Reinforcing structures

Industry

CPC
H01L2224/02125

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/02125Reinforcing structures

Industries

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method to minimize stress on stack via
- Patent number 12,080,600
- Issue date Sep 3, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,961,810
- Issue date Apr 16, 2024
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 11,855,014
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,810,837
- Issue date Nov 7, 2023
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods related to stack structures including passivati...
- Patent number 11,804,460
- Issue date Oct 31, 2023
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 11,791,286
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Youn-ji Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices and apparatuses having a patterned surface...
- Patent number 11,640,948
- Issue date May 2, 2023
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 11,616,028
- Issue date Mar 28, 2023
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution layer (RDL) structure, semiconductor device and manu...
- Patent number 11,605,605
- Issue date Mar 14, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC.
- Ping-Heng Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus
- Patent number 11,410,946
- Issue date Aug 9, 2022
- Mitsubishi Electric Corporation
- Daisuke Hirata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structures in electronic devices including passivation layers...
- Patent number 11,257,774
- Issue date Feb 22, 2022
- Skyworks Solutions, Inc.
- Jiro Yota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 11,043,462
- Issue date Jun 22, 2021
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microelectronic devices having a patterned surfa...
- Patent number 10,950,564
- Issue date Mar 16, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,879,198
- Issue date Dec 29, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method
- Patent number 10,867,941
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having crack-inhibiting structures
- Patent number 10,811,365
- Issue date Oct 20, 2020
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for solder connections
- Patent number 10,453,815
- Issue date Oct 22, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,340,208
- Issue date Jul 2, 2019
- Rohm Co., Ltd.
- Motoharu Haga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless interconnection structure and method of forming same
- Patent number 10,319,691
- Issue date Jun 11, 2019
- Taiwan Semiconductor Manufacturing Company
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal pads with openings in integrated circuits i...
- Patent number 10,269,736
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through-silicon-via and methods of form...
- Patent number 10,262,922
- Issue date Apr 16, 2019
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with solder regions aligned to recesses
- Patent number 10,262,958
- Issue date Apr 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a bump contact on a TSV comprising a cavi...
- Patent number 10,217,715
- Issue date Feb 26, 2019
- AMS AG
- Martin Schrems
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,109,608
- Issue date Oct 23, 2018
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures having a tapering curved profile and methods of making same
- Patent number 10,008,459
- Issue date Jun 26, 2018
- Taiwan Semiconductor Manufacturing Company
- Pei-Chun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump structure and method of forming same
- Patent number 9,966,346
- Issue date May 8, 2018
- Taiwan Semiconductor Manufacturing Company
- Guan-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive contacts having varying widths and method of manufacturi...
- Patent number 9,953,939
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having through-silicon-via and methods of form...
- Patent number 9,941,190
- Issue date Apr 10, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underbump metallization structure
- Patent number 9,859,235
- Issue date Jan 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming micro-vias partially thr...
- Patent number 9,685,415
- Issue date Jun 20, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...
- Publication number 20240387429
- Publication date Nov 21, 2024
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240030104
- Publication date Jan 25, 2024
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CURVED LIGHT-EMITTING SUBSTRATE
- Publication number 20230275102
- Publication date Aug 31, 2023
- SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.
- Zhenhai YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME
- Publication number 20230056623
- Publication date Feb 23, 2023
- CHANGXIN MEMORY TECHNOLOGIES, INC
- Chih-Cheng LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...
- Publication number 20220336396
- Publication date Oct 20, 2022
- Skyworks Solutions, Inc.
- Jiro YOTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
- Publication number 20220278088
- Publication date Sep 1, 2022
- SAMSUNG DISPLAY CO., LTD.
- Chan Jae PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20220102245
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- Chulyong Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20220013481
- Publication date Jan 13, 2022
- RENESAS ELECTRONICS CORPORATION
- Tatsuya USAMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210384144
- Publication date Dec 9, 2021
- Samsung Electronics Co., Ltd.
- Youn-ji MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...
- Publication number 20210225787
- Publication date Jul 22, 2021
- Changxin Memory Technologies, Inc.
- Ping-Heng WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...
- Publication number 20210202417
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method
- Publication number 20210098397
- Publication date Apr 1, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20210020585
- Publication date Jan 21, 2021
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
- Publication number 20200211982
- Publication date Jul 2, 2020
- Micron Technology, Inc.
- Shams U. Arifeen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solderless Interconnection Structure and Method of Forming Same
- Publication number 20190295971
- Publication date Sep 26, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20190214356
- Publication date Jul 11, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...
- Publication number 20180190571
- Publication date Jul 5, 2018
- Micron Technology, Inc.
- Jaspreet S. Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
- Publication number 20170271286
- Publication date Sep 21, 2017
- Samsung Electronics Co., Ltd.
- YOUNGBAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...
- Publication number 20170069587
- Publication date Mar 9, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yen-Liang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package with Solder Regions Aligned to Recesses
- Publication number 20140374899
- Publication date Dec 25, 2014
- Ching-Jung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...
- Publication number 20140264855
- Publication date Sep 18, 2014
- Macronix International Co., Ltd.
- Ming-Tung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Micro-Vias Partially Thr...
- Publication number 20140239496
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...
- Publication number 20140225259
- Publication date Aug 14, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
Metal Pads with Openings in Integrated Circuits
- Publication number 20140061898
- Publication date Mar 6, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...
- Publication number 20140038406
- Publication date Feb 6, 2014
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Application
CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...
- Publication number 20140015127
- Publication date Jan 16, 2014
- AGERE SYSTEMS LLC
- Mark A. Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20130256877
- Publication date Oct 3, 2013
- Samsung Electronics Co., Ltd.
- YoungLyong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Micro-Vias Partially thr...
- Publication number 20130249105
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE ON POST-PASSIVATION INTERC...
- Publication number 20130147031
- Publication date Jun 13, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS

