Patent Application
20130273730
1. Field of the Invention
In this invention a method to realize fluxless indium bumping is described. This method can be used for the packaging for MEMS, photoelectric chip, bio-chip and so on. It is an invention in the field of microelectronics packaging.
2. Prior Art
Solder is a must for microelectronics packaging. Normally it can help to realize the signal transmission and provide mechanical support in and between chips. For a normal packaging process, flux is also a must. For example, when using Sn solder to weld chips without flux, it will be very difficult to get a high quality interconnect due to the oxidized surface. Such oxidized surface will prevent alloy formation when welding because it has a very high melting point. In order to get a high-quality interconnection, flux must be used for remove the oxide layer. But for some application, such as the packaging of the photoelectric chip (with optical lens), MEMS and biological detection chip, flux is prohibited to avoid its pollution to chip. The pollution probably causes device performance degradation and even completely failure. So it is necessary to develop a kind of flux free welding process for such applications. Normally two ways can be used to realize such kind of welding. One is with special flux such as hydrogen plasma, which can provide a strong educability environment; the other is to coat a special thin layer on the solder surface which can prevent the solder being oxidized. The second way is described in this invention.
The most difficult point for this technology is how to realize flux free solder bumping. So far two research groups have some studies on this technology deduced from the published paper. First one is Chin C. Lee's group, who succeeded to realize two chips welding with Tin-based solder and without flux [Chin C. Lee, Ricky W. Chuang. Fluxless Non-Eutectic Joints Fabricated Using Gold-Tin Multilayer Composite. IEEE Transactions On Components And Packaging Technologies, 2003, 26(2):252-263]; the other is Jeong-Won Yoon's group, who realized Tin-based solder bumping without flux[Jeong-Won Yoon, Hyun-Suk Chun, Seung-Boo Jung.Reliability evaluation of Au—20Sn flip chip solder bump fabricated by sequential electroplating method with Sn and Au. Materials Science and Engineering A, 2008, 473:119-125.]. In this invention, a method is proposed to achieve flux free indium-based bumping. As it is known, indium is a kind of metal with many excellent properties, such as low melting point, excellent plasticity, excellent welding characteristics in low temperature and so on. These properties are better than that of Tin-based solder.
To realize flux free indium bumping, a layer is introduced onto its surface with electroplating, what can protect indium from being oxidized. As it is known, the normally used metal for anti-oxidation layer is golden or silver. But when introducing Au onto indium solder surface, Au—In alloy on the indium solder surface will prevent indium bumping due to its high melting point what can be deduced from Au—In phase diagram. When introducing Ag onto the indium surface, the issue described above will not appear. From the Ag—In phase diagram, the melting point of In—Ag alloy will drop firstly, and to the lowest melting point (144° C.) when the In/Ag mass ratio is about 24 and then increase slowly when the Ag content increasing. To solder for welding, the melting point of 144° C. is quite low. So by introducing Ag onto the surface of indium solder, it can prevent indium from being oxidized and also kept the reflow temperature at a low level.
Ag coating on indium solder is the key point in this invention. In order to clarify this invention, a detailed process flow is described as an example;
The process flow is showed as following.
A. Si substrate metallization
(a) Substrate plane preparation: SiO2 is grown on the Si wafer by thermal oxidation;
(b) Ti/Cu/Ti is sputtered on oxidation Si wafer with method of magnetron sputtering. Ti under Cu is as adhesion layer to SiO2, Ti on Cu layer protects Cu from being oxidized and also can provide excellent adhesion to the sputtered oxide layer. Ti/Cu/Ti here is used as underbump metallization (UMB) layer and also seed layer;
B. Contact holes opening
(a) SiO2 passivation layer is deposited on Ti/Cu/Ti with PECVD (plasma-enhanced chemical vapor) method;
(b) Define pattern on the wafer with lithography process: Firstly, to coat 1-3 um positive photography on the wafer and finish photography process; secondly to remove photoresit at the wafer edge; thirdly, to remove SiO2 layer on the pattern to get contact holes with CF4 plasma or BOE (buffer oxide etch); The diameter of contact hole here is about 30 um-50 um;
C. Underbump metallization (UBM) thickening
(a) Cu layer thickening with electroplating. Normally the thickness for sputtered Cu layer is from 1000 Å to 5000 Å. If using Cu layer with such thickness as UBM, the solder bump will easily fall off when reflow. 2-4 um Cu layer here is preferred.
