Semiconductor insulating substrates

Industry

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H01L23/147

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Parent Industries

HELECTRICITY H01Electric elements H01LSEMICONDUCTOR DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR H01L23/00Details of semiconductor or other solid state devices

Current Industry

H01L23/147Semiconductor insulating substrates

Industries

Patents Grantslast 30 patents

Information Patent Grant
Split substrate interposer with integrated passive device
- Patent number 12,148,687
- Issue date Nov 19, 2024
- Tokyo Electron Limited
- Arya Bhattacherjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor package and semiconductor package
- Patent number 12,125,776
- Issue date Oct 22, 2024
- Yibu Semiconductor Co., Ltd.
- Weiping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encircling a semiconductor device with stacked frames on a substrate
- Patent number 12,119,296
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-substrate via structure and method of manufacture
- Patent number 12,119,294
- Issue date Oct 15, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 12,119,229
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Yu-Hsiang Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,761
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around source/drain method of making contacts for backside metals
- Patent number 12,100,762
- Issue date Sep 24, 2024
- Intel Corporation
- Patrick Morrow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adapting electrical, mechanical, and thermal properties of package...
- Patent number 12,094,726
- Issue date Sep 17, 2024
- Applied Materials, Inc.
- Mukhles Sowwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Panel molded electronic assemblies with multi-surface conductive co...
- Patent number 12,096,549
- Issue date Sep 17, 2024
- Vicor Corporation
- Patrizio Vinciarelli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density interconnect device and method
- Patent number 12,094,831
- Issue date Sep 17, 2024
- Tahoe Research, LTD.
- Mihir K Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 12,087,679
- Issue date Sep 10, 2024
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-free frame design for silicon bridges for semiconductor packages
- Patent number 12,074,121
- Issue date Aug 27, 2024
- Intel Corporation
- Dae-Woo Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reconstituted substrate for radio frequency applications
- Patent number 12,051,653
- Issue date Jul 30, 2024
- Applied Materials, Inc.
- Guan Huei See
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and semiconductor device
- Patent number 12,051,662
- Issue date Jul 30, 2024
- Rohm Co., Ltd.
- Masatoshi Aketa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor device and method for manufacturing the same
- Patent number 12,040,244
- Issue date Jul 16, 2024
- INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Kai Cao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,990,351
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing semiconductor pac...
- Patent number 11,972,995
- Issue date Apr 30, 2024
- Samsung Electronics Co., Ltd.
- Dahee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder resist structure to mitigate solder bridge risk
- Patent number 11,967,547
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,961,742
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 11,942,408
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuo-Mao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,923,280
- Issue date Mar 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure and methods of forming the same
- Patent number 11,923,357
- Issue date Mar 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kai-Fang Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module circuit structure
- Patent number 11,923,266
- Issue date Mar 5, 2024
- Fuji Electric Co., Ltd.
- Makoto Isozaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device
- Patent number 11,908,837
- Issue date Feb 20, 2024
- Kioxia Corporation
- Soichiro Ibaraki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,908,759
- Issue date Feb 20, 2024
- Mediatek Inc.
- Nan-Cheng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including embedded bridge interconnect stru...
- Patent number 11,901,334
- Issue date Feb 13, 2024
- Micron Technology, Inc.
- Shing-Yih Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 11,895,780
- Issue date Feb 6, 2024
- Unimicron Technology Corp.
- Kai-Ming Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,887,919
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Yun Seok Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Semiconductor Device Having TSV Formed Through...
- Publication number 20240387393
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Pin Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379638
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun Yi WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20240371647
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- YU-HSIANG HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND...
- Publication number 20240371641
- Publication date Nov 7, 2024
- Shin-Etsu Handotai Co., Ltd.
- Junya ISHIZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371743
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES
- Publication number 20240363458
- Publication date Oct 31, 2024
- Joon Bu Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363506
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Won Bae Bang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES
- Publication number 20240347339
- Publication date Oct 17, 2024
- Syrnatec, Inc.
- Yash Suresh Mirchandani
- B24 - GRINDING POLISHING
Information Patent Application
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240339421
- Publication date Oct 10, 2024
- ROHM CO., LTD.
- Masatoshi AKETA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE
- Publication number 20240313043
- Publication date Sep 19, 2024
- ROHM CO., LTD.
- Bungo TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20240297106
- Publication date Sep 5, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Michael J. Seddon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE OF OPTICAL COMMUNICATION MODULE AND PRODUCTION...
- Publication number 20240290725
- Publication date Aug 29, 2024
- Huawei Technologies Co., Ltd
- Wenqi ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240266189
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20240249990
- Publication date Jul 25, 2024
- Samsung Electronics Co., Ltd.
- Dahee Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD
- Publication number 20240234370
- Publication date Jul 11, 2024
- Wolfspeed, Inc.
- Shadi Sabri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK
- Publication number 20240222247
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Hua Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240213138
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- Tae Yeong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENGINEERED SEMICONDUCTOR SUBSTRATE
- Publication number 20240203804
- Publication date Jun 20, 2024
- Micron Technology, Inc.
- Darwin A. Clampitt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240203856
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SHUO-MAO CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSING CHIP PACKAGING STRUCTURE AND METHOD
- Publication number 20240186200
- Publication date Jun 6, 2024
- NATIONAL CENTER FOR ADVANCED PACKAGING CO., LTD.
- Peng SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNE...
- Publication number 20240178189
- Publication date May 30, 2024
- Shing-Yih SHIH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...
- Publication number 20240155759
- Publication date May 9, 2024
- International Business Machines Corporation
- Shawn Anthony Hall
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Assembly
- Publication number 20240145529
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Interposer Assembly Containing A Decoupling Capacitor
- Publication number 20240145528
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip-On-Wafer Assembly Containing A Decoupling Capacitor
- Publication number 20240145451
- Publication date May 2, 2024
- KYOCERA AVX Components Corporation
- Laurent Desclos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND SEMICONDUCTOR LAYERED STRUCTURE AND PROCESS FOR PREPARING...
- Publication number 20240128080
- Publication date Apr 18, 2024
- Umicore
- Markus LEITGEB
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF
- Publication number 20240120207
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Lung-Kai Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSERS FOR MICROELECTRONIC DEVICES
- Publication number 20240120283
- Publication date Apr 11, 2024
- Micron Technology, Inc.
- Owen Fay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POROUS POLYMER DIELECTRIC LAYER ON CORE
- Publication number 20240113009
- Publication date Apr 4, 2024
- Intel Corporation
- Whitney Bryks
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...