Reinforcing structures

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Semiconductor device and method to minimize stress on stack via

Solderless interconnection structure and method of forming same

Semiconductor device and method

Semiconductor packages

Devices and methods related to stack structures including passivati...

Semiconductor device and semiconductor package

Microelectronic devices and apparatuses having a patterned surface...

Semiconductor devices having crack-inhibiting structures

Redistribution layer (RDL) structure, semiconductor device and manu...

Semiconductor apparatus

Stack structures in electronic devices including passivation layers...

Solderless interconnection structure and method of forming same

Methods of forming microelectronic devices having a patterned surfa...

Package with solder regions aligned to recesses

Semiconductor device and method

Semiconductor devices having crack-inhibiting structures

Methods and apparatus for solder connections

Semiconductor device

Solderless interconnection structure and method of forming same

Method of forming metal pads with openings in integrated circuits i...

Semiconductor device having through-silicon-via and methods of form...

Package with solder regions aligned to recesses

Semiconductor device with a bump contact on a TSV comprising a cavi...

Semiconductor package

Structures having a tapering curved profile and methods of making same

Bump structure and method of forming same

Conductive contacts having varying widths and method of manufacturi...

Semiconductor device having through-silicon-via and methods of form...

Underbump metallization structure

Semiconductor device and method of forming micro-vias partially thr...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT (IC) CHIP WITH BUMP INTERCONNECTS EACH HAVING MU...

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

SEMICONDUCTOR PACKAGES

CURVED LIGHT-EMITTING SUBSTRATE

SEMICONDUCTOR STRUCTURE AND METHOD FOR PREPARING SAME

DEVICES AND METHODS RELATED TO STACK STRUCTURES INCLUDING PASSIVATI...

DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

REDISTRIBUTION LAYER (RDL) STRUCTURE, SEMICONDUCTOR DEVICE AND MANU...

MICROELECTRONIC DEVICES AND APPARATUSES HAVING A PATTERNED SURFACE...

Semiconductor Device and Method

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES

Solderless Interconnection Structure and Method of Forming Same

Package with Solder Regions Aligned to Recesses

SEMICONDUCTOR DEVICE HAVING THROUGH-SILICON-VIA AND METHODS OF FORM...

SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES

CONDUCTIVE CONTACTS HAVING VARYING WIDTHS AND METHOD OF MANUFACTURI...

Package with Solder Regions Aligned to Recesses

SEMICONDUCTOR COMPOSITE LAYER STRUCTURE AND SEMICONDUCTOR PACKAGING...

Semiconductor Device and Method of Forming Micro-Vias Partially Thr...

SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERC...

Metal Pads with Openings in Integrated Circuits

METHOD FOR FABRICATING A THROUGH WIRE INTERCONNECT (TWI) ON A SEMIC...

CONTACT SUPPORT PILLAR STRUCTURE FOR FLIP CHIP SEMICONDUCTOR DEVICE...

SEMICONDUCTOR PACKAGE

Semiconductor Device and Method of Forming Micro-Vias Partially thr...

SEMICONDUCTOR DEVICE WITH BUMP STRUCTURE ON POST-PASSIVATION INTERC...