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HYBRID CONDUCTIVE STRUCTURES
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Publication number 20240096998
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Publication date Mar 21, 2024
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Shuen-Shin LIANG
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H01 - BASIC ELECTRIC ELEMENTS
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DEVICE FOR FORMING CONDUCTIVE POWDER
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Publication number 20230381862
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Publication date Nov 30, 2023
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Taiwan Semiconductor Manufacturing Company, Ltd.
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You-Hua CHOU
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B22 - CASTING POWDER METALLURGY
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Bottom-up Formation of Contact Plugs
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Publication number 20230386917
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Publication date Nov 30, 2023
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Taiwan Semiconductor Manufacturing Co, LTD.
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Yen-Yu Chen
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H01 - BASIC ELECTRIC ELEMENTS
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METHOD OF DEPOSITING LAYERS
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Publication number 20230122969
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Publication date Apr 20, 2023
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Applied Materials, Inc.
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Shirish PETHE
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H01 - BASIC ELECTRIC ELEMENTS
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HYBRID CONDUCTIVE STRUCTURES
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Publication number 20220367660
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Publication date Nov 17, 2022
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Shuen-Shin Liang
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H01 - BASIC ELECTRIC ELEMENTS
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Bottom-up Formation of Contact Plugs
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Publication number 20220359285
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Publication date Nov 10, 2022
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Taiwan Semiconductor Manufacturing Co., Ltd.
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Yen-Yu Chen
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H01 - BASIC ELECTRIC ELEMENTS
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Ruthenium Reflow For Via Fill
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Publication number 20220223472
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Publication date Jul 14, 2022
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Applied Materials, Inc.
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Yi Luo
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H01 - BASIC ELECTRIC ELEMENTS
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ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS
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Publication number 20220102209
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Publication date Mar 31, 2022
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LAM RESEARCH CORPORATION
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Tighe A. Spurlin
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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