Semiconductor insulating substrates

Industry

Parent Industries

Current Industry

Patents Grantslast 30 patents

Split substrate interposer with integrated passive device

Semiconductor device package and manufacturing method thereof

Method for forming semiconductor package and semiconductor package

Encircling a semiconductor device with stacked frames on a substrate

Through-substrate via structure and method of manufacture

Method of manufacturing semiconductor structure

Wrap-around source/drain method of making contacts for backside metals

Wrap-around source/drain method of making contacts for backside metals

Adapting electrical, mechanical, and thermal properties of package...

Panel molded electronic assemblies with multi-surface conductive co...

High density interconnect device and method

Package core assembly and fabrication methods

Metal-free frame design for silicon bridges for semiconductor packages

Reconstituted substrate for radio frequency applications

Electronic component and semiconductor device

Nitride semiconductor device and method for manufacturing the same

Semiconductor package and manufacturing method thereof

Semiconductor package and method of manufacturing semiconductor pac...

Solder resist structure to mitigate solder bridge risk

Semiconductor device and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device structure and methods of forming the same

Semiconductor module circuit structure

Fabrication method of substrate having electrical interconnection s...

Semiconductor device

Semiconductor device

Microelectronic devices including embedded bridge interconnect stru...

Manufacturing method of package structure

Semiconductor package

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Method for Forming a Semiconductor Device Having TSV Formed Through...

INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

METHOD OF MANUFACTURING COMPOUND SEMICONDUCTOR BONDED SUBSTRATE AND...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT CHIPS INCORPORATING NEGATIVE POISSON`S RATIO STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

COMPOSITE SUBSTRATE FOR FABRICATION OF BETA GALLIUM OXIDE DEVICES

ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

INSULATION CHIP AND SIGNAL TRANSMISSION DEVICE

THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE

PACKAGING STRUCTURE OF OPTICAL COMMUNICATION MODULE AND PRODUCTION...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR DEVICE AND RELATED FABRICATION METHOD

SOLDER RESIST STRUCTURE TO MITIGATE SOLDER BRIDGE RISK

SEMICONDUCTOR PACKAGE

ENGINEERED SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SENSING CHIP PACKAGING STRUCTURE AND METHOD

APPARATUSES INCLUDING REDISTRIBUTION LAYERS AND EMBEDDED INTERCONNE...

ELECTRONIC APPARATUS MINIMIZING DIFFERENTIAL THERMAL CONTRACTION FO...

Semiconductor Package Assembly

Chip-On-Interposer Assembly Containing A Decoupling Capacitor

Chip-On-Wafer Assembly Containing A Decoupling Capacitor

COMPOUND SEMICONDUCTOR LAYERED STRUCTURE AND PROCESS FOR PREPARING...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THEREOF

INTERPOSERS FOR MICROELECTRONIC DEVICES

POROUS POLYMER DIELECTRIC LAYER ON CORE