Random access memory [RAM]

Industry

CPC
H01L2924/1435

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

Current Industry

H01L2924/1435Random access memory [RAM]

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package, semiconductor device and shielding housing o...
- Patent number 12,107,054
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity memory circuit with low effective latency
- Patent number 12,073,082
- Issue date Aug 27, 2024
- SUNRISE MEMORY CORPORATION
- Youn Cheul Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,894,346
- Issue date Feb 6, 2024
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 11,848,259
- Issue date Dec 19, 2023
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,791,303
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,756,918
- Issue date Sep 12, 2023
- Kioxia Corporation
- Tsutomu Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package assembly having a conductive electromagnetic...
- Patent number 11,728,292
- Issue date Aug 15, 2023
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity memory circuit with low effective latency
- Patent number 11,675,500
- Issue date Jun 13, 2023
- SUNRISE MEMORY CORPORATION
- Youn Cheul Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,664,352
- Issue date May 30, 2023
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device with separate die for programmable fabric...
- Patent number 11,632,112
- Issue date Apr 18, 2023
- Intel Corporation
- Ravi Prakash Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package, semiconductor device and shielding housing o...
- Patent number 11,610,848
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including semiconductor chips
- Patent number 11,569,193
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyungu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for integrating power and thermal management in...
- Patent number 11,520,388
- Issue date Dec 6, 2022
- Intel Corporation
- Sean R. Atsatt
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power management for multi-dimensional programmable logic devices
- Patent number 11,444,624
- Issue date Sep 13, 2022
- Intel Corporation
- Karthik Chandrasekar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module
- Patent number 11,410,970
- Issue date Aug 9, 2022
- ULTRAMEMORY INC.
- Ryuji Takishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Face-up fan-out electronic package with passive components using a...
- Patent number 11,211,337
- Issue date Dec 28, 2021
- Intel Corporation
- Lizabeth Keser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large channel interconnects with through silicon Vias (TSVs) and me...
- Patent number 11,127,715
- Issue date Sep 21, 2021
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 11,018,115
- Issue date May 25, 2021
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management for multi-dimensional programmable logic devices
- Patent number 10,812,085
- Issue date Oct 20, 2020
- Intel Corporation
- Karthik Chandrasekar
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor module
- Patent number 10,741,525
- Issue date Aug 11, 2020
- ULTRAMEMORY INC.
- Ryuji Takishita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component, and electronic component manufacturing method
- Patent number 10,643,976
- Issue date May 5, 2020
- NEC Corporation
- Yurika Otsuka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a high reliability
- Patent number 10,622,335
- Issue date Apr 14, 2020
- Samsung Electronics Co., Ltd.
- Ji-Hwan Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM magnetic shielding with fan-out wafer level packaging
- Patent number 10,475,985
- Issue date Nov 12, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Bharat Bhushan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded magnetoresistive random access memory devices and methods...
- Patent number 10,431,732
- Issue date Oct 1, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Bhushan Bharat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional flash NOR memory system with configurable pins
- Patent number 10,373,686
- Issue date Aug 6, 2019
- Silicon Storage Technology, Inc.
- Hieu Van Tran
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit packages including modules that include at least one integr...
- Patent number 10,178,786
- Issue date Jan 8, 2019
- Honeywell International Inc.
- James L. Tucker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Large channel interconnects with through silicon vias (TSVs) and me...
- Patent number 10,177,116
- Issue date Jan 8, 2019
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alternative surfaces for conductive pad layers of silicon bridges f...
- Patent number 10,177,083
- Issue date Jan 8, 2019
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure
- Patent number 10,128,192
- Issue date Nov 13, 2018
- Mediatek Inc.
- Min-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with dual second level electrical interconnec...
- Patent number 10,028,380
- Issue date Jul 17, 2018
- SanDisk Technologies LLC
- Abhishek Ramesh Tambat
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...
- Publication number 20240371786
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITY MEMORY CIRCUIT WITH LOW EFFECTIVE LATENCY
- Publication number 20240345736
- Publication date Oct 17, 2024
- Sunrise Memory Corporation
- Youn Cheul Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240332221
- Publication date Oct 3, 2024
- Samsung Electronics Co., Ltd.
- Seungyoung AHN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING
- Publication number 20240332252
- Publication date Oct 3, 2024
- Meta Platforms Technologies, LLC
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20240258228
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Juneyoung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Dimensional Application-Specific Integrated Circuit Architecture
- Publication number 20240243112
- Publication date Jul 18, 2024
- META PLATFORMS, INC.
- Ravi Shankar Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234275
- Publication date Jul 11, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Hui Yeong JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240234376
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Hyun Soo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES
- Publication number 20240213109
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING CAPACITORS
- Publication number 20240213143
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Eunseok Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240203854
- Publication date Jun 20, 2024
- Samsung Electronics Co., Ltd.
- Hyeon Jeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240178114
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- KYOUNG LIM SUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240178117
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Myung Sam KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240136331
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Hyun Soo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240096717
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- AE-NEE JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BONDING WIRE COATED WITH OXIDE INSU...
- Publication number 20240088088
- Publication date Mar 14, 2024
- Soo Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240071882
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Seongho SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240055339
- Publication date Feb 15, 2024
- Samsung Electronics Co., Ltd.
- Hwanjoo Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
- Publication number 20240055333
- Publication date Feb 15, 2024
- CHANGXIN MEMORY TECHNOLOGIES, INC
- LING-YI CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20240047230
- Publication date Feb 8, 2024
- Resonac Corporation
- Tomoko HIGASHIUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240047419
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Geunwoo KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240047418
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Choongbin YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-MEMORY COMPUTING CIRCUIT AND FABRICATION METHOD THEREOF
- Publication number 20230361081
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hidehiro Fujiwara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH CAPACITY MEMORY CIRCUIT WITH LOW EFFECTIVE LATENCY
- Publication number 20230259283
- Publication date Aug 17, 2023
- Sunrise Memory Corporation
- Youn Cheul Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Integrated Circuit Device with Separate Die for Programmable Fabric...
- Publication number 20230253965
- Publication date Aug 10, 2023
- Intel Corporation
- Ravi Prakash Gutala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...
- Publication number 20230197633
- Publication date Jun 22, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS
- Publication number 20230154886
- Publication date May 18, 2023
- Samsung Electronics Co., Ltd.
- Hyungu KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit Systems And Methods Using Spacer Dies
- Publication number 20230100829
- Publication date Mar 30, 2023
- Intel Corporation
- Sheue Fen Yong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...
- Publication number 20230082556
- Publication date Mar 16, 2023
- Canon Kabushiki Kaisha
- Masayoshi Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...
- Publication number 20220392847
- Publication date Dec 8, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Nuo Xu
- H01 - BASIC ELECTRIC ELEMENTS

