Murata Manufacturing Co., Ltd.
- Tsuyoshi Takakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded radio-frequency devices configured to provide shielding fo...
- Patent number 12,308,325
- Issue date May 20, 2025
- Skyworks Solutions, Inc.
- Pietro Natale Alessandro Chyurlia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with lid to manage radiation feedback
- Patent number 12,308,326
- Issue date May 20, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package structure comprising package unit incl...
- Patent number 12,300,630
- Issue date May 13, 2025
- Advanced Semiconductor Engineering, Inc.
- Ming-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,300,629
- Issue date May 13, 2025
- Samsung Electronics Co., Ltd.
- Youngwoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method for manufacturing same
- Patent number 12,300,628
- Issue date May 13, 2025
- Murata Manufacturing Co., Ltd.
- Toru Komatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-frequency module having a compartment shield structure
- Patent number 12,293,975
- Issue date May 6, 2025
- Murata Manufacturing Co., Ltd.
- Yoshihito Otsubo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including shielding cover that covers molded...
- Patent number 12,293,977
- Issue date May 6, 2025
- Samsung Electronics Co., Ltd.
- Young-Woo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit systems
- Patent number 12,293,978
- Issue date May 6, 2025
- Snap Inc.
- Stephen Andrew Steger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising discrete antenna device
- Patent number 12,293,980
- Issue date May 6, 2025
- QUALCOMM Incorporated
- Jaehyun Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor EMI shielding component, semiconductor package struct...
- Patent number 12,293,976
- Issue date May 6, 2025
- PHOENIX PIONEER TECHNOLOGY CO., LTD.
- E-Tung Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PSPI-based patterning method for RDL
- Patent number 12,288,781
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with hybrid mold layers
- Patent number 12,288,740
- Issue date Apr 29, 2025
- Intel Corporation
- Bok Eng Cheah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 12,288,753
- Issue date Apr 29, 2025
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 12,288,780
- Issue date Apr 29, 2025
- Samsung Electronics Co., Ltd.
- Ju-Youn Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...
- Publication number 20250210464
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...
- Publication number 20250210852
- Publication date Jun 26, 2025
- QUALCOMM Incorporated
- Ranadeep DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS
- Publication number 20250210463
- Publication date Jun 26, 2025
- NXP B.V.
- Douglas Michael Reber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20250201727
- Publication date Jun 19, 2025
- CXMT Corporation
- Qingchun FANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective EMI Shielding Using Preformed Mask with Fang Design
- Publication number 20250201729
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflowable Vapor Chamber Lid
- Publication number 20250201663
- Publication date Jun 19, 2025
- Marvell Asia Pte Ltd.
- Alaba Bamido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250201726
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuen-Shian Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded Laser Package with Electromagnetic Interference Shield and M...
- Publication number 20250201730
- Publication date Jun 19, 2025
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK
- Publication number 20250201728
- Publication date Jun 19, 2025
- Qorvo US, Inc.
- Zhunming Du
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Protective Layer on Subs...
- Publication number 20250201733
- Publication date Jun 19, 2025
- JCET STATS ChipPAC Korea Limited
- HyeonChul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING
- Publication number 20250203884
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jaio-Wei Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF COMPONENT WITH INTEGRATED EMI SHIELDING
- Publication number 20250192067
- Publication date Jun 12, 2025
- APPLIED OPTOELECTRONICS, INC.
- William G. MAHONEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...
- Publication number 20250194173
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...
- Publication number 20250194174
- Publication date Jun 12, 2025
- NANYA TECHNOLOGY CORPORATION
- Hsih-Yang CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONFIGURABLE PACKAGE INTEGRATED ELECTRO MAGNETIC INTERFERENCE SHI...
- Publication number 20250192068
- Publication date Jun 12, 2025
- Applied Materials, Inc.
- Ghaleb Saleh Ghaleb Al-Duhni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Devices in Semiconductor Packages and Methods of Forming...
- Publication number 20250192080
- Publication date Jun 12, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN TECHNIQUES FOR HIGH-FREQUENCY AND HIGH-SPEED SIGNALS IN A PA...
- Publication number 20250183193
- Publication date Jun 5, 2025
- Telefonaktiebolaget LM Ericsson (publ)
- Martin HANSSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH ELECTRICAL SHIELDING STRUCTURE AND MESH PAD STRUC...
- Publication number 20250174574
- Publication date May 29, 2025
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174603
- Publication date May 29, 2025
- KIOXIA Corporation
- Akihito SAWANOBORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250174582
- Publication date May 29, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Yang LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHO...
- Publication number 20250167133
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- YOUNGWOO PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC PACKAGES
- Publication number 20250167185
- Publication date May 22, 2025
- NXP USA, Inc.
- Sharan Kishore
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CIRCUITS UNDER INDUCTOR (CUL)
- Publication number 20250169085
- Publication date May 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kai-Chun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE
- Publication number 20250167131
- Publication date May 22, 2025
- Advanced Semiconductor Engineering, Inc.
- Hsun-Wei CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD OF EMI SHIELDING
- Publication number 20250167132
- Publication date May 22, 2025
- Applied Materials, Inc.
- Ghaleb Saleh Ghaleb Al-Duhni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...
- Publication number 20250159787
- Publication date May 15, 2025
- Skyworks Solutions, Inc.
- Darren Roger Frenette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...
- Publication number 20250157862
- Publication date May 15, 2025
- NXP B.V.
- Yu Ling Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-GATE TOTAL IONIZING DOSE (TID) RADIATION-HARDENED DEVICE
- Publication number 20250157944
- Publication date May 15, 2025
- Peking University
- Xia AN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package Structure and Manufacturing Method Therefor
- Publication number 20250157945
- Publication date May 15, 2025
- Huawei Technologies Co., Ltd
- Xuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND TESTING METHOD
- Publication number 20250155498
- Publication date May 15, 2025
- Advanced Semiconductor Engineering, Inc.
- Chen-Chao WANG
- G01 - MEASURING TESTING

