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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

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Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode containing a grating and methods of making the...
- Patent number 11,695,100
- Issue date Jul 4, 2023
- Nanosys, Inc.
- Zhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 11,545,452
- Issue date Jan 3, 2023
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 11,043,468
- Issue date Jun 22, 2021
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device bonding area including fused solder film and m...
- Patent number 10,910,331
- Issue date Feb 2, 2021
- Lapis Semiconductor Co., Ltd.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 10,643,863
- Issue date May 5, 2020
- Advanced Semiconductor Engineering, Inc.
- You-Lung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead-free solder joining of electronic structures
- Patent number 10,586,782
- Issue date Mar 10, 2020
- International Business Machines Corporation
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a clip
- Patent number 10,424,534
- Issue date Sep 24, 2019
- Infineon Technologies AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film element and method for manufacturing the same
- Patent number 10,388,603
- Issue date Aug 20, 2019
- MURATA MANUFACTURING CO., LTD.
- Toshiyuki Nakaiso
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Hybrid low metal loading flux
- Patent number 9,950,393
- Issue date Apr 24, 2018
- Intel Corporation
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,935,044
- Issue date Apr 3, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsiu-Jen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device contact structure having stacked nickel, coppe...
- Patent number 9,853,006
- Issue date Dec 26, 2017
- GLOBALFOUNDRIES Inc.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connections, structures with such connections, and metho...
- Patent number 9,793,198
- Issue date Oct 17, 2017
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing element chip and method of manufacturing el...
- Patent number 9,698,052
- Issue date Jul 4, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Atsushi Harikai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a clip
- Patent number 9,640,465
- Issue date May 2, 2017
- Infineon Technologies AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for semiconductor devices
- Patent number 9,362,241
- Issue date Jun 7, 2016
- Renesas Electronics Corporation
- Takaomi Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging and manufacturing method thereof
- Patent number 9,355,927
- Issue date May 31, 2016
- Taiwan Semiconductor Manufacturing Company Ltd.
- Hsiu-Jen Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor structure with low-melting-temperature conductive reg...
- Patent number 9,318,313
- Issue date Apr 19, 2016
- STMicroelectronics S.r.l.
- Alberto Pagani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to realize flux free indium bumping
- Patent number 8,900,986
- Issue date Dec 2, 2014
- Shanghai Institute of Microsystem and Information Technology, Chinese Academy...
- Qiuping Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for inhibiting growth of intermetallic compounds
- Patent number 8,835,300
- Issue date Sep 16, 2014
- National Chiao Tung University
- Chih Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for packaging ultra-thin chip with solder ball thermo-compre...
- Patent number 8,563,417
- Issue date Oct 22, 2013
- Alpha & Omega Semiconductor, Inc.
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional device fabrication method
- Patent number 7,354,798
- Issue date Apr 8, 2008
- International Business Machines Corporation
- H. Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS
- Publication number 20240038703
- Publication date Feb 1, 2024
- ATI Technologies ULC
- JIANGUO LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME
- Publication number 20230299040
- Publication date Sep 21, 2023
- Intel Corporation
- Jay Prakash Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE CONTAINING A GRATING AND METHODS OF MAKING THE...
- Publication number 20210226107
- Publication date Jul 22, 2021
- GLO AB
- Zhen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20210125957
- Publication date Apr 29, 2021
- Commissariat A L'Energie Atomique et Aux Energies Alternatives
- Jean BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND M...
- Publication number 20210118831
- Publication date Apr 22, 2021
- LAPIS SEMICONDUCTOR CO., LTD.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20200161272
- Publication date May 21, 2020
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20190139918
- Publication date May 9, 2019
- LAPIS SEMICONDUCTOR CO., LTD.
- Masanori Shindo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES
- Publication number 20190006312
- Publication date Jan 3, 2019
- International Business Machines Corporation
- CHARLES L. ARVIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20180236609
- Publication date Aug 23, 2018
- Intel Corporation
- Rajen S. SIDHU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THIN FILM ELEMENT AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180226346
- Publication date Aug 9, 2018
- Murata Manufacturing Co., Ltd.
- Toshiyuki Nakaiso
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20180061793
- Publication date Mar 1, 2018
- KINPO ELECTRONICS, INC.
- Yu-Wei Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A CLIP
- Publication number 20170250125
- Publication date Aug 31, 2017
- INFINEON TECHNOLOGIES AG
- Xavier Arokiasamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED CONTACT STRUCTURE
- Publication number 20160307860
- Publication date Oct 20, 2016
- GLOBALFOUNDRIES INC.
- Charles L. Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES
- Publication number 20160247772
- Publication date Aug 25, 2016
- RENESAS ELECTRONICS CORPORATION
- Takaomi Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES
- Publication number 20160064343
- Publication date Mar 3, 2016
- Renesas Electronics Corporation
- Takaomi Nishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LOW METAL LOADING FLUX
- Publication number 20130341379
- Publication date Dec 26, 2013
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...
- Publication number 20130285056
- Publication date Oct 31, 2013
- STMicroelectronics S.r. I.
- Alberto PAGANI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REALIZE FLUX FREE INDIUM BUMPING
- Publication number 20130273730
- Publication date Oct 17, 2013
- Qiuping Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...
- Publication number 20130130443
- Publication date May 23, 2013
- Jun Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS
- Publication number 20130037940
- Publication date Feb 14, 2013
- NATIONAL CHIAO-TUNG UNIVERSITY
- Chih CHEN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRIC JOINT STRUCTURE AND METHOD FOR PREPARING THE SAME
- Publication number 20130000967
- Publication date Jan 3, 2013
- Samsung Electro-Mechanics CO., LTD.
- Dong Jun LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF
- Publication number 20120126397
- Publication date May 24, 2012
- Siliconware Precision Industries Co., Ltd.
- Feng-Lung Chien
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE
- Publication number 20120098143
- Publication date Apr 26, 2012
- Tsung-Chi WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional device fabrication method
- Publication number 20060121690
- Publication date Jun 8, 2006
- H Bernhard Pogge
- H01 - BASIC ELECTRIC ELEMENTS

