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Rotational mechanism

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  • CPC
  • H01L2224/78822
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HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

Current Industry

H01L2224/78822Rotational mechanism
Industries

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    WIRE BONDING APPARATUS
    • Publication number 20230125756
    • Publication date Apr 27, 2023
    • SHINKAWA LTD.
    • Osamu KAKUTANI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDING METHOD AND WIRE BONDING APPARATUS
    • Publication number 20210351155
    • Publication date Nov 11, 2021
    • KAIJO CORPORATION
    • Mami KUSHIMA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
    • Publication number 20180323166
    • Publication date Nov 8, 2018
    • SHINKAWA LTD.
    • Yuu HASEGAWA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    OFF SUBSTRATE KINKING OF BOND WIRE
    • Publication number 20160225739
    • Publication date Aug 4, 2016
    • Invensas Corporation
    • Belgacem Haba
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
    • Publication number 20120013016
    • Publication date Jan 19, 2012
    • Tac Keun OH
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Dual Capillary IC Wirebonding
    • Publication number 20110272449
    • Publication date Nov 10, 2011
    • TEXAS INSTRUMENTS INCORPORATED
    • Rex Warren PIRKLE
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20100200969
    • Publication date Aug 12, 2010
    • Advanced Semiconductor Engineering, Inc.
    • Wen Pin HUANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BOND HEAD FOR HEAVY WIRE BONDER
    • Publication number 20100127045
    • Publication date May 27, 2010
    • Chi Wah CHENG
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FLEXIBLE SEMICONDUCTOR PACKAGE APPARATUS HAVING A RESPONSIVE BENDAB...
    • Publication number 20100109140
    • Publication date May 6, 2010
    • Tac Keun OH
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    WIRE BONDER
    • Publication number 20090218385
    • Publication date Sep 3, 2009
    • OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
    • Florian Faessler
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Dual Capillary IC Wirebonding
    • Publication number 20090091006
    • Publication date Apr 9, 2009
    • Rex Warren Pirkle
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Actuator and bonding apparatus
    • Publication number 20070040455
    • Publication date Feb 22, 2007
    • KABUSHIKI KAISHA SHINKAWA
    • Manabu Haraguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonder
    • Publication number 20060076390
    • Publication date Apr 13, 2006
    • Unaxis International Trading Ltd
    • Martin Melzer
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Wire bonder and method of operating the same
    • Publication number 20060071049
    • Publication date Apr 6, 2006
    • Farhad Farassat
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Motion control device for wire bonder bondhead
    • Publication number 20060060631
    • Publication date Mar 23, 2006
    • Kulicke & Soffa Industries, Inc.
    • E. Walter Frasch
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Method of measuring thickness of bonded ball in wire bonding
    • Publication number 20060054662
    • Publication date Mar 16, 2006
    • Kimiji Nishimaki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Bonding arm swinging type bonding apparatus
    • Publication number 20050184127
    • Publication date Aug 25, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Osamu Kakutani
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Actuator and bonding apparatus
    • Publication number 20050184600
    • Publication date Aug 25, 2005
    • KABUSHIKI KAISHA SHINKAWA
    • Manabu Haraguchi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonder
    • Publication number 20040245314
    • Publication date Dec 9, 2004
    • ESEC Trading SA
    • Dieter Vischer
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    High speed linear and rotary split-axis wire bonder
    • Publication number 20040129754
    • Publication date Jul 8, 2004
    • Krishnan Suresh
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Tool head for attaching an electrical conductor on the contact surf...
    • Publication number 20040129761
    • Publication date Jul 8, 2004
    • Manfred Reinold
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Novel ultrasonic vibration mode for wire bonding
    • Publication number 20020096554
    • Publication date Jul 25, 2002
    • Micron Technology, Inc.
    • Tongbi Jiang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20020050507
    • Publication date May 2, 2002
    • NEC Corporation
    • Akira Takeishi
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus and discharge method thereof
    • Publication number 20020043550
    • Publication date Apr 18, 2002
    • NEC Corporation
    • Maho Shoji
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Wire bonding apparatus
    • Publication number 20010002032
    • Publication date May 31, 2001
    • KABUSHIKI KAISHA SHINKAWA
    • Yoshimitsu Terakado
    • H01 - BASIC ELECTRIC ELEMENTS