Random access memory [RAM]

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor package, semiconductor device and shielding housing o...

High capacity memory circuit with low effective latency

Semiconductor package having a high reliability

Alternative surfaces for conductive pad layers of silicon bridges f...

Semiconductor package including semiconductor chips

Semiconductor device

Semiconductor package assembly having a conductive electromagnetic...

High capacity memory circuit with low effective latency

Semiconductor package having a high reliability

Integrated circuit device with separate die for programmable fabric...

Semiconductor package, semiconductor device and shielding housing o...

Semiconductor package including semiconductor chips

Systems and methods for integrating power and thermal management in...

Power management for multi-dimensional programmable logic devices

Semiconductor module

Face-up fan-out electronic package with passive components using a...

Large channel interconnects with through silicon Vias (TSVs) and me...

Semiconductor package having a high reliability

Power management for multi-dimensional programmable logic devices

Semiconductor module

Electronic component, and electronic component manufacturing method

Semiconductor package having a high reliability

MRAM magnetic shielding with fan-out wafer level packaging

Shielded magnetoresistive random access memory devices and methods...

Three-dimensional flash NOR memory system with configurable pins

Circuit packages including modules that include at least one integr...

Large channel interconnects with through silicon vias (TSVs) and me...

Alternative surfaces for conductive pad layers of silicon bridges f...

Fan-out package structure

Semiconductor package with dual second level electrical interconnec...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...

HIGH CAPACITY MEMORY CIRCUIT WITH LOW EFFECTIVE LATENCY

SEMICONDUCTOR PACKAGE

HIGH-DENSITY SYSTEM-ON-CHIP PARTITIONING

INTEGRATED CIRCUIT DEVICE

Three Dimensional Application-Specific Integrated Circuit Architecture

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE WITH SEMICONDUCTOR DEVICES

SEMICONDUCTOR PACKAGES HAVING CAPACITORS

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING BONDING WIRE COATED WITH OXIDE INSU...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

IN-MEMORY COMPUTING CIRCUIT AND FABRICATION METHOD THEREOF

HIGH CAPACITY MEMORY CIRCUIT WITH LOW EFFECTIVE LATENCY

Integrated Circuit Device with Separate Die for Programmable Fabric...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...

SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIPS

Circuit Systems And Methods Using Spacer Dies

DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD T...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND SHIELDING HOUSING O...