Protection against radiation

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Shielded semiconductor package with open terminal and methods of ma...

Compartmentalized shielding of a module utilizing self-shielded sub...

Chip package and manufacturing method thereof

Semiconductor device and method of manufacturing thereof

Semiconductor device and method of forming multi-layer shielding st...

Semiconductor device and method for selective EMI shielding using a...

Semiconductor package

Semiconductor device and manufacturing method thereof

Transient stabilized SOI FETs

Semiconductor device and method of forming microelectromechanical s...

Slotted absorber

Antenna and device configurations

System packaging for cellular modem and transceiver system of heter...

Interference filter and electrostatic discharge / electrical surge...

Semiconductor device with compartment shield formed from metal bars...

Electronic component module, sub-module, and method for manufacturi...

Shielded radio-frequency devices configured to provide shielding fo...

Electronic component with lid to manage radiation feedback

Semiconductor device package structure comprising package unit incl...

Semiconductor package and method of fabricating the same

Module and method for manufacturing same

High-frequency module having a compartment shield structure

Semiconductor package including shielding cover that covers molded...

Circuit systems

Package comprising discrete antenna device

Semiconductor EMI shielding component, semiconductor package struct...

PSPI-based patterning method for RDL

Semiconductor package with hybrid mold layers

Semiconductor device with partial EMI shielding and method of makin...

Semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR CIRCUIT WITH SELECTIVE BACKSIDE POWER AND GROUND DIST...

ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD P...

SEMICONDUCTOR DIE WITH BURIED ELECTRICAL INTERCONNECTIONS

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREFOR

Selective EMI Shielding Using Preformed Mask with Fang Design

Reflowable Vapor Chamber Lid

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Molded Laser Package with Electromagnetic Interference Shield and M...

ELECTRONIC COMPONENT WITH LID TO MANAGE RADIATION FEEDBACK

Semiconductor Device and Method of Forming Protective Layer on Subs...

METAL-INSULATOR-METAL CAPACITOR WITH PARTIAL BOTTOM LANDING

RF COMPONENT WITH INTEGRATED EMI SHIELDING

SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...

SEMICONDUCTOR DEVICE STRUCTURE WITH BACKSIDE PICK-UP REGION AND MET...

RECONFIGURABLE PACKAGE INTEGRATED ELECTRO MAGNETIC INTERFERENCE SHI...

Integrated Devices in Semiconductor Packages and Methods of Forming...

DESIGN TECHNIQUES FOR HIGH-FREQUENCY AND HIGH-SPEED SIGNALS IN A PA...

CHIP PACKAGE WITH ELECTRICAL SHIELDING STRUCTURE AND MESH PAD STRUC...

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE INCLUDING AN ELECTROMAGNETIC SHIELD AND METHO...

STACKED ELECTRONIC PACKAGES

SEMICONDUCTOR DEVICES INCLUDING CIRCUITS UNDER INDUCTOR (CUL)

OPTICAL PACKAGE STRUCTURE

NOVEL METHOD OF EMI SHIELDING

PACKAGED MODULE WITH FRONT END INTEGRATED CIRCUIT AND STACKED FILTE...

SEMICONDUCTOR DEVICE HAVING INTEGRATED LID STRUCTURE AND METHOD THE...

MULTI-GATE TOTAL IONIZING DOSE (TID) RADIATION-HARDENED DEVICE

Chip Package Structure and Manufacturing Method Therefor

PACKAGE STRUCTURE AND TESTING METHOD