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Light emitting diode containing a grating and methods of making the...

Semiconductor device bonding area including fused solder film and m...

Lead-free solder joining of electronic structures

Semiconductor device bonding area including fused solder film and m...

Semiconductor package and method of manufacturing the same

Lead-free solder joining of electronic structures

Semiconductor device including a clip

Thin film element and method for manufacturing the same

Hybrid low metal loading flux

Semiconductor packaging and manufacturing method thereof

Semiconductor device contact structure having stacked nickel, coppe...

Conductive connections, structures with such connections, and metho...

Method of manufacturing element chip and method of manufacturing el...

Semiconductor device including a clip

Manufacturing method for semiconductor devices

Semiconductor packaging and manufacturing method thereof

Semiconductor structure with low-melting-temperature conductive reg...

Method to realize flux free indium bumping

Method for inhibiting growth of intermetallic compounds

Method for packaging ultra-thin chip with solder ball thermo-compre...

Three-dimensional device fabrication method

Patents Applicationslast 30 patents

SEMICONDUCTOR ASSEMBLY INCLUDING MULTIPLE SOLDER MASKS

METHOD OF ATOMIC DIFFUSION HYBRID BONDING AND APPARATUS MADE FROM SAME

LIGHT EMITTING DIODE CONTAINING A GRATING AND METHODS OF MAKING THE...

METHOD FOR FABRICATING AN ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE BONDING AREA INCLUDING FUSED SOLDER FILM AND M...

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

LEAD-FREE SOLDER JOINING OF ELECTRONIC STRUCTURES

HYBRID LOW METAL LOADING FLUX

THIN FILM ELEMENT AND METHOD FOR MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE INCLUDING A CLIP

LAYERED CONTACT STRUCTURE

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES

MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICES

HYBRID LOW METAL LOADING FLUX

SEMICONDUCTOR STRUCTURE WITH LOW-MELTING-TEMPERATURE CONDUCTIVE REG...

METHOD TO REALIZE FLUX FREE INDIUM BUMPING

METHOD FOR PACKAGING ULTRA-THIN CHIP WITH SOLDER BALL THERMO-COMPRE...

METHOD FOR INHIBITING GROWTH OF INTERMETALLIC COMPOUNDS

ELECTRIC JOINT STRUCTURE AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF

METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE

Three-dimensional device fabrication method