D. Indium electroplating on Cu UBM layer
(a) Remove photoresist by immersing wafer into hot acetone after Cu layer thickening;
(b) Indium electroplating on Ti/Cu see layer. To avoid the electroplated indium being oxidizing, it shouldn't be exposed into air before the Ag coating. The acetone can provide such protection.
E. Ag layer coating on indium surface with electroplating.
(a) Ag—In alloy will form on indium solder surface. This alloy layer will prevent indium from being oxidized;
F. Ag-coated indium solder bumping.
(a) The reflow process is carried in an annealing furnace with H2 or N2 atmosphere. The time is about 3 min-8 min at a summit temperature of 180° C.-220° C.;
Chip dicing;
From the process described above, a method is proposed to achieve flux free indium-based bumping in this invention. The advantages of this invention lies in the fact that: bumping process is with indium-based solder, which is a solder with low melting point, excellent plasticity, excellent welding property; The indium solder and the Ag coating layer can be easily prepared with step by step electroplating; The In—Ag solder can be reflowed at low temperature (−200° C.). In all, this invention provides a way to the packaging of the photoelectric chip (with optical lens), MEMS, biological detection chip and so on.
The character of the invention is as following:
(1) The indium-based bump is prepared with electroplating step by step after substrate metallization and contact hole opening;
Using sputtered Ti/Cu/Ti to realize substrate metallization;
Oxide passivation layer here is prepared with PECVD method; The contact hole is opened with BOE or CF4 plasma etching;
A perfect Ag coating layer on indium surface is got with a controllable electroplating process;
Reflow process is carried in an annealing furnace with H2 or N2 atmosphere and the reflow chart can be controlled;
The process for this invention is showed in
In order to clarify this invention, an example in detail can be described as following.
Step 1. Substrate plane preparation: 5000 Å SiO2 layer 101 is grown on the Si wafer substrate by thermal oxidation, and then a layer 102 is sputtered on the SiO2 layer. The Ti/Cu/Ti (200 Å/2000 Å/200 Å) used as underbump metallization (UMB) layer and also seed layer;
Step 2. Passivation layer preparation: A 5000 Å SiO2 layer 103 is prepared with plasma-enhanced chemical vapor deposition (PECVD) method;
Step 3. A 1.7 um positive photoreisit (S1912) 104 is coated on the wafer and then finish photography process;
Step 4. Contact hole opening: SiO2 and Ti on Cu layer are etched away with BOE (buffer-oxide-etch); 40 um Cu pattern 105 is exposed;
Step 5. Cu layer thickening: 2 um Cu 106 is prepared on sputtered Cu layer. After finishing Cu electroplating, photoresit is removed with acetone (the PR removal also can be carried in step 8 before the reflow process);
Step 6. Prepare indium bump with electroplating: A current of 5-20 mA/cm2 is preferred and the indium bump 107 is prepared; after finishing electroplating, the wafer is immersed into alcohol to prevent it from being oxidized;
Step 7. Ag layer 108 is coated onto the surface of indium solder. The thickness of Ag layer is controlled by electroplating condition; the mass ratio of In/Ag is controlled by the thickness of the Ag layer; the mass ratio of In/Ag should be near to 24, where is the In/Ag eutectic point;
Step 8. The indium bump is reflowed in a furnace with H2 or N2 atmosphere with summit temperature of 200° C. for 5 min. The final indium bump 109 can be got.
Wafer dicing.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201010515444.0 | Oct 2010 | CN | national |
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/CN11/81091 | 10/21/2011 | WO | 00 | 6/13/